Thermal: Difference between revisions
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* Readable in software: [http://www.ps3devwiki.com/wiki/LV2_Functions_and_Syscalls#sys_sm.2Fsys_ctrl_Syscalls LV2 sc383 sys_game_get_temperature / sc384 sys_sm_get_tzpb] | * Readable in software: [http://www.ps3devwiki.com/wiki/LV2_Functions_and_Syscalls#sys_sm.2Fsys_ctrl_Syscalls LV2 sc383 sys_game_get_temperature / sc384 sys_sm_get_tzpb] | ||
** http://www.ps3devwiki.com/files/devtools/PS3_Temp/ | |||
Speculation: | Speculation: | ||
Revision as of 01:09, 1 October 2012
CELL BE internal Powermanagement
CELL BE heatdistribution (on die)
Characteristics:
- Dynamic Power Managment with 5 power managment states
- 1 linear sensor
- 10 digital thermal sensors (8xSPE, PPE and?)
- THERM signal(s) are sent to Syscon Hardware via SMbus
- Readable in software: LV2 sc383 sys_game_get_temperature / sc384 sys_sm_get_tzpb
Speculation:
- Attackvector for clock-slowdown?
AD51/067ARMZ-REEL (2 channel Thermal Monitor SMbus IC)
6-710-287-01 / IC1101
Used for monitoring the CELL BE
| Pin | Signal | Description |
|---|---|---|
| 1 | VCC | +3.3_Thermal |
| 2 | D+ | from STI_THERMAL0 via R1106 100 Ohm and C1103 0.001uF 50V |
| 3 | D- | from STI_THERMAL0 via R1107 100 Ohm and C1103 0.001uF 50V |
| 4 | /THERM | |
| 5 | GND | Ground |
| 6 | /THERM2 | to /SYS_THR_ALRT |
| 7 | SDATA | from THR_I2C_SDA |
| 8 | SCLK | from THR_I2C_SCL |
OnSemi ADT7461A0002RMZR (2 channel Thermal Monitor SMbus IC CELL BE/RSX)
6-710-286-01 / IC2101
Used for monitoring the RSX
Datasheet: ADT7461-D.PDF
| Pin | Signal | Description |
|---|---|---|
| 1 | VCC | +3.3_Thermal |
| 2 | D+ | from RSX_TDR via R2101 100 Ohm and C2103 0.001uF 50V |
| 3 | D- | from RSX_TDN via R2102 100 Ohm and C2103 0.001uF 50V |
| 4 | /THERM | to RSX_GPIO6 / RSX_THR_EVENT |
| 5 | GND | Ground |
| 6 | /THERM2 | to /THRRSX_SENS_ALRT |
| 7 | SDATA | from THR_I2C_SDA |
| 8 | SCLK | from THR_I2C_SCL |