Editing Flash (Hardware)

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= Flash =
= Differentiation =
The PS3 uses a NOR interface from the [[South Bridge]] to address the main firmware flash. On NAND based consoles, it uses the [[Starship2]] as an interleaving bridge chip to the two NAND flash, while on NOR based consoles the single NOR flash is connected directly to the [[South Bridge]].


<Gallery>
CECHA-CECHG (Fat-old) :
File:Spansion flash product code.jpg|Spansion flash<br>product code
2x Samsung K9F1G08U0A-PIB0 (2x1Gbit=256MB total)
</Gallery>
 
CECHH-CECHQ (Fat-new) and CECH-2xxxA/B (Slim):
1x Spansion S29GL128N90TFIR2
or
1x Samsung K8Q2815UQB-PI4B


== SKU Differentiation ==
For a difference between models, see [[SKU Models]]
For a difference between models, see [[SKU Models]]


===Retail===
{{Flash types and models used by PS3}}


===Non Retail===
Reference Tool DECR1000A Communication Processor board :
1x [[K9F2G08U0M|Samsung K9F2G08U0M]] (NAND 1x2Gbit=256MB total)


== Other Flash ==
==Samsung K9F1G08U0A-PIB0==
 
<pre>productcode meaning:
K - Memory
9 - NAND Flash
F - Small Classification : SLC Normal
1G - Density : 1Gigabit (128MB)
0 - Technology : Normal (x8)
8 - Organisation : x8
U - Vcc Supply Voltage : min 2.7V - Max 3.6V / typ. 3.3V
0 - Mode : Normal
A - Generation : 2nd
-
P - Package : 48pin TSOP1 (12mm x 20mm / 0.5mm pitch)) Lead-free
I - Temperature : Industrial
B - Customer Bad Block : Include Bad Block
0 - PreProgram Version : None</pre>
 
<div style="float:right">[[File:TOSP1-48pin.png|200px|thumb|left|48-pin TSOP1 Standard Type 12mm x 20mm<br />Samsung K9F1G08U0A-PIB0]]</div>
 


=== Renesas HN58X2504TIE (EEPROM) ===
 
<div style="float:right">[[File:TSSOP-8pin-HN58X2504TIE.png|200px|thumb|left|8-pin TSSOP<br />Renesas HN58X2504TIE]]</div>
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;"
Note: although [http://www.edepot.com/playstation3.html#Super_Secrets edepot&others] lists it on the board, I can only find this IC in the sixaxis. <br />
|- bgcolor="#cccccc"
[http://www.datasheetarchive.com/HN58X2504TIE-datasheet.html Datasheet] <br />
! Pin !! Usage !! Remarks
|-
| 1 || NC || No Connection
|-
| 2 || NC || No Connection
|-
| 3 || NC || No Connection
|-
| 4 || NC || No Connection
|-
| 5 || NC || No Connection
|-
| 6 || NC || No Connection
|-
| 7 || R/B || Read/Busy Output
|-
| 8 || RE || Read Enable
|-
| 9 || CE || Chip Enable
|-
| 10 || NC || No Connection
|-
| 11 || NC || No Connection
|-
| 12 || Vcc || Vcc (min 2.7V-max 3.6V / typ 3.3V)  
|-
| 13 || Vss || Ground
|-
| 14 || NC || No Connection
|-
| 15 || NC || No Connection
|-
| 16 || CLE || Command Latch Enable
|-
| 17 || ALE || Address Latch Enable
|-
| 18 || WE || Write Enable
|-
| 19 || WP || Write Protect
|-
| 20 || NC || No Connection
|-
| 21 || NC || No Connection
|-
| 22 || NC || No Connection
|-
| 23 || NC || No Connection
|-
| 24 || NC || No Connection
|-
|}
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;"  
|- bgcolor="#cccccc"
! Pin !! Usage !! Remarks
|-
| 25 || NC || No Connection
|-
| 26 || NC || No Connection
|-
| 27 || NC || No Connection
|-
| 28 || NC || No Connection
|-
| 29 || I/O0 ||
|-
| 30 || I/O1 ||
|-
| 31 || I/O2 ||
|-
| 32 || I/O3 ||
|-
| 33 || NC || No Connection
|-
| 34 || NC || No Connection
|-
| 35 || NC || No Connection
|-
| 36 || Vss || Ground
|-
| 37 || Vcc || Vcc (min 2.7V-max 3.6V / typ 3.3V)
|-
| 38 || NC || No Connection
|-
| 39 || NC || No Connection
|-
| 40 || NC || No Connection
|-
| 41 || I/O4 ||
|-
| 42 || I/O5 ||
|-
| 43 || I/O6 ||
|-
| 44 || I/O7 ||
|-
| 45 || NC || No Connection
|-
| 46 || NC || No Connection
|-
| 47 || NC || No Connection
|-
| 48 || NC || No Connection
|-
|}
 
 
 
==Spansion S29GL128N90TFIR2==


<pre>productcode meaning:
<pre>productcode meaning:
H -  
S29GL128N - 3.0 Volt-only, 512 Megabit (32M x 16-bit/64Mx8-bit), Page-Mode, Flash Memory, 110nm
N -  
90 - Speed option : 90ns
5 -
T - Package type: TSOP
8 - Organisation : x8bit
F - Package materials set : Lead-free
X -  
I - Temperature range : Industrial
2 -  
R2 - ?Vio = 2.7 to 3.6V, lowest address sector protected?</pre>
5 -  
0 -
4 - Density : 4-kbit (512x8bit)
T - Package : 8pin plastic TSSOP (TTP-8DAV)
I - Temp : Industrial (-40 to +85 °C
E - Environment : Lead Free
</pre>


<div style="float:right">[[File:S29GLxxxN.png|200px|thumb|left|56-pin TSOP1 Standard Type 14mm x 20mm<br />Spansion S29GLxxxN]]</div>


Each PS3 has a special EEPROM chip on the motherboard using a SPI Serial Interface Renasas chip.


{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;"  
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;"  
|- bgcolor="#cccccc"
|- bgcolor="#cccccc"
! Type !! Size !! Speed !! Voltage !! Packaging !! Manufacturer !! Serial Number !! Description
! Pin !! Usage !! Remarks
|-
| 1 || '''A23''' || No Connection for S29GL128N
|-
|-
| EEPROM || 4-kbit (512x8bit) || 3MHz || 1.8V to 5.5V || 8-pin TSSOP || Renesas || HN58X2504TIE || PS3 EEPROM chip
| 2 || A22 ||
|-
| 3 || A15 ||
|-
| 4 || A14 ||
|-
| 5 || A13 ||
|-
| 6 || A12 ||
|-
| 7 || A11 ||
|-
| 8 || A10 ||
|-
| 9 || A9 ||
|-
| 10 || A8 ||
|-
| 11 || A19 ||
|-
| 12 || A20 ||
|-
| 13 || WE# || Write Enable
|-
| 14 || RESET# || Reset
|-
| 15 || A21 ||
|-
| 16 || WP#/ACC || Write Protect / Accelerated Program Operation
|-
| 17 || RD/BY# || Ready/Busy Output
|-
| 18 || A18 ||
|-
| 19 || A17 ||
|-
| 20 || A7 ||
|-
| 21 || A6 ||
|-
| 22 || A5 ||
|-
| 23 || A4 ||
|-
| 24 || A3 ||
|-
| 25 || A2 ||
|-
| 26 || A1 ||
|-
| 27 || NC || No Connection
|-
| 28 || NC || No Connection
|-
|}
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;"
|- bgcolor="#cccccc"
! Pin !! Usage !! Remarks
|-
| 29 || Vio || Vio - Output Buffer Power
|-
| 30 || NC || No Connection
|-
| 31 || A0 ||
|-
| 32 || CE# || Chip Enable
|-
| 33 || VSS || Ground
|-
| 34 || OE# || Output Enable
|-
| 35 || DQ0 ||
|-
| 36 || DQ8 ||
|-
| 37 || DQ1 ||
|-
| 38 || DQ9 ||
|-
| 39 || DQ2 ||
|-
| 40 || DQ10 ||
|-
| 41 || DQ3 ||
|-
| 42 || DQ11 ||
|-
| 43 || Vcc || Vcc (min 2.7V-max 3.6V / typ 3.0V)
|-
| 44 || DQ4 ||
|-
| 45 || DQ12 ||
|-
| 46 || DQ5 ||
|-
| 47 || DQ13 ||
|-
| 48 || DQ6 || '''*OTP?'''
|-
| 49 || DQ14 ||
|-
| 50 || DQ7 || '''*OTP?'''
|-
| 51 || DQ15'''/A-1''' ||
|-
| 52 || VSS || Ground
|-
| 53 || '''#BYTE''' || BYTE# Selects 8-bit or 16-bit mode (NC on Samsung NOR)
|-
| 54 || A16 ||
|-
| 55 || NC || No Connection
|-
| 56 || A24 || No Connection for S29GL128N and S29GL256N
|-
|-
|}
|}




==Samsung K8Q2815UQB-PI4B==
<pre>productcode meaning:
K - Memory
8 - NOR Flash
Q - Small Classification : Page Mode DDP
28 - Density : 128M, 8M / 16Bank / 8^8
15 - Dual Bank Boot Block (Bank1, Bank2) : 16M, 2M / 14M
U - Vcc : 3.0V / 3.3V (2.7V~3.6V)
Q - Device Type: Yop and Bottom Boot Block
B - Generation : 3rd Generation
-
P - Package : TSOP1 (Lead Free)
I - Temp : Industrial
4B - Speed : 60ns/25ns (Page)
</pre>
<div style="float:right">[[File:TOSP1-56pin.png|200px|thumb|left|56-pin TSOP1 Standard Type 14mm x 20mm]]</div>
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;"
|- bgcolor="#cccccc"
! Pin !! Usage !! Remarks
|-
| 1 || NC || No Connection
|-
| 2 || A22 ||
|-
| 3 || A15 ||
|-
| 4 || A14 ||
|-
| 5 || A13 ||
|-
| 6 || A12 ||
|-
| 7 || A11 ||
|-
| 8 || A10 ||
|-
| 9 || A9 ||
|-
| 10 || A8 ||
|-
| 11 || A19 ||
|-
| 12 || A20 ||
|-
| 13 || WE || Write Enable
|-
| 14 || RESET || Reset
|-
| 15 || A21 ||
|-
| 16 || WP/ACC || Write Protect / Accelerated Program Operation
|-
| 17 || RD/BY || Ready/Busy Output
|-
| 18 || A18 ||
|-
| 19 || A17 ||
|-
| 20 || A7 ||
|-
| 21 || A6 ||
|-
| 22 || A5 ||
|-
| 23 || A4 ||
|-
| 24 || A3 ||
|-
| 25 || A2 ||
|-
| 26 || A1 ||
|-
| 27 || NC || No Connection
|-
| 28 || NC || No Connection
|-
|}
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;"  
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;"  
|- bgcolor="#cccccc"
|- bgcolor="#cccccc"
! Pin !! Usage !! Remarks
! Pin !! Usage !! Remarks
|-
|-
| 1 || S || Chip Select
| 29 || VCCQ || VccQ
|-
| 30 || NC || No Connection
|-
| 31 || A0 ||
|-
| 32 || CE || Chip Enable
|-
| 33 || VSS || Ground
|-
| 34 || OE || Output Enable
|-
| 35 || DQ0 ||
|-
| 36 || DQ8 ||
|-
| 37 || DQ1 ||
|-
| 38 || DQ9 ||
|-
| 39 || DQ2 ||
|-
| 40 || DQ10 ||
|-
| 41 || DQ3 ||
|-
| 42 || DQ11 ||
|-
| 43 || Vcc || Vcc (min 2.7V-max 3.6V / typ 3.0V)
|-
| 44 || DQ4 ||
|-
| 45 || DQ12 ||
|-
| 46 || DQ5 ||
|-
| 47 || DQ13 ||
|-
| 48 || DQ6 || *OTP?
|-
| 49 || DQ14 ||
|-
|-
| 2 || Q || Serial data output
| 50 || DQ7 || *OTP?
|-
|-
| 3 || W || Write Protect
| 51 || DQ15 ||  
|-
|-
| 4 || VSS || Ground
| 52 || VSS || Ground
|-
|-
| 5 || D || Serial data input
| 53 || NC || No Connection
|-
|-
| 6 || C || Serial Clock
| 54 || A16 ||  
|-
|-
| 7 || HOLD || Hold
| 55 || NC || No Connection
|-
|-
| 8 || VCC || Vcc (min 1.8V-max 5.5V)
| 56 || NC || No Connection
|-
|-
|}
|}




{{Motherboard Components}}<noinclude>[[Category:Main]]</noinclude>
*OTP Block Region : 256-word Flash memory region. The data DQ6=1 for customer locked and DQ7=1 for factory locked
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