Thermal: Difference between revisions

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File:FLIR top.png|FLIR top
File:FLIR top.png|FLIR top
File:FLIR bottom with motherboard overlay.jpg|FLIR bottom with motherboard overlay
File:FLIR bottom with motherboard overlay.jpg|FLIR bottom with motherboard overlay
File:CUH-1000 top surface.jpg|CUH-1000 top surface
File:CUH-1100 top surface.jpg|CUH-1100 top surface
File:CUH-1200 top surface.jpg|CUH-1200 top surface
File:CUH-1000 back.jpg|CUH-1000 back
File:CUH-1100 back.jpg|CUH-1100 back
File:CUH-1200 back.jpg|CUH-1200 back
</gallery>
</gallery>
Source:  
Source:  
* http://www.planetextech.com/profiles/blogs/playstation-4-thermal-images
* http://www.planetextech.com/profiles/blogs/playstation-4-thermal-images
* http://tweakers.net/reviews/3318/5/playstation-4-de-volgende-generatie-begint-nu-warmte-energie-en-geluid.html (Dutch)
* http://tweakers.net/reviews/3318/5/playstation-4-de-volgende-generatie-begint-nu-warmte-energie-en-geluid.html (Dutch)
* http://pocketnews.cocolog-nifty.com/pkns/2015/06/ps4-4c94.html (Japanese)


== Applicable thermal range ==
== Applicable thermal range ==

Latest revision as of 13:41, 29 June 2015

Thermal[edit | edit source]

Which MCU is responsible for thermal management is not yet documented

FLIR images[edit | edit source]

Source:

Applicable thermal range[edit | edit source]

for individual IC components (like flash, mentioned in datasheet):

  • usage: -40°C to 85°C
  • storage : -65°C to 150°C

general room temperature (mentioned in FCC documents):

  • 5-35°C