Latest revision as of 18:14, 14 February 2013

flash specifications[edit source]

NOR[edit source]

Flash	write buffer	access time	page read	read bus cycles	write bus cycles	erase bus cycles	typ. erase time	typ. program time
S29GL128N	16 words/ 32 bytes	90ns	25ns	1	6	6	64s (0.5s/sector)	123s
S29GL128P	32 words/ 64 bytes	90ns	25ns	1	6	6	64s (0.5s/sector)	123s
K8Q2815UQB	...	60ns	20ns	1	4	6	71s/chip (0.7s/sector)	25.2s/chip
K8P2716UZC	32 words/ 64 bytes	65ns	25ns	1	6	6	89.6s (0.7s/sector)	26s
MX29GL128E	32 words/ 64 bytes	90ns	25ns	1	6	6	64s (0.6s/sector)	50s

shops[edit source]

Buying spare NAND/NOR parts:

NOR replacements[edit source]

http://search.digikey.com/scripts/dksearch/dksus.dll > NOR flash > 128M > 65/70/75/85/90 > 2.3-3.6/2.7-3.6 > 56-TSOP (14x20)

http://search.digikey.com/us/en/products/TE28F128P33T85A/TE28F128P33T85A-ND/1869959

non PS3 related[edit source]

http://www.free60.org/NAND:Bad_Blocks

PSP flash[edit source]

ref. : http://hitmen.c02.at/files/yapspd/psp_doc/chap3.html

FAT[edit source]

 TA-079 - Samsung K5E5658HCM-D060 (3.0V/2.5V)
 TA-080 -
 TA-081 - 
 TA-082 - Samsung K5E5658ACM-D060 (1.8V/1.8V)
 TA-086 -

Slim[edit source]

 TA-085 - Sharp LR388A1
 TA-088 - Sharp LR388A0 - PSP-2000

Brite[edit source]

 TA-090 -

Go[edit source]

 TA-091 - 
 TA-094 -

X360[edit source]

Samsung K9F4G08U0M-K9F4G08U0A-K9F4G08U0B-K9F4G08U0C-K9F4G08U0D-K9F4G08U0E-K9F4G08U0Y-K9F4G08U0Z.pdf (1.05 MB) (not used in PS3, was asked in EF.net #progskeet-support (Xbox360 Jasper)
Hynix h27ubg8t2atr (used in new glitchproof xbox 360 mobo)

H - Hynix
2 - Flash
7 - NAND 
u - 2.7V~3.6V VCC
bg - 32Gb
8 - x8 organisation
t - MLC + single die + large block
2 - 1nCE & 1 R/nB; Sequential Row Read Disable
a - 2nd generation
t - TSOP1
r - Lead & Halogen free

Datasheet: AAFDEd01.pdf (1.58 MB)

Hynix hy27uf084g2b (on Jasper, 512mb BB)

Datasheet: http://catalog.gaw.ru/project/download.php?id=11313

product serial breakdown[edit source]

Macronix[edit source]

Serial Flash[edit source]

Device[edit source]

25L: 3V, Serial Flash
25U: 1.8V, Serial Flash
25V: 2.5V, Serial Flash

Density[edit source]

10: 1Mb
20: 2Mb
40: 4Mb
80: 8Mb
16: 16Mb
32: 32Mb
64: 64 Mb
128: 128Mb
256/257: 256Mb

Mode[edit source]

05: Standard single I/O
06: Single in, Dual out
08: Unique ID
25/26: Default lock protection
33/35: MXSMIO - Multi in, Multi out
36: MXSMIO - Single in, Multi out
45: MXSMIO Duplex - Multi I/O with DTR
55: MXSMIO - Security type

Generation[edit source]

Package Type[edit source]

P: 300mil 8-PDIP
ZN: 8-WSON (6x5mm)
Z2: 8-WSON (8x6mm)
ZU: 8-USON
M: SOP
O: 173mil 8-TSSOP
XC: 24-ball TFBGA

Temperature Range[edit source]

I: Industrial (-40'C to 85'C)
S: Automotive Grade 3 (-40'C to 85'C)
R: Automotive Grade 2 (-40'C to 105'C)
Q: Automotive Grade 1 (-40'C to 125'C)

Speed[edit source]

10: 104MHz
12: 85MHz/86MHz
13: 75MHz
15: 66MHz
20: 50MHz
25: 40MHz

Option[edit source]

G: RoHS Compliant

Parallel Flash[edit source]

Device[edit source]

29F: 5V, Parallel Flash
29LV / 29GL / 68GL: 3V, Parallel Flash
29LA / 29GA: Security Type, Parallel Flash

Density[edit source]

20x: 2Mb
40x: 4Mb
80x: 8Mb
16x: 16Mb
32x: 32Mb
64x: 64 Mb
12x: 128Mb
25x: 256Mb
51x: 512Mb

Generation[edit source]

Block Type[edit source]

T: Top Boot
B: Bottom Boot
H: Uniform Sector, Highest Address Sector Protected
L: Uniform Sector, Lowest Address Sector Protected
U: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Highest Address Sector Protected
D: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Lowest Address Sector Protected

Package Type[edit source]

P: 8-PDIP
M: SOP
Q: PLCC
T/T2: TSOP
XB: 0.8mm Ball Pitch / 0.3mm Ball Size
XC: 1.0mm Ball Pitch / 0.4mm Ball Size
XE: 0.8mm Ball Pitch / 0.4mm Ball Size
XF: 1.0mm Ball Pitch / 0.6mm Ball Size
XH: 0.5mm Ball Pitch / 0.3mm Ball Size
GB: 0.5mm Ball Pitch / 0.25mm Ball Size
XG: 0.8mm Ball Pitch / 0.4mm Ball Size

Temperature Range[edit source]

C: Commercial (-0'C to 70'C)
I: Industrial (-40'C to 85'C)
S: Automotive Grade 3 (-40'C to 85'C)
R: Automotive Grade 2 (-40'C to 105'C)
Q: Automotive Grade 1 (-40'C to 125'C)

Speed[edit source]

55: 55ns
70: 70ns
90: 90ns
10: 100ns
11: 110ns

Option[edit source]

G: RoHS Compliant
Q: Restricted   VCC: (3.0V-3.6V) RoHS Compliant

NAND Flash[edit source]

Device[edit source]

30: NAND Flash

Voltage[edit source]

L: 2.7V to 3.6V

Classification[edit source]

F: SLC+Large Block

Density[edit source]

12: 512Mb
1G: 1Gb

Option Code[edit source]

08=x8

Mode[edit source]

A-Die#:1, CE#:1, R/B#:1, Reserve:0

Generation[edit source]

Package Type[edit source]

T: 48TSOP
XK: 0.8mm Ball Pitch / 0.45mm Ball Size of VFBGA
RoHS Compliant

Temperature Range[edit source]

I: Industrial (-40'C to 85'C)

@@ Line 1: / Line 1: @@
+= flash specifications =
+== NOR ==
+{| class="wikitable sortable"
+|-
+! Flash !! write<br />buffer !! access<br />time !! page<br />read !! read<br />bus<br />cycles !! write<br />bus<br />cycles !! erase<br />bus<br />cycles !! typ.<br />erase<br />time !! typ.<br />program<br />time
+|-
+| [http://www.sltdigital.com/product/product_pdf/sencond_hdx_ic/memory/S29GL256.pdf S29GL128N] || 16 words/<br />32 bytes || 90ns || 25ns || 1 || 6 || 6 || 64s<br />(0.5s/sector) || 123s
+|-
+| [http://www.spansion.com/Support/Datasheets/S29GL-P_00.pdf S29GL128P] || 32 words/<br />64 bytes || 90ns || 25ns || 1 || 6 || 6 || 64s<br />(0.5s/sector) || 123s
+|-
+| [http://www.samsung.com/global/system/business/semiconductor/product/2007/8/7/144546ds_k8q2815uqb_rev11.pdf K8Q2815UQB] || ... || 60ns || 20ns || 1 || 4 || 6 || 71s/chip<br />(0.7s/sector) || 25.2s/chip
+|-
+| [http://www.samsung.com/global/system/business/semiconductor/product/2010/11/26/478704ds_k8p2716uzc_rev10.pdf K8P2716UZC] || 32 words/<br />64 bytes || 65ns || 25ns || 1 || 6 || 6 || 89.6s<br />(0.7s/sector) || 26s
+|-
+| [http://www.mxic.com.tw/QuickPlace/hq/PageLibrary4825740B00298A3B.nsf/h_Index/DBACA1C90564EBB248257639003A563A/$File/MX29GL128E,%203V,%20128Mb,%20v1.1.pdf MX29GL128E] || 32 words/<br />64 bytes || 90ns || 25ns || 1 || 6 || 6 || 64s<br />(0.6s/sector) || 50s
+|-
+|}
 = shops =
-Buying spare NAN/NOR parts:
+Buying spare NAND/NOR parts:
 * http://www.farnell.com/
 * http://www.futureelectronics.com/
+* http://de.mouser.com/localsites/
+* http://www.digikey.com/us/en/International/global.html
+== NOR replacements ==
+http://search.digikey.com/scripts/dksearch/dksus.dll > NOR flash > 128M > 65/70/75/85/90 > 2.3-3.6/2.7-3.6 > 56-TSOP (14x20)
+* http://search.digikey.com/us/en/products/TE28F128P33T85A/TE28F128P33T85A-ND/1869959
 = non PS3 related =
+http://www.free60.org/NAND:Bad_Blocks
 == PSP flash ==
+ref. : http://hitmen.c02.at/files/yapspd/psp_doc/chap3.html
 === FAT ===
    TA-079 - Samsung K5E5658HCM-D060 (3.0V/2.5V)
@@ Line 23: / Line 51: @@
 == X360 ==
-Samsung [http://www.multiupload.com/6U774SRLEJ K9F4G08U0M-K9F4G08U0A-K9F4G08U0B-K9F4G08U0C-K9F4G08U0D-K9F4G08U0E-K9F4G08U0Y-K9F4G08U0Z.pdf (1.05 MB)] (not used in PS3, was asked in EF.net #progskeet-support (Xbox360 Jasper)
+* Samsung [http://www.multiupload.com/6U774SRLEJ K9F4G08U0M-K9F4G08U0A-K9F4G08U0B-K9F4G08U0C-K9F4G08U0D-K9F4G08U0E-K9F4G08U0Y-K9F4G08U0Z.pdf (1.05 MB)] (not used in PS3, was asked in EF.net #progskeet-support (Xbox360 Jasper)
+* Hynix h27ubg8t2atr (used in new glitchproof xbox 360 mobo)
+<pre>H - Hynix
+- Flash
+- NAND
+u - 2.7V~3.6V VCC
+bg - 32Gb
+- x8 organisation
+t - MLC + single die + large block
+- 1nCE & 1 R/nB; Sequential Row Read Disable
+a - 2nd generation
+t - TSOP1
+r - Lead & Halogen free</pre>
+Datasheet: [http://www.multiupload.com/T1TWVRYV8S AAFDEd01.pdf (1.58 MB)]
+* Hynix hy27uf084g2b (on Jasper, 512mb BB)
+Datasheet: http://catalog.gaw.ru/project/download.php?id=11313
+= product serial breakdown =
+== Macronix ==
+=== Serial Flash ===
+==== Device ====
+<pre>25L: 3V, Serial Flash
+U: 1.8V, Serial Flash
+V: 2.5V, Serial Flash</pre>
+==== Density ====
+<pre>10: 1Mb
+: 2Mb
+: 4Mb
+: 8Mb
+: 16Mb
+: 32Mb
+: 64 Mb
+: 128Mb
+/257: 256Mb</pre>
+==== Mode ====
+<pre>05: Standard single I/O
+: Single in, Dual out
+: Unique ID
+/26: Default lock protection
+/35: MXSMIO - Multi in, Multi out
+: MXSMIO - Single in, Multi out
+: MXSMIO Duplex - Multi I/O with DTR
+: MXSMIO - Security type</pre>
+==== Generation ====
+==== Package Type ====
+<pre>P: 300mil 8-PDIP
+ZN: 8-WSON (6x5mm)
+Z2: 8-WSON (8x6mm)
+ZU: 8-USON
+M: SOP
+O: 173mil 8-TSSOP
+XC: 24-ball TFBGA</pre>
+==== Temperature Range ====
+<pre>I: Industrial (-40'C to 85'C)
+S: Automotive Grade 3 (-40'C to 85'C)
+R: Automotive Grade 2 (-40'C to 105'C)
+Q: Automotive Grade 1 (-40'C to 125'C)</pre>
+==== Speed ====
+<pre>10: 104MHz
+: 85MHz/86MHz
+: 75MHz
+: 66MHz
+: 50MHz
+: 40MHz</pre>
+==== Option ====
+<pre>G: RoHS Compliant</pre>
+=== Parallel Flash ===
+==== Device ====
+<pre>29F: 5V, Parallel Flash
+LV / 29GL / 68GL: 3V, Parallel Flash
+LA / 29GA: Security Type, Parallel Flash</pre>
+==== Density ====
+<pre>20x: 2Mb
+x: 4Mb
+x: 8Mb
+x: 16Mb
+x: 32Mb
+x: 64 Mb
+x: 128Mb
+x: 256Mb
+x: 512Mb</pre>
+==== Generation ====
+==== Block Type ====
+<pre>T: Top Boot
+B: Bottom Boot
+H: Uniform Sector, Highest Address Sector Protected
+L: Uniform Sector, Lowest Address Sector Protected
+U: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Highest Address Sector Protected
+D: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Lowest Address Sector Protected</pre>
+==== Package Type ====
+<pre>P: 8-PDIP
+M: SOP
+Q: PLCC
+T/T2: TSOP
+XB: 0.8mm Ball Pitch / 0.3mm Ball Size
+XC: 1.0mm Ball Pitch / 0.4mm Ball Size
+XE: 0.8mm Ball Pitch / 0.4mm Ball Size
+XF: 1.0mm Ball Pitch / 0.6mm Ball Size
+XH: 0.5mm Ball Pitch / 0.3mm Ball Size
+GB: 0.5mm Ball Pitch / 0.25mm Ball Size
+XG: 0.8mm Ball Pitch / 0.4mm Ball Size</pre>
+==== Temperature Range ====
+<pre>C: Commercial (-0'C to 70'C)
+I: Industrial (-40'C to 85'C)
+S: Automotive Grade 3 (-40'C to 85'C)
+R: Automotive Grade 2 (-40'C to 105'C)
+Q: Automotive Grade 1 (-40'C to 125'C)</pre>
+==== Speed ====
+<pre>55: 55ns
+: 70ns
+: 90ns
+: 100ns
+: 110ns</pre>
+==== Option ====
+<pre>G: RoHS Compliant
+Q: Restricted   VCC: (3.0V-3.6V) RoHS Compliant</pre>
+=== NAND Flash ===
+==== Device ====
+<pre>30: NAND Flash</pre>
+==== Voltage ====
+<pre>L: 2.7V to 3.6V</pre>
+==== Classification ====
+<pre>F: SLC+Large Block</pre>
+==== Density ====
+<pre>12: 512Mb
+G: 1Gb</pre>
+==== Option Code ====
+<pre>08=x8</pre>
+==== Mode ====
+<pre>A-Die#:1, CE#:1, R/B#:1, Reserve:0</pre>
+==== Generation ====
+==== Package Type ====
+<pre>T: 48TSOP
+XK: 0.8mm Ball Pitch / 0.45mm Ball Size of VFBGA
+RoHS Compliant</pre>
+==== Temperature Range ====
+<pre>I: Industrial (-40'C to 85'C)</pre>
+==== Reserved ====

Talk:Flash (Hardware): Difference between revisions

Latest revision as of 18:14, 14 February 2013

flash specifications[edit source]

NOR[edit source]

shops[edit source]

NOR replacements[edit source]

non PS3 related[edit source]

PSP flash[edit source]

FAT[edit source]

Slim[edit source]

Brite[edit source]

Go[edit source]

X360[edit source]

product serial breakdown[edit source]

Macronix[edit source]

Serial Flash[edit source]

Device[edit source]

Density[edit source]

Mode[edit source]

Generation[edit source]

Package Type[edit source]

Temperature Range[edit source]

Speed[edit source]

Option[edit source]

Parallel Flash[edit source]

Device[edit source]

Density[edit source]

Generation[edit source]

Block Type[edit source]

Package Type[edit source]

Temperature Range[edit source]

Speed[edit source]

Option[edit source]

NAND Flash[edit source]

Device[edit source]

Voltage[edit source]

Classification[edit source]

Density[edit source]

Option Code[edit source]

Mode[edit source]

Generation[edit source]

Package Type[edit source]

Temperature Range[edit source]

Reserved[edit source]

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