BGA reball: Difference between revisions
Jump to navigation
Jump to search
mNo edit summary |
m (samba reballing) |
||
| (One intermediate revision by the same user not shown) | |||
| Line 1: | Line 1: | ||
{{#ev:youtube|jh8lkoEPLrc}} | |||
=Replacing solder balls with a rework station= | |||
This process is in between a reflow and a reballing. Is a reflow because is used hot air, and is a reballing because the balls are replaced | |||
{{#ev:youtube|gVYyuLOg1q4}} | |||
{{Wikify}} | {{Wikify}} | ||
{{Hardware Modification}} | {{Hardware Modification}} | ||
<noinclude>[[Category:Main]]</noinclude> | <noinclude>[[Category:Main]]</noinclude> | ||
Latest revision as of 15:49, 16 July 2017
Replacing solder balls with a rework station[edit | edit source]
This process is in between a reflow and a reballing. Is a reflow because is used hot air, and is a reballing because the balls are replaced
| This article is marked for rewrite/restructuring in proper wiki format. You can help PS3 Developer wiki by editing it. |
| ||||||||||||||||||||||
