REX-00x: Difference between revisions

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(Created page with "= REX-001 = == Specifications == {|class="wikitable" |- ! Models | CECH-43xxA / CECH-43xxB |- ! Serials | |- ! Regions | |- ! Backwards Compatability | PS1 Only. No...")
 
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= REX-001 =
= REX-001 =
Has a 40-pin connector for the laser flat flex cable, just like [[RTX-001]] and [[PPX-001]].
Unlike the previous Super Slim motherboards, REX-001 (as well as [[RTX-001]]) require heatsinking for Cell's VRM MOSFETs. For this purpose, the metal shields are shaped differently and thermal pads are applied on both, top and bottom, of the PCB at the mosfets. This is needed because these boards use less PCB layers and thus don't have a large enough copper plane in the PCB to sink the heat into.
== Specifications ==
== Specifications ==
{|class="wikitable"
{|class="wikitable"
|-
|-
! Models
! Models
| [[CECH-43xx]]A / [[CECH-43xx]]B
| [[CECH-43xx]]A / [[CECH-43xx]]B / [[CECH-43xx]]C
|-
|-
! Serials
! Part no. / revisions
|  
| 1-893-507-11 / -31
|-
|-
! Regions
! Regions
|  
|  
|-
|-
! Backwards Compatability
! Backwards Compatibility
| PS1 Only. No PS2  
| PS1 Only. No PS2  
|-
|-
Line 25: Line 28:
|-
|-
! Release
! Release
|  
| 2014
|-
|-
|}
|}
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== Pictures ==
== Pictures ==
<gallery>
<gallery>
File:PQX-001 Board.jpeg|PQX-001_Board
File:REX-001-top.jpg|REX-001 eMMC top side
File:REX-001_NOR_top_side.jpg|REX-001 NOR top side
</gallery>
</gallery>


<gallery>
File:R chassis thermal pads 1.jpg|Thermal contact surface on top shield required for RTX-001 and REX-001
File:R chassis thermal pads 2.jpg|Thermal contact surface on bottom shield required for RTX-001 and REX-001 (thermal pads removed for picture)
</gallery>


{{Components}}<noinclude>[[Category:Main]]</noinclude>
{{Components}}<noinclude>
[[Category:Main]]
</noinclude>

Latest revision as of 06:03, 12 November 2024

REX-001[edit | edit source]

Has a 40-pin connector for the laser flat flex cable, just like RTX-001 and PPX-001.

Unlike the previous Super Slim motherboards, REX-001 (as well as RTX-001) require heatsinking for Cell's VRM MOSFETs. For this purpose, the metal shields are shaped differently and thermal pads are applied on both, top and bottom, of the PCB at the mosfets. This is needed because these boards use less PCB layers and thus don't have a large enough copper plane in the PCB to sink the heat into.

Specifications[edit | edit source]

Models CECH-43xxA / CECH-43xxB / CECH-43xxC
Part no. / revisions 1-893-507-11 / -31
Regions
Backwards Compatibility PS1 Only. No PS2
Flash Storage
Cell/RSX 45nm/28nm
Watts/Max 80/210
Release 2014

Pictures[edit | edit source]