Thermal: Difference between revisions

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* THERM signal(s) are sent to [[Syscon Hardware]] via SMbus
* THERM signal(s) are sent to [[Syscon Hardware]] via SMbus
* Readable in software: [http://www.ps3devwiki.com/wiki/LV2_Functions_and_Syscalls#sys_sm.2Fsys_ctrl_Syscalls LV2 sc383 sys_game_get_temperature]


Speculation:
Speculation:
* Readable in software?
* Attackvector for clock-slowdown?
* Attackvector for clock-slowdown?


== AD51/067ARMZ-REEL (2 channel Thermal Monitor SMbus IC) ==
== AD51/067ARMZ-REEL (2 channel Thermal Monitor SMbus IC) ==

Revision as of 05:47, 28 September 2012

CELL BE internal Powermanagement

CELL BE heatdistribution (on die)

Characteristics:

  • Dynamic Power Managment with 5 power managment states
  • 1 linear sensor
  • 10 digital thermal sensors (8xSPE, PPE and?)

Speculation:

  • Attackvector for clock-slowdown?

AD51/067ARMZ-REEL (2 channel Thermal Monitor SMbus IC)

6-710-287-01 / IC1101
Used for monitoring the CELL BE

Pin Signal Description
1 VCC +3.3_Thermal
2 D+ from STI_THERMAL0 via R1106 100 Ohm and C1103 0.001uF 50V
3 D- from STI_THERMAL0 via R1107 100 Ohm and C1103 0.001uF 50V
4 /THERM
5 GND Ground
6 /THERM2 to /SYS_THR_ALRT
7 SDATA from THR_I2C_SDA
8 SCLK from THR_I2C_SCL


OnSemi ADT7461A0002RMZR (2 channel Thermal Monitor SMbus IC CELL BE/RSX)

OnSemi ADT7461A0002RMZR
6-710-287-01
Used for monitoring the CELL BE (IC1101) & RSX (IC2101)

6-710-286-01 / IC2101
Used for monitoring the RSX
Datasheet: ADT7461-D.PDF

Pin Signal Description
1 VCC +3.3_Thermal
2 D+ from RSX_TDR via R2101 100 Ohm and C2103 0.001uF 50V
3 D- from RSX_TDN via R2102 100 Ohm and C2103 0.001uF 50V
4 /THERM to RSX_GPIO6 / RSX_THR_EVENT
5 GND Ground
6 /THERM2 to /THRRSX_SENS_ALRT
7 SDATA from THR_I2C_SDA
8 SCLK from THR_I2C_SCL


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