Talk:Flash (Hardware)

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flash specifications[edit source]

NOR[edit source]

Flash write
buffer
access
time
page
read
read
bus
cycles
write
bus
cycles
erase
bus
cycles
typ.
erase
time
typ.
program
time
S29GL128N 16 words/
32 bytes
90ns 25ns 1 6 6 64s
(0.5s/sector)
123s
S29GL128P 32 words/
64 bytes
90ns 25ns 1 6 6 64s
(0.5s/sector)
123s
K8Q2815UQB ... 60ns 20ns 1 4 6 71s/chip
(0.7s/sector)
25.2s/chip
K8P2716UZC 32 words/
64 bytes
65ns 25ns 1 6 6 89.6s
(0.7s/sector)
26s
MX29GL128E 32 words/
64 bytes
90ns 25ns 1 6 6 64s
(0.6s/sector)
50s

shops[edit source]

Buying spare NAND/NOR parts:

NOR replacements[edit source]

http://search.digikey.com/scripts/dksearch/dksus.dll > NOR flash > 128M > 65/70/75/85/90 > 2.3-3.6/2.7-3.6 > 56-TSOP (14x20)

non PS3 related[edit source]

http://www.free60.org/NAND:Bad_Blocks

PSP flash[edit source]

ref. : http://hitmen.c02.at/files/yapspd/psp_doc/chap3.html

FAT[edit source]

 TA-079 - Samsung K5E5658HCM-D060 (3.0V/2.5V)
 TA-080 -
 TA-081 - 
 TA-082 - Samsung K5E5658ACM-D060 (1.8V/1.8V)
 TA-086 - 

Slim[edit source]

 TA-085 - Sharp LR388A1
 TA-088 - Sharp LR388A0 - PSP-2000

Brite[edit source]

 TA-090 - 

Go[edit source]

 TA-091 - 
 TA-094 -


X360[edit source]

H - Hynix
2 - Flash
7 - NAND 
u - 2.7V~3.6V VCC
bg - 32Gb
8 - x8 organisation
t - MLC + single die + large block
2 - 1nCE & 1 R/nB; Sequential Row Read Disable
a - 2nd generation
t - TSOP1
r - Lead & Halogen free

Datasheet: AAFDEd01.pdf (1.58 MB)

  • Hynix hy27uf084g2b (on Jasper, 512mb BB)

Datasheet: http://catalog.gaw.ru/project/download.php?id=11313

product serial breakdown[edit source]

Macronix[edit source]

Serial Flash[edit source]

Device[edit source]

25L: 3V, Serial Flash
25U: 1.8V, Serial Flash
25V: 2.5V, Serial Flash

Density[edit source]

10: 1Mb
20: 2Mb
40: 4Mb
80: 8Mb
16: 16Mb
32: 32Mb
64: 64 Mb
128: 128Mb
256/257: 256Mb

Mode[edit source]

05: Standard single I/O
06: Single in, Dual out
08: Unique ID
25/26: Default lock protection
33/35: MXSMIO - Multi in, Multi out
36: MXSMIO - Single in, Multi out
45: MXSMIO Duplex - Multi I/O with DTR
55: MXSMIO - Security type

Generation[edit source]

Package Type[edit source]

P: 300mil 8-PDIP
ZN: 8-WSON (6x5mm)
Z2: 8-WSON (8x6mm)
ZU: 8-USON
M: SOP
O: 173mil 8-TSSOP
XC: 24-ball TFBGA

Temperature Range[edit source]

I: Industrial (-40'C to 85'C)
S: Automotive Grade 3 (-40'C to 85'C)
R: Automotive Grade 2 (-40'C to 105'C)
Q: Automotive Grade 1 (-40'C to 125'C)

Speed[edit source]

10: 104MHz
12: 85MHz/86MHz
13: 75MHz
15: 66MHz
20: 50MHz
25: 40MHz

Option[edit source]

G: RoHS Compliant

Parallel Flash[edit source]

Device[edit source]

29F: 5V, Parallel Flash
29LV / 29GL / 68GL: 3V, Parallel Flash
29LA / 29GA: Security Type, Parallel Flash

Density[edit source]

20x: 2Mb
40x: 4Mb
80x: 8Mb
16x: 16Mb
32x: 32Mb
64x: 64 Mb
12x: 128Mb
25x: 256Mb
51x: 512Mb

Generation[edit source]

Block Type[edit source]

T: Top Boot
B: Bottom Boot
H: Uniform Sector, Highest Address Sector Protected
L: Uniform Sector, Lowest Address Sector Protected
U: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Highest Address Sector Protected
D: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Lowest Address Sector Protected

Package Type[edit source]

P: 8-PDIP
M: SOP
Q: PLCC
T/T2: TSOP
XB: 0.8mm Ball Pitch / 0.3mm Ball Size
XC: 1.0mm Ball Pitch / 0.4mm Ball Size
XE: 0.8mm Ball Pitch / 0.4mm Ball Size
XF: 1.0mm Ball Pitch / 0.6mm Ball Size
XH: 0.5mm Ball Pitch / 0.3mm Ball Size
GB: 0.5mm Ball Pitch / 0.25mm Ball Size
XG: 0.8mm Ball Pitch / 0.4mm Ball Size

Temperature Range[edit source]

C: Commercial (-0'C to 70'C)
I: Industrial (-40'C to 85'C)
S: Automotive Grade 3 (-40'C to 85'C)
R: Automotive Grade 2 (-40'C to 105'C)
Q: Automotive Grade 1 (-40'C to 125'C)

Speed[edit source]

55: 55ns
70: 70ns
90: 90ns
10: 100ns
11: 110ns

Option[edit source]

G: RoHS Compliant
Q: Restricted   VCC: (3.0V-3.6V) RoHS Compliant


NAND Flash[edit source]

Device[edit source]

30: NAND Flash

Voltage[edit source]

L: 2.7V to 3.6V

Classification[edit source]

F: SLC+Large Block

Density[edit source]

12: 512Mb
1G: 1Gb

Option Code[edit source]

08=x8

Mode[edit source]

A-Die#:1, CE#:1, R/B#:1, Reserve:0

Generation[edit source]

Package Type[edit source]

T: 48TSOP
XK: 0.8mm Ball Pitch / 0.45mm Ball Size of VFBGA
RoHS Compliant

Temperature Range[edit source]

I: Industrial (-40'C to 85'C)

Reserved[edit source]