Revision as of 21:52, 7 February 2012
Flash
The PS3 uses a NOR interface from the South Bridge to address the main firmware flash. On NAND based consoles, it uses the Starship2 as an interleaving bridge chip to the two NAND flash, while on NOR based consoles the single NOR flash is connected directly to the South Bridge.
SKU Differentiation
For a difference between models, see SKU Models
Retail
| Flash |
FAT |
SLIM |
Notes
|
CECHA
CECHB |
CECHC
CECHE |
CECHE |
CECHG |
CECHH |
CECHK |
CECHL
CECHM
CECHP
CECHQ |
CECH-20.. |
CECH-21.. |
CECH-25.. |
CECH-25.. |
CECH-30..
|
COK
001 |
COK
002 |
COK
002W |
SEM
001 |
DIA
001 |
DIA
002 |
VER
001 |
DYN
001 |
SUR
001 |
JTP
001 |
JSD
001 |
KTE
001
|
| NAND |
2x Samsung K9F1G08U0A-PIB0 |
Yes |
Yes |
- |
- |
No |
No |
No |
No |
No |
No |
No |
No |
|
| 2x Samsung K9F1G08U0B-PIB0 |
- |
- |
- |
Yes |
No |
No |
No |
No |
No |
No |
No |
No |
|
| NOR |
1x Spansion S29GL128N90TFIR2 |
No |
No |
No |
No |
Yes |
Yes |
Yes |
- |
- |
- |
- |
- |
|
| 1x Samsung K8Q2815UQB-PI4B |
No |
No |
No |
No |
- |
- |
Yes |
Yes |
- |
- |
- |
- |
|
| 1x Spansion S29GL128P90TFIR2 |
No |
No |
No |
No |
- |
- |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
|
| 1x Samsung K8P2716UZC-QI4D |
No |
No |
No |
No |
- |
- |
- |
- |
- |
Yes |
Yes |
Yes |
|
| 1x Macronix MX29GL128ELT2I-90G |
No |
No |
No |
No |
- |
- |
- |
Yes |
Yes |
- |
- |
Yes |
|
Non Retail
Reference Tool DECR1000A Communication Processor board :
1x Samsung K9F2G08U0M (NAND 1x2Gbit=256MB total)
Pinout Flash chips
NAND
Samsung K9F1G08U0A-PIB0 or K9F1G08UOB-PIB0 (NAND)
48-pin TSOP1 Standard Type
12mm x 20mm
Samsung K9F1G08U0A-PIB0
One of the 2 Samsung K9F1G08U0A-PIB0 on a NAND based FAT
Datasheet
productcode meaning:
K - Memory
9 - NAND Flash
F - Small Classification : SLC Normal
1G - Density : 1Gigabit (128MB)
0 - Technology : Normal (x8)
8 - Organisation : x8
U - Vcc Supply Voltage : min 2.7V - Max 3.6V / typ. 3.3V
0 - Mode : Normal
A - Generation : 2nd
-
P - Package : 48pin TSOP1 (12mm x 20mm / 0.5mm pitch)) Lead-free
I - Temperature : Industrial
B - Customer Bad Block : Include Bad Block
0 - PreProgram Version : None
| Pin |
Usage |
Remarks
|
| 1 |
NC |
No Connection
|
| 2 |
NC |
No Connection
|
| 3 |
NC |
No Connection
|
| 4 |
NC |
No Connection
|
| 5 |
NC |
No Connection
|
| 6 |
NC |
No Connection
|
| 7 |
R/B |
Read/Busy Output
|
| 8 |
RE |
Read Enable
|
| 9 |
CE |
Chip Enable
|
| 10 |
NC |
No Connection
|
| 11 |
NC |
No Connection
|
| 12 |
Vcc |
Vcc (min 2.7V-max 3.6V / typ 3.3V)
|
| 13 |
Vss |
Ground
|
| 14 |
NC |
No Connection
|
| 15 |
NC |
No Connection
|
| 16 |
CLE |
Command Latch Enable
|
| 17 |
ALE |
Address Latch Enable
|
| 18 |
WE |
Write Enable
|
| 19 |
WP |
Write Protect
|
| 20 |
NC |
No Connection
|
| 21 |
NC |
No Connection
|
| 22 |
NC |
No Connection
|
| 23 |
NC |
No Connection
|
| 24 |
NC |
No Connection
|
| |
| Pin |
Usage |
Remarks
|
| 48 |
NC |
No Connection
|
| 47 |
NC |
No Connection
|
| 46 |
NC |
No Connection
|
| 45 |
NC |
No Connection
|
| 44 |
I/O7 |
|
| 43 |
I/O6 |
|
| 42 |
I/O5 |
|
| 41 |
I/O4 |
|
| 40 |
NC |
No Connection
|
| 39 |
NC |
No Connection
|
| 38 |
NC |
No Connection
|
| 37 |
Vcc |
Vcc (min 2.7V-max 3.6V / typ 3.3V)
|
| 36 |
Vss |
Ground
|
| 35 |
NC |
No Connection
|
| 34 |
NC |
No Connection
|
| 33 |
NC |
No Connection
|
| 32 |
I/O3 |
|
| 31 |
I/O2 |
|
| 30 |
I/O1 |
|
| 29 |
I/O0 |
|
| 28 |
NC |
No Connection
|
| 27 |
NC |
No Connection
|
| 26 |
NC |
No Connection
|
| 25 |
NC |
No Connection
|
|
Samsung K9F2G08U0M (NAND)
1x 2 Gbit NAND as used on Reference Tool DECR1000A Communication Processor board
Samsung K9F2G08U0M
48-pin TSOP1 Standard Type 12mm x 20mm
used on Reference Tool DECR1000A Communication Processor board
Datasheet
productcode meaning:
K - Memory
9 - NAND Flash
F - Small Classification : SLC Normal
2G - Density : 2Gigabit (256MB)
0 - Technology : Normal (x8)
8 - Organisation : x8
U - Vcc Supply Voltage : min 2.7V - Max 3.6V / typ. 3.3V
0 - Mode : Normal
M - Generation :
-
?P - Package : 48pin TSOP1 (12mm x 20mm / 0.5mm pitch)) Lead-free
?I - Temperature : Industrial
?B - Customer Bad Block : Include Bad Block
?0 - PreProgram Version : None
| Pin |
Usage |
Remarks
|
| 1 |
NC |
No Connection
|
| 2 |
NC |
No Connection
|
| 3 |
NC |
No Connection
|
| 4 |
NC |
No Connection
|
| 5 |
NC |
No Connection
|
| 6 |
NC |
No Connection
|
| 7 |
R/B |
Read/Busy Output
|
| 8 |
RE |
Read Enable
|
| 9 |
CE |
Chip Enable
|
| 10 |
NC |
No Connection
|
| 11 |
NC |
No Connection
|
| 12 |
Vcc |
Vcc (min 2.7V-max 3.6V / typ 3.3V)
|
| 13 |
Vss |
Ground
|
| 14 |
NC |
No Connection
|
| 15 |
NC |
No Connection
|
| 16 |
CLE |
Command Latch Enable
|
| 17 |
ALE |
Address Latch Enable
|
| 18 |
WE |
Write Enable
|
| 19 |
WP |
Write Protect
|
| 20 |
NC |
No Connection
|
| 21 |
NC |
No Connection
|
| 22 |
NC |
No Connection
|
| 23 |
NC |
No Connection
|
| 24 |
NC |
No Connection
|
| |
| Pin |
Usage |
Remarks
|
| 48 |
NC |
No Connection
|
| 47 |
NC |
No Connection
|
| 46 |
NC |
No Connection
|
| 45 |
NC |
No Connection
|
| 44 |
I/O7 |
|
| 43 |
I/O6 |
|
| 42 |
I/O5 |
|
| 41 |
I/O4 |
|
| 40 |
NC |
No Connection
|
| 39 |
NC |
No Connection
|
| 38 |
PRE |
Power-On Read Enable
PRE controls auto read operation executed during power-on.
Power-on auto-read is enabled when PRE pin is tied to VCC.
|
| 37 |
Vcc |
Vcc (min 2.7V-max 3.6V / typ 3.3V)
|
| 36 |
Vss |
Ground
|
| 35 |
NC |
No Connection
|
| 34 |
NC |
No Connection
|
| 33 |
NC |
No Connection
|
| 32 |
I/O3 |
|
| 31 |
I/O2 |
|
| 30 |
I/O1 |
|
| 29 |
I/O0 |
|
| 28 |
NC |
No Connection
|
| 27 |
NC |
No Connection
|
| 26 |
NC |
No Connection
|
| 25 |
NC |
No Connection
|
|
NOR
Spansion S29GL128N90TFIR2 (NOR)
56-pin TSOP1 Standard Type
14mm x 20mm
Spansion S29GLxxxN
Datasheet
productcode meaning:
S29GL128N - 3.0 Volt-only, 512 Megabit (32M x 16-bit/64Mx8-bit), Page-Mode, Flash Memory, 110nm
90 - Speed option : 90ns
T - Package type: TSOP
F - Package materials set : Lead-free
I - Temperature range : Industrial
R2 - ?Vio = 2.7 to 3.6V, lowest address sector protected?
| Pin |
Usage |
Remarks
|
| 1 |
A23 |
No Connection for S29GL128N
|
| 2 |
A22 |
|
| 3 |
A15 |
|
| 4 |
A14 |
|
| 5 |
A13 |
|
| 6 |
A12 |
|
| 7 |
A11 |
|
| 8 |
A10 |
|
| 9 |
A9 |
|
| 10 |
A8 |
|
| 11 |
A19 |
|
| 12 |
A20 |
|
| 13 |
WE# |
Write Enable
|
| 14 |
RESET# |
Reset
|
| 15 |
A21 |
|
| 16 |
WP#/ACC |
Write Protect / Accelerated Program Operation
|
| 17 |
RD/BY# |
Ready/Busy Output
|
| 18 |
A18 |
|
| 19 |
A17 |
|
| 20 |
A7 |
|
| 21 |
A6 |
|
| 22 |
A5 |
|
| 23 |
A4 |
|
| 24 |
A3 |
|
| 25 |
A2 |
|
| 26 |
A1 |
|
| 27 |
NC |
No Connection
|
| 28 |
NC |
No Connection
|
| Pin |
Usage |
Remarks
|
| 29 |
Vio |
Vio - Output Buffer Power
|
| 30 |
NC |
No Connection
|
| 31 |
A0 |
|
| 32 |
CE# |
Chip Enable
|
| 33 |
VSS |
Ground
|
| 34 |
OE# |
Output Enable
|
| 35 |
DQ0 |
|
| 36 |
DQ8 |
|
| 37 |
DQ1 |
|
| 38 |
DQ9 |
|
| 39 |
DQ2 |
|
| 40 |
DQ10 |
|
| 41 |
DQ3 |
|
| 42 |
DQ11 |
|
| 43 |
Vcc |
Vcc (min 2.7V-max 3.6V / typ 3.0V)
|
| 44 |
DQ4 |
|
| 45 |
DQ12 |
|
| 46 |
DQ5 |
|
| 47 |
DQ13 |
|
| 48 |
DQ6 |
*OTP?
|
| 49 |
DQ14 |
|
| 50 |
DQ7 |
*OTP?
|
| 51 |
DQ15/A-1 |
|
| 52 |
VSS |
Ground
|
| 53 |
#BYTE |
BYTE# Selects 8-bit or 16-bit mode (NC on Samsung K8Q2815UQB-PI4B NOR)
|
| 54 |
A16 |
|
| 55 |
NC |
No Connection
|
| 56 |
A24 |
No Connection for S29GL128N and S29GL256N
|
Spansion S29GL128P90TFIR2 (NOR)
56-pin TSOP1 Standard Type
14mm x 20mm
Spansion S29GLxxxP
Datasheet
productcode meaning:
S29GL128P - 3.0 Volt-only, 512 Megabit (32M x 16-bit/64Mx8-bit), Page-Mode, Flash Memory, 90nm
90 - Speed option : 90ns
T - Package type: TSOP
F - Package materials set : Lead-free
I - Temperature range : Industrial
R2 - ?Vio = 2.7 to 3.6V, lowest address sector protected?
| Pin |
Usage |
Remarks
|
| 1 |
A23 |
No Connection for S29GL128P
|
| 2 |
A22 |
|
| 3 |
A15 |
|
| 4 |
A14 |
|
| 5 |
A13 |
|
| 6 |
A12 |
|
| 7 |
A11 |
|
| 8 |
A10 |
|
| 9 |
A9 |
|
| 10 |
A8 |
|
| 11 |
A19 |
|
| 12 |
A20 |
|
| 13 |
WE# |
Write Enable
|
| 14 |
RESET# |
Reset
|
| 15 |
A21 |
|
| 16 |
WP#/ACC |
Write Protect / Accelerated Program Operation
|
| 17 |
RY/BY# |
Ready/Busy Output
|
| 18 |
A18 |
|
| 19 |
A17 |
|
| 20 |
A7 |
|
| 21 |
A6 |
|
| 22 |
A5 |
|
| 23 |
A4 |
|
| 24 |
A3 |
|
| 25 |
A2 |
|
| 26 |
A1 |
|
| 27 |
NC |
No Connection
|
| 28 |
NC |
No Connection
|
| Pin |
Usage |
Remarks
|
| 29 |
Vio |
Vio - Output Buffer Power
|
| 30 |
NC |
No Connection
|
| 31 |
A0 |
|
| 32 |
CE# |
Chip Enable
|
| 33 |
VSS |
Ground
|
| 34 |
OE# |
Output Enable
|
| 35 |
DQ0 |
|
| 36 |
DQ8 |
|
| 37 |
DQ1 |
|
| 38 |
DQ9 |
|
| 39 |
DQ2 |
|
| 40 |
DQ10 |
|
| 41 |
DQ3 |
|
| 42 |
DQ11 |
|
| 43 |
Vcc |
Vcc (min 2.7V-max 3.6V / typ 3.0V)
|
| 44 |
DQ4 |
|
| 45 |
DQ12 |
|
| 46 |
DQ5 |
|
| 47 |
DQ13 |
|
| 48 |
DQ6 |
*OTP?
|
| 49 |
DQ14 |
|
| 50 |
DQ7 |
*OTP?
|
| 51 |
DQ15/A-1 |
|
| 52 |
VSS |
Ground
|
| 53 |
#BYTE |
BYTE# Selects 8-bit or 16-bit mode (NC on Samsung K8Q2815UQB-PI4B NOR)
|
| 54 |
A16 |
|
| 55 |
A25 |
No Connection for S29GL128P, S29GL256P and S29GL512P
|
| 56 |
A24 |
No Connection for S29GL128P and S29GL256P
|
Samsung K8Q2815UQB-PI4B (NOR)
56-pin TSOP1 Standard Type
14mm x 20mm
Samsung K8Q2815UQB-PI4B (NOR) as seen on modern PS3 Slim
Datasheet
productcode meaning:
K - Memory
8 - NOR Flash
Q - Small Classification : Page Mode DDP
28 - Density : 128M, 8M / 16Bank / 8^8
15 - Dual Bank Boot Block (Bank1, Bank2) : 16M, 2M / 14M
U - Vcc : 3.0V / 3.3V (2.7V~3.6V)
Q - Device Type: Top and Bottom Boot Block
B - Generation : 3rd Generation
-
P - Package : TSOP1 (Lead Free)
I - Temp : Industrial
4B - Speed : 60ns/25ns (Page)
NOTE
Multiple Bank architectures (8 banks)
- Bank 0 : 8Mbit (4Kw x 8 and 32Kw x 15)
- Bank 1 :24Mbit (32Kw x 48)
- Bank 2 : 24Mbit (32Kw x 48)
- Bank 3 : 8Mbit (4Kw x 8 and 32Kw x 15)
- Bank 4 : 8Mbit (4Kw x 8 and 32Kw x 15)
- Bank 5 :24Mbit (32Kw x 48)
- Bank 6 : 24Mbit (32Kw x 48)
- Bank 7 : 8Mbit (4Kw x 8 and 32Kw x 15)
OTP Block : Extra 256 word
- 128word for factory and 128word for customer OTP (only on first Virtual Chip, A22=low)
| Pin |
Usage |
Remarks
|
| 1 |
NC |
No Connection
|
| 2 |
A22 |
Virtual Chip Enable of 2nd Chip
|
| 3 |
A15 |
|
| 4 |
A14 |
|
| 5 |
A13 |
|
| 6 |
A12 |
|
| 7 |
A11 |
|
| 8 |
A10 |
|
| 9 |
A9 |
|
| 10 |
A8 |
|
| 11 |
A19 |
|
| 12 |
A20 |
|
| 13 |
WE |
Write Enable
|
| 14 |
RESET |
Reset
|
| 15 |
A21 |
|
| 16 |
WP/ACC |
Write Protect / Accelerated Program Operation
|
| 17 |
RD/BY |
Ready/Busy Output
|
| 18 |
A18 |
|
| 19 |
A17 |
|
| 20 |
A7 |
|
| 21 |
A6 |
|
| 22 |
A5 |
|
| 23 |
A4 |
|
| 24 |
A3 |
|
| 25 |
A2 |
|
| 26 |
A1 |
|
| 27 |
NC |
No Connection
|
| 28 |
NC |
No Connection
|
| Pin |
Usage |
Remarks
|
| 29 |
VCCQ |
VccQ
|
| 30 |
NC |
No Connection
|
| 31 |
A0 |
|
| 32 |
CE |
Chip Enable
|
| 33 |
VSS |
Ground
|
| 34 |
OE |
Output Enable
|
| 35 |
DQ0 |
|
| 36 |
DQ8 |
|
| 37 |
DQ1 |
|
| 38 |
DQ9 |
|
| 39 |
DQ2 |
|
| 40 |
DQ10 |
|
| 41 |
DQ3 |
|
| 42 |
DQ11 |
|
| 43 |
Vcc |
Vcc (min 2.7V-max 3.6V / typ 3.0V)
|
| 44 |
DQ4 |
|
| 45 |
DQ12 |
|
| 46 |
DQ5 |
|
| 47 |
DQ13 |
|
| 48 |
DQ6 |
*OTP?
|
| 49 |
DQ14 |
|
| 50 |
DQ7 |
*OTP?
|
| 51 |
DQ15 |
|
| 52 |
VSS |
Ground
|
| 53 |
NC |
No Connection
|
| 54 |
A16 |
|
| 55 |
NC |
No Connection
|
| 56 |
NC |
No Connection
|
- OTP Block Region : 256-word Flash memory region. The data DQ6=1 for customer locked and DQ7=1 for factory locked
Samsung K8P2716UZC-QI4D (NOR)
56-pin TSOP1 Standard Type
14mm x 20mm
as used for Samsung K8P2716UZC-QI4D
Samsung K8P2716UZC-QI4D as seen on some JSD-001 boards
Datasheet
productcode meaning:
K - Memory
8 - NOR Flash
P
27 - Density : 128M x8/x16
18 - Dual Bank Boot Block :
U - Vcc : 3.0V / 3.3V (2.7V~3.6V)
Z - Device Type:
C - Generation : 4rd Generation
-
Q - Package : 56TSOP1
I - Temp : Industrial
4D - Speed : 70ns/30ns(Page)
| Pin |
Usage |
Remarks
|
| 1 |
NC |
No Connection
|
| 2 |
A22 |
|
| 3 |
A15 |
|
| 4 |
A14 |
|
| 5 |
A13 |
|
| 6 |
A12 |
|
| 7 |
A11 |
|
| 8 |
A10 |
|
| 9 |
A9 |
|
| 10 |
A8 |
|
| 11 |
A19 |
|
| 12 |
A20 |
|
| 13 |
WE# |
Write Enable
|
| 14 |
RESET# |
Reset
|
| 15 |
A21 |
|
| 16 |
WP#/ACC |
Write Protect / Accelerated Program Operation
|
| 17 |
RD/BY# |
Ready/Busy Output
|
| 18 |
A18 |
|
| 19 |
A17 |
|
| 20 |
A7 |
|
| 21 |
A6 |
|
| 22 |
A5 |
|
| 23 |
A4 |
|
| 24 |
A3 |
|
| 25 |
A2 |
|
| 26 |
A1 |
|
| 27 |
NC |
No Connection
|
| 28 |
NC |
No Connection
|
| Pin |
Usage |
Remarks
|
| 29 |
Vio |
Vio - Output Buffer Power
|
| 30 |
NC |
No Connection
|
| 31 |
A0 |
|
| 32 |
CE# |
Chip Enable
|
| 33 |
VSS |
Ground
|
| 34 |
OE# |
Output Enable
|
| 35 |
DQ0 |
|
| 36 |
DQ8 |
|
| 37 |
DQ1 |
|
| 38 |
DQ9 |
|
| 39 |
DQ2 |
|
| 40 |
DQ10 |
|
| 41 |
DQ3 |
|
| 42 |
DQ11 |
|
| 43 |
Vcc |
Vcc (min 2.7V-max 3.6V / typ 3.0V)
|
| 44 |
DQ4 |
|
| 45 |
DQ12 |
|
| 46 |
DQ5 |
|
| 47 |
DQ13 |
|
| 48 |
DQ6 |
|
| 49 |
DQ14 |
|
| 50 |
DQ7 |
|
| 51 |
DQ15/A-1 |
|
| 52 |
VSS |
Ground
|
| 53 |
#BYTE |
BYTE# Selects 8-bit or 16-bit mode
|
| 54 |
A16 |
|
| 55 |
NC |
No Connection
|
| 56 |
NC |
No Connection
|
Macronix MX29GL128ELT2I-90G (NOR)
56-pin TSOP1 Standard Type
14mm x 20mm
Macronix MX29GL128ELT2I-90G (NOR) as seen on CECH-30.. according to some sources
Datasheet
productcode meaning:
MX29GL Series
3V
128 Mb
16M x 8/8M x 16
90ns
Parallel Flash
TSOP-56
| Pin |
Usage |
Remarks
|
| 1 |
NC |
No Connection
|
| 2 |
A22 |
|
| 3 |
A15 |
|
| 4 |
A14 |
|
| 5 |
A13 |
|
| 6 |
A12 |
|
| 7 |
A11 |
|
| 8 |
A10 |
|
| 9 |
A9 |
|
| 10 |
A8 |
|
| 11 |
A19 |
|
| 12 |
A20 |
|
| 13 |
WE# |
Write Enable
|
| 14 |
RESET# |
Reset
|
| 15 |
A21 |
|
| 16 |
WP#/ACC |
Write Protect / Accelerated Program Operation
|
| 17 |
RD/BY# |
Ready/Busy Output
|
| 18 |
A18 |
|
| 19 |
A17 |
|
| 20 |
A7 |
|
| 21 |
A6 |
|
| 22 |
A5 |
|
| 23 |
A4 |
|
| 24 |
A3 |
|
| 25 |
A2 |
|
| 26 |
A1 |
|
| 27 |
NC |
No Connection
|
| 28 |
NC |
No Connection
|
| Pin |
Usage |
Remarks
|
| 29 |
VI/O |
Vcc I/O (min 2.7V-max 3.6V / typ 3.0V)
|
| 30 |
NC |
No Connection
|
| 31 |
A0 |
|
| 32 |
CE# |
Chip Enable
|
| 33 |
GND |
Ground
|
| 34 |
OE# |
Output Enable
|
| 35 |
Q0 |
|
| 36 |
Q8 |
|
| 37 |
Q1 |
|
| 38 |
Q9 |
|
| 39 |
Q2 |
|
| 40 |
Q10 |
|
| 41 |
Q3 |
|
| 42 |
Q11 |
|
| 43 |
Vcc |
Vcc (min 2.7V-max 3.6V / typ 3.0V)
|
| 44 |
Q4 |
|
| 45 |
Q12 |
|
| 46 |
Q5 |
|
| 47 |
Q13 |
|
| 48 |
Q6 |
|
| 49 |
Q14 |
|
| 50 |
Q7 |
|
| 51 |
Q15/A-1 |
Q15 (Word Mode) / LSB addr (Byte Mode)
|
| 52 |
GND |
Ground
|
| 53 |
BYTE# |
Selects 8bits or 16bits mode
|
| 54 |
A16 |
|
| 55 |
NC |
No Connection
|
| 56 |
NC |
No Connection
|
Pinout Other
Renesas HN58X2504TIE (EEPROM)
8-pin TSSOP
Renesas HN58X2504TIE
Note: although edepot&others lists it on the board, I can only find this IC in the sixaxis.
Datasheet
productcode meaning:
H -
N -
5 -
8 - Organisation : x8bit
X -
2 -
5 -
0 -
4 - Density : 4-kbit (512x8bit)
T - Package : 8pin plastic TSSOP (TTP-8DAV)
I - Temp : Industrial (-40 to +85 °C
E - Environment : Lead Free
Each PS3 has a special EEPROM chip on the motherboard using a SPI Serial Interface Renasas chip.
| Type |
Size |
Speed |
Voltage |
Packaging |
Manufacturer |
Serial Number |
Description
|
| EEPROM |
4-kbit (512x8bit) |
3MHz |
1.8V to 5.5V |
8-pin TSSOP |
Renesas |
HN58X2504TIE |
PS3 EEPROM chip
|
| Pin |
Usage |
Remarks
|
| 1 |
S |
Chip Select
|
| 2 |
Q |
Serial data output
|
| 3 |
W |
Write Protect
|
| 4 |
VSS |
Ground
|
| 5 |
D |
Serial data input
|
| 6 |
C |
Serial Clock
|
| 7 |
HOLD |
Hold
|
| 8 |
VCC |
Vcc (min 1.8V-max 5.5V)
|
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