RTX-00x: Difference between revisions
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Has a 40-pin connector for the laser flat flex cable, just like [[REX-001]] and [[PPX-001]]. | Has a 40-pin connector for the laser flat flex cable, just like [[REX-001]] and [[PPX-001]]. | ||
RTX-001 (as well as [[REX-001]]) require heatsinking for Cell's VRM MOSFETs. For this purpose, the metal shields are shaped differently and thermal pads are applied on both, top and bottom, of the PCB at the mosfets. This is needed because these boards use less PCB layers and thus don't have a large enough copper plane in the PCB to sink the heat into. | Unlike the previous Super Slim motherboards, RTX-001 (as well as [[REX-001]]) require heatsinking for Cell's VRM MOSFETs. For this purpose, the metal shields are shaped differently and thermal pads are applied on both, top and bottom, of the PCB at the mosfets. This is needed because these boards use less PCB layers and thus don't have a large enough copper plane in the PCB to sink the heat into. | ||
== Specifications == | == Specifications == | ||
{|class="wikitable" | {|class="wikitable" | ||
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File:RTX-001 bottom.jpg|RTX-001 NOR bottom side | File:RTX-001 bottom.jpg|RTX-001 NOR bottom side | ||
File:RTX-001 eMMC top side.jpg|RTX-001 eMMC top side | File:RTX-001 eMMC top side.jpg|RTX-001 eMMC top side | ||
</gallery> | |||
<gallery> | |||
File:R chassis thermal pads 1.jpg|Thermal contact surface on top shield required for RTX-001 and REX-001 | |||
File:R chassis thermal pads 2.jpg|Thermal contact surface on bottom shield required for RTX-001 and REX-001 (thermal pads removed for picture) | |||
</gallery> | </gallery> | ||
{{Components}}<noinclude>[[Category:Main]]</noinclude> | {{Components}}<noinclude>[[Category:Main]]</noinclude> | ||
Latest revision as of 15:51, 10 February 2023
RTX-001[edit | edit source]
Has a 40-pin connector for the laser flat flex cable, just like REX-001 and PPX-001.
Unlike the previous Super Slim motherboards, RTX-001 (as well as REX-001) require heatsinking for Cell's VRM MOSFETs. For this purpose, the metal shields are shaped differently and thermal pads are applied on both, top and bottom, of the PCB at the mosfets. This is needed because these boards use less PCB layers and thus don't have a large enough copper plane in the PCB to sink the heat into.
Specifications[edit | edit source]
| Models | CECH-43xxA / CECH-43xxB / CECH-43xxC |
|---|---|
| Part no. / revisions | 1-893-504-11 / -31 |
| Regions | |
| Backwards Compatibility | PS1 Only. No PS2 |
| Flash Storage | |
| Cell/RSX | 45nm/28nm |
| Watts/Max | 80/210 |
| Release |
Pictures[edit | edit source]
RTX-001 NOR top side
RTX-001 NOR bottom side
RTX-001 eMMC top side
Thermal contact surface on top shield required for RTX-001 and REX-001
Thermal contact surface on bottom shield required for RTX-001 and REX-001 (thermal pads removed for picture)
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