KLMAG2GE4A-A001: Difference between revisions

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[[Category:Hardware]]
== Samsung [[KLMAG2GE4A-A001]] ==
== Samsung [[KLMAG2GE4A-A001]] ==
<div style="float:right">[[File:Samsung KLMAG2GE4A-A001.jpg|200px|thumb|left|Samsung KLMAG2GE4A-A001]]<br />[[File:Superslim missing component close to SB.jpg|200px|thumb|left|Pads when no eMMC present]]</div>
<div style="float:right">[[File:Samsung KLMAG2GE4A-A001.jpg|200px|thumb|left|Samsung KLMAG2GE4A-A001]]<br />[[File:Superslim missing component close to SB.jpg|200px|thumb|left|Pads when no eMMC present]]</div>
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* in [http://wiiubrew.org/wiki/EMMC_NAND Wii-U consoles]: Samsung KLM8G2FE3B-B001 (8GB class100 BGA153) or KLMBG4GE4A-A001 (32GB class400 BGA169)
* in [http://wiiubrew.org/wiki/EMMC_NAND Wii-U consoles]: Samsung KLM8G2FE3B-B001 (8GB class100 BGA153) or KLMBG4GE4A-A001 (32GB class400 BGA169)
* in [http://desmond.imageshack.us/Himg96/scaled.php?server=96&filename=img0889kf.jpg&res=landing Xbox 360 consoles]: Samsung KLM4G1HE3F-B001 (4GB class50 BGA153)
* in [http://desmond.imageshack.us/Himg96/scaled.php?server=96&filename=img0889kf.jpg&res=landing Xbox 360 consoles]: Samsung KLM4G1HE3F-B001 (4GB class50 BGA153)
* in PSVita: Toshiba [http://download.siliconexpert.com/pdfs/2010/12/11/22/49/47/571/tos_/manual/thgbm3g5d1fbaie32nm4gbe-mmc_e_rev0.3_100917.pdf THGBM3G5D1FBAIE]
* in [http://www.techinsights.com/teardowns/sony-playstation-vita-teardown/ PSVita PCH-1000]: Toshiba [http://download.siliconexpert.com/pdfs/2010/12/11/22/49/47/571/tos_/manual/thgbm3g5d1fbaie32nm4gbe-mmc_e_rev0.3_100917.pdf THGBM3G5D1FBAIE]
* in [http://www.4gamer.net/games/990/G999021/20131115043/ VitaTV]: Samsung KLM4G1FE3A-F001
* in [http://www.4gamer.net/games/990/G999021/20131013001/ PSVita PCH-2000]: Toshiba THGBMAG5A1JBAIR
* in other PSVita PCH-2000: Sandisk {{unk|?}}
* in [http://www.ifixit.com/Teardown/PlayStation+Vita+Teardown/7872 other PSVita] [http://yifan.lu/2013/12/18/removing-the-cpu-and-nand-from-psvita/#more-670 PCH-1000] and [http://www.4gamer.net/games/990/G999021/20131115043/ VitaTV]: Samsung KLM4G1FE3A-F001
* in [http://www.konsolen-junkies.de/images/one_nand1.jpg Xbox-one]: SK Hynix H26M42003GMR 8GB eMMC NAND Flash
* in [http://www.konsolen-junkies.de/images/one_nand1.jpg Xbox-one]: SK Hynix H26M42003GMR 8GB eMMC NAND Flash
* in [http://3dbrew.org/wiki/Hardware#NAND_pinout 3DS]: Toshiba THGBM2G3P1FBAI8 1GB eMMC NAND flash


http://www.samsung.com/global/business/semiconductor/product/flash-emmc/overview
http://www.samsung.com/global/business/semiconductor/product/flash-emmc/overview


=== Handy PDF's ===
=== Handy PDFs ===
* [http://www.jedec.org/sites/default/files/docs/JESD84-A44.pdf Embedded MMC (eMMC) Standard MMCA 4.4 (JESD84-A44)(March 2009)]<br />
* [http://www.jedec.org/sites/default/files/docs/JESD84-A44.pdf Embedded MMC (eMMC) Standard MMCA 4.4 (JESD84-A44)(March 2009)]<br />
* [http://omapworld.com/iNAND_e_MMC_4_41_IF_data_sheet_v1_0%5B1%5D.pdf iNAND_e_MMC_4_41_IF_data_sheet_v1_0.pdf]
* [http://omapworld.com/iNAND_e_MMC_4_41_IF_data_sheet_v1_0%5B1%5D.pdf iNAND_e_MMC_4_41_IF_data_sheet_v1_0.pdf]
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* [http://www.freescale.com/files/training_pdf/WBNR_FTF10_NET_F0598_PDF.pdf WBNR_FTF10_NET_F0598_PDF.pdf]
* [http://www.freescale.com/files/training_pdf/WBNR_FTF10_NET_F0598_PDF.pdf WBNR_FTF10_NET_F0598_PDF.pdf]


See also :  
See also:
* http://www.vitadevwiki.com/index.php?title=Media
* http://en.wikipedia.org/wiki/MultiMediaCard#MMCplus_and_MMCmobile
* http://en.wikipedia.org/wiki/MultiMediaCard#MMCplus_and_MMCmobile
* http://en.wikipedia.org/wiki/Secure_Digital#Transfer_modes
* http://en.wikipedia.org/wiki/Secure_Digital#Transfer_modes
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File:Fake SDcard - example 2.jpg|Fake SDcard - example 2
File:Fake SDcard - example 2.jpg|Fake SDcard - example 2
</GALLERY>
</GALLERY>
{{Console}}


[[Category:Flash]]
 
 
{{Motherboard Components}}<noinclude>[[Category:Main]]</noinclude>

Latest revision as of 23:01, 19 September 2022

Samsung KLMAG2GE4A-A001[edit | edit source]

Samsung KLMAG2GE4A-A001

Pads when no eMMC present

Used in 'Super Slim 12GB' CECH-4003A MPX-001 accompanied by Panasonic MN66840

Partnumber: KLMAG2GE4A-A00x
Density:    16GB
Controller: VHX
Package: 169-ball BGA
Package type: 2 chip (DDP)
Package size: 12mm x 16mm
MMC version: eMMC4.41
Class: Class400
Organisation: x8
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

variants:

http://www.samsung.com/global/business/semiconductor/product/flash-emmc/overview

Handy PDFs[edit | edit source]

See also:

Testpoints eMMC[edit | edit source]

eMMC-BGA169

eMMC - colormapping - front

eMMC - colormapping - back

MMC-plus 13pad layout

MMC, SD, miniSD, microSD cards pinout

eMMC in Wii-U - pinout

eMMC in Wii-U removed (as you can see, only 4-bit mode is used)
Color eMMC
Testpoint		 BGA169
Pad #		 MMC-plus
(1-,4-,8-bit)
Pad #		 MMC
(1bit)
Pad #		 SD
(1-,4-bit)
Pad #		 miniSD
(1-,4-bit)
Pad #		 microSD
(1-,4-bit)
Pad #		 Name Type Description
- - A-G 1-14 - - - - - NP or NC - not present or not connected
  B4 H3 07 07 07 07 07 DATA0 I/O Data I/O : Bidirectional channel used for data transfer
  B5 H4 08 - 08 08 08 DATA1 I/O Data I/O : Bidirectional channel used for data transfer
  B6 H5 09 - 09 09 01 DATA2 I/O Data I/O : Bidirectional channel used for data transfer
  B2 J2 01 01 (NC) 01 01 02 DATA3 I/O Data I/O : Bidirectional channel used for data transfer
  B3 J3 10 - - - - DATA4 I/O Data I/O : Bidirectional channel used for data transfer
  B1 J4 11 - - - - DATA5 I/O Data I/O : Bidirectional channel used for data transfer
  B7 J5 12 - - - - DATA6 I/O Data I/O : Bidirectional channel used for data transfer
  B8 J6 13 - - - - DATA7 I/O Data I/O : Bidirectional channel used for data transfer
  K2 04 04 04 04 04 VDDi Supply Internal power node. Connect 0.1uF capacitor from VDDi to ground.
  K4 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
  K6 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
  M6 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
  M7 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
  N5 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
  P5 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
  R10 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
  T10 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
- - U5 - - - - - RESET Input Hardware Reset (not connected on PS3 and Wii-U)
  U8 03 / 06 03 / 06 03 / 06 03 / 06 06 VSS Ground Flash I/O and memory ground connection
  U9 04 04 04 04 04 VCC Supply Flash I/O and memory power supply
  W4 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
  W5 02 02 02 02 03 CMD I/O Command: A bidirectional channel used for device initialisation and command transfers
  W6 05 05 05 05 05 CLK Input Clock: Each cycle directs a 1-bit transfer on the command and DAT lines
  Y2 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
  Y4 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
  Y5 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
  AA3 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
  AA4 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
  AA5 04 04 04 04 04 VCCQ Supply Memory controller core and MMC IF I/O power supply
  AA6 03 / 06 03 / 06 03 / 06 03 / 06 06 VSSQ Ground Memory controller core and MMC IF ground connection
- - AB-HG 1-14 - - - - - NP or NC - not present or not connected

remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ

Note: for hooking up to SD card reader the following might be needed:

  • 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also Application Notes 10911)

Connecting to reader[edit | edit source]

  • Fake SDcard - example 1

    Fake SDcard - example 1

  • Fake SDcard - example 2

    Fake SDcard - example 2


Syscon
CXR713F Series
CELL
90 nm
65 nm
45 nm
RSX
90 nm
65 nm
40 nm
28 nm
CELL RAM
(XDR)
Elpida
Qimonda
Samsung
RSX RAM
(GDDR3 or 5)
Elpida
Infineon & Qimonda
Samsung
Hynix
PS2
Compatibility
EEGS
RDRAM
Bridge
South Bridge
Starship2
Flash
NAND
Samsung
NOR
Macronix
Samsung
Spansion
eMMC
Samsung
Panasonic
BD SATA/PATA
BD Controllers
On BD board
Sony
Renesas SCEI
Integrated
Sony
Renesas SCEI
Others
IDT SCEI
Wireless
Connectors
Other
Diverse Comp.
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