KLMAG2GE4A-A001: Difference between revisions
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== Samsung [[KLMAG2GE4A-A001]] == | == Samsung [[KLMAG2GE4A-A001]] == | ||
<div style="float:right">[[File:Samsung KLMAG2GE4A-A001.jpg|200px|thumb|left|Samsung KLMAG2GE4A-A001]]<br />[[File:Superslim missing component close to SB.jpg|200px|thumb|left|Pads when no eMMC present]]</div> | <div style="float:right">[[File:Samsung KLMAG2GE4A-A001.jpg|200px|thumb|left|Samsung KLMAG2GE4A-A001]]<br />[[File:Superslim missing component close to SB.jpg|200px|thumb|left|Pads when no eMMC present]]</div> | ||
Used in 'Super Slim 12GB' [[CECH-40xx|CECH-4003A]] [[MPX-00x|MPX-001]] accompanied by Panasonic [[MN66840]]<br /> | Used in 'Super Slim 12GB' [[CECH-40xx|CECH-4003A]] [[MPX-00x|MPX-001]] accompanied by Panasonic [[MN66840]]<br /> | ||
Partnumber: KLMAG2GE4A-A00x | Partnumber: KLMAG2GE4A-A00x | ||
| Line 30: | Line 31: | ||
=== Testpoints eMMC === | === Testpoints eMMC === | ||
<div style="float:right">[[File:EMMC-BGA169.png|200px|thumb|left|eMMC-BGA169]]<br />[[File:EMMC - colormapping - front.jpg|200px|thumb|left|eMMC - colormapping - front]]<br />[[File:EMMC - colormapping - back.jpg|200px|thumb|left|eMMC - colormapping - back]]<br />[[File:MMC-13pads-layout.png|200px|thumb|left|MMC-plus 13pad layout]]<br />[[File:MMC-SD-miniSD-microSD-Color-Numbers-Names.jpg|200px|thumb|left|MMC, SD, miniSD, microSD cards pinout]]</div> | <div style="float:right">[[File:EMMC-BGA169.png|200px|thumb|left|eMMC-BGA169]]<br />[[File:EMMC - colormapping - front.jpg|200px|thumb|left|eMMC - colormapping - front]]<br />[[File:EMMC - colormapping - back.jpg|200px|thumb|left|eMMC - colormapping - back]]<br />[[File:MMC-13pads-layout.png|200px|thumb|left|MMC-plus 13pad layout]]<br />[[File:MMC-SD-miniSD-microSD-Color-Numbers-Names.jpg|200px|thumb|left|MMC, SD, miniSD, microSD cards pinout]]<br />[[File:EMMC Wii-U.jpg|200px|thumb|left|eMMC in Wii-U]]</div> | ||
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable sortable" style="border:1px solid #999; border-collapse: collapse;" | {| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable sortable" style="border:1px solid #999; border-collapse: collapse;" | ||
Revision as of 04:02, 17 February 2013
Samsung KLMAG2GE4A-A001
Used in 'Super Slim 12GB' CECH-4003A MPX-001 accompanied by Panasonic MN66840
Partnumber: KLMAG2GE4A-A00x Density: 16GB Controller: VHX Package: 169-ball BGA Package type: 2 chip (DDP) Package size: 12mm x 16mm MMC version: eMMC4.41 Class: Class400 Organisation: x8 Voltage : 1.7 - 1.95V / 2.7 - 3.6V
http://www.samsung.com/global/business/semiconductor/product/flash-emmc/overview
Handy PDF's
- Embedded MMC (eMMC) Standard MMCA 4.4 (JESD84-A44)(March 2009)
- iNAND_e_MMC_4_41_IF_data_sheet_v1_0.pdf
- JESD84-A44.pdf
- Victor_Tsai.pdf
- WBNR_FTF10_NET_F0598_PDF.pdf
See also :
- http://www.vitadevwiki.com/index.php?title=Media
- http://en.wikipedia.org/wiki/MultiMediaCard#MMCplus_and_MMCmobile
- http://en.wikipedia.org/wiki/Secure_Digital#Transfer_modes
Testpoints eMMC
| Color | eMMC Testpoint |
BGA169 Pad # |
MMC-plus (1-,4-,8-bit) Pad # |
MMC (1bit) Pad # |
SD (1-,4-bit) Pad # |
miniSD (1-,4-bit) Pad # |
microSD (1-,4-bit) Pad # |
Name | Type | Description |
|---|---|---|---|---|---|---|---|---|---|---|
| - | - | A-G 1-14 | - | - | - | - | - | NP or NC | - | not present or not connected |
| B4 | H3 | 07 | 07 | 07 | 07 | 07 | DATA0 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B5 | H4 | 08 | - | 08 | 08 | 08 | DATA1 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B6 | H5 | 09 | - | 09 | 09 | 01 | DATA2 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B2 | J2 | 01 | 01 (NC) | 01 | 01 | 02 | DATA3 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B3 | J3 | 10 | - | - | - | - | DATA4 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B1 | J4 | 11 | - | - | - | - | DATA5 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B7 | J5 | 12 | - | - | - | - | DATA6 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| B8 | J6 | 13 | - | - | - | - | DATA7 | I/O | Data I/O : Bidirectional channel used for data transfer | |
| K2 | 04 | 04 | 04 | 04 | 04 | VDDi | Supply | Internal power node. Connect 0.1uF capacitor from VDDi to ground. | ||
| K4 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection | ||
| K6 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply | ||
| M6 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply | ||
| M7 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection | ||
| N5 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply | ||
| P5 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection | ||
| R10 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection | ||
| T10 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply | ||
| - | - | U5 | - | - | - | - | - | RESET | Input | Hardware Reset (not connected on PS3) |
| U8 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSS | Ground | Flash I/O and memory ground connection | ||
| U9 | 04 | 04 | 04 | 04 | 04 | VCC | Supply | Flash I/O and memory power supply | ||
| W4 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply | ||
| W5 | 02 | 02 | 02 | 02 | 03 | CMD | I/O | Command: A bidirectional channel used for device initialisation and command transfers | ||
| W6 | 05 | 05 | 05 | 05 | 05 | CLK | Input | Clock: Each cycle directs a 1-bit transfer on the command and DAT lines | ||
| Y2 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection | ||
| Y4 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply | ||
| Y5 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection | ||
| AA3 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply | ||
| AA4 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection | ||
| AA5 | 04 | 04 | 04 | 04 | 04 | VCCQ | Supply | Memory controller core and MMC IF I/O power supply | ||
| AA6 | 03 / 06 | 03 / 06 | 03 / 06 | 03 / 06 | 06 | VSSQ | Ground | Memory controller core and MMC IF ground connection | ||
| - | - | AB-HG 1-14 | - | - | - | - | - | NP or NC | - | not present or not connected |
remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ
Note: for hooking up to SD card reader the following might be needed:
- 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also Application Notes 10911)