KLMAG2GE4A-A001

Samsung KLMAG2GE4A-A001

Samsung KLMAG2GE4A-A001

Pads when no eMMC present

Used in 'Super Slim 12GB' CECH-4003A MPX-001 accompanied by Panasonic MN66840

Partnumber: KLMAG2GE4A-A00x
Density:    16GB
Controller: VHX
Package: 169-ball BGA
Package type: 2 chip (DDP)
Package size: 12mm x 16mm
MMC version: eMMC4.41
Class: Class400
Organisation: x8
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

variants:

• in Wii-U consoles: Samsung KLM8G2FE3B-B001 (8GB class100 BGA153) or KLMBG4GE4A-A001 (32GB class400 BGA169)
• in Xbox 360 consoles: Samsung KLM4G1HE3F-B001 (4GB class50 BGA153)

http://www.samsung.com/global/business/semiconductor/product/flash-emmc/overview

Handy PDF's

• Embedded MMC (eMMC) Standard MMCA 4.4 (JESD84-A44)(March 2009)
  
• iNAND_e_MMC_4_41_IF_data_sheet_v1_0.pdf
• JESD84-A44.pdf
• Victor_Tsai.pdf
• WBNR_FTF10_NET_F0598_PDF.pdf

See also :

• http://www.vitadevwiki.com/index.php?title=Media
• http://en.wikipedia.org/wiki/MultiMediaCard#MMCplus_and_MMCmobile
• http://en.wikipedia.org/wiki/Secure_Digital#Transfer_modes

Testpoints eMMC

eMMC-BGA169

eMMC - colormapping - front

eMMC - colormapping - back

MMC-plus 13pad layout

MMC, SD, miniSD, microSD cards pinout

eMMC in Wii-U - pinout

eMMC in Wii-U removed (as you can see, only 4-bit mode is used)

Color	eMMC Testpoint	BGA169 Pad #	MMC-plus (1-,4-,8-bit) Pad #	MMC (1bit) Pad #	SD (1-,4-bit) Pad #	miniSD (1-,4-bit) Pad #	microSD (1-,4-bit) Pad #	Name	Type	Description
-	-	A-G 1-14	-	-	-	-	-	NP or NC	-	not present or not connected
	B4	H3	07	07	07	07	07	DATA0	I/O	Data I/O : Bidirectional channel used for data transfer
	B5	H4	08	-	08	08	08	DATA1	I/O	Data I/O : Bidirectional channel used for data transfer
	B6	H5	09	-	09	09	01	DATA2	I/O	Data I/O : Bidirectional channel used for data transfer
	B2	J2	01	01 (NC)	01	01	02	DATA3	I/O	Data I/O : Bidirectional channel used for data transfer
	B3	J3	10	-	-	-	-	DATA4	I/O	Data I/O : Bidirectional channel used for data transfer
	B1	J4	11	-	-	-	-	DATA5	I/O	Data I/O : Bidirectional channel used for data transfer
	B7	J5	12	-	-	-	-	DATA6	I/O	Data I/O : Bidirectional channel used for data transfer
	B8	J6	13	-	-	-	-	DATA7	I/O	Data I/O : Bidirectional channel used for data transfer
		K2	04	04	04	04	04	VDDi	Supply	Internal power node. Connect 0.1uF capacitor from VDDi to ground.
		K4	03 / 06	03 / 06	03 / 06	03 / 06	06	VSSQ	Ground	Memory controller core and MMC IF ground connection
		K6	04	04	04	04	04	VCCQ	Supply	Memory controller core and MMC IF I/O power supply
		M6	04	04	04	04	04	VCC	Supply	Flash I/O and memory power supply
		M7	03 / 06	03 / 06	03 / 06	03 / 06	06	VSS	Ground	Flash I/O and memory ground connection
		N5	04	04	04	04	04	VCC	Supply	Flash I/O and memory power supply
		P5	03 / 06	03 / 06	03 / 06	03 / 06	06	VSS	Ground	Flash I/O and memory ground connection
		R10	03 / 06	03 / 06	03 / 06	03 / 06	06	VSS	Ground	Flash I/O and memory ground connection
		T10	04	04	04	04	04	VCC	Supply	Flash I/O and memory power supply
-	-	U5	-	-	-	-	-	RESET	Input	Hardware Reset (not connected on PS3 and Wii-U)
		U8	03 / 06	03 / 06	03 / 06	03 / 06	06	VSS	Ground	Flash I/O and memory ground connection
		U9	04	04	04	04	04	VCC	Supply	Flash I/O and memory power supply
		W4	04	04	04	04	04	VCCQ	Supply	Memory controller core and MMC IF I/O power supply
		W5	02	02	02	02	03	CMD	I/O	Command: A bidirectional channel used for device initialisation and command transfers
		W6	05	05	05	05	05	CLK	Input	Clock: Each cycle directs a 1-bit transfer on the command and DAT lines
		Y2	03 / 06	03 / 06	03 / 06	03 / 06	06	VSSQ	Ground	Memory controller core and MMC IF ground connection
		Y4	04	04	04	04	04	VCCQ	Supply	Memory controller core and MMC IF I/O power supply
		Y5	03 / 06	03 / 06	03 / 06	03 / 06	06	VSSQ	Ground	Memory controller core and MMC IF ground connection
		AA3	04	04	04	04	04	VCCQ	Supply	Memory controller core and MMC IF I/O power supply
		AA4	03 / 06	03 / 06	03 / 06	03 / 06	06	VSSQ	Ground	Memory controller core and MMC IF ground connection
		AA5	04	04	04	04	04	VCCQ	Supply	Memory controller core and MMC IF I/O power supply
		AA6	03 / 06	03 / 06	03 / 06	03 / 06	06	VSSQ	Ground	Memory controller core and MMC IF ground connection
-	-	AB-HG 1-14	-	-	-	-	-	NP or NC	-	not present or not connected

remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ

Note: for hooking up to SD card reader the following might be needed:

• 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also Application Notes 10911)

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