PARENT COMPONENT
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CHILD COMPONENT
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PARENT CATEGORY
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CHILD CATEGORY
|
QTY
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MANUFACTURER
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PART#
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GENERAL DESCRIPTION
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SPECIFIC DESCRIPTION
|
TYPE
|
PHOTOS
|
NOTES
|
Display / Touchscreen Module |
Display & Touch |
Display |
OLED |
1 |
Samsung Mobile Display |
AMS495QA01 |
OLED Display Unit - 5" Diagonal, 16M Color AMOLED, 960 x 544 Pixels, 115um x 115um Pixel Size, 110mm x 62.5mm Viewable Area |
Logo, AMS495QA01 REV14.2, 2011.07.20, S111101123451 |
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|
|
Display PCB |
I/O & Interface |
Passive |
Capacitor |
24 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Display PCB |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
Hirose |
|
Board to Board - Plug, Gold Plated Contacts |
HRS, 2U |
SMD |
|
|
Display PCB |
I/O & Interface |
Discrete Semi |
Diode |
1 |
Rohm |
RB520S-30 |
Schottky Barrier - 30V, 200mA |
B |
SOD523 |
|
|
Display PCB |
I/O & Interface |
Passive |
Magnetic |
3 |
|
|
Ferrite Bead - Arrayx2 |
|
303 |
|
|
Display PCB |
I/O & Interface |
Passive |
Resistor |
6 |
|
|
SMD Flat Chip |
|
402 |
|
|
Enclosure, Main |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Acoustics |
2 |
|
|
Loudspeaker - w/ 2 Gold Plated Contacts & Metal Shielding |
J02, q145 |
|
|
|
Enclosure, Main |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Antenna |
1 |
|
|
Internal B - Etched Copper On Flexible Substrate, w/ PSA |
29058121 D1 |
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|
|
Enclosure, Main |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Antenna |
1 |
|
|
GPS - Etched Copper On Flexible Substrate, w/ PSA |
29058109.02, 11465B4.0 |
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|
|
Enclosure, Main |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Antenna |
1 |
|
|
Internal A - Etched Copper On Flexible Substrate, Painted, w/ PSA |
29062968 P5 WK41 |
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|
|
Enclosure, Main |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Antenna |
1 |
|
|
WLAN / Bluetooth - Etched Copper On Flexible Substrate, Painted, w/ PSA |
29062934 P5 WK41 |
|
|
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Enclosure, Main |
Mechanical / Electro-Mechanical |
Mechanical |
Hardware |
3 |
|
|
Fastener - Machine Screw, M1.6 x 4.5mm, Philips Flat Head, Painted |
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|
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Enclosure, Main |
Mechanical / Electro-Mechanical |
Mechanical |
Hardware |
15 |
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Fastener - Machine Screw, M1.6 x 5mm, Philips Flat Head, Painted |
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|
|
|
Enclosure, Main |
Mechanical / Electro-Mechanical |
Mechanical |
Hardware |
3 |
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|
Fastener - Machine Screw, M1.6 x 5.4mm, Philips Flat Head, Painted |
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|
|
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Enclosure, Main |
Mechanical / Electro-Mechanical |
Mechanical |
Hardware |
1 |
|
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Fastener - Machine Screw, M1.6 x 5.4mm, Philips Flat Head |
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|
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Enclosure, Main |
Mechanical / Electro-Mechanical |
Mechanical |
Hardware |
2 |
|
|
Fastener - Machine Screw, M1.6 x 4.6mm, Hex Flat Head |
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|
|
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Enclosure, Main |
Mechanical / Electro-Mechanical |
Mechanical |
Hardware |
5 |
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|
Fastener - Machine Screw, M1.6 x 6.4mm, Philips Flat Head, Black Oxide Finish |
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|
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Enclosure, Main |
Mechanical / Electro-Mechanical |
Mechanical |
Metals |
1 |
|
|
Mounting Tab - Stamped / Formed Aluminum |
L 2 |
|
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|
Enclosure, Main |
Mechanical / Electro-Mechanical |
Mechanical |
Metals |
1 |
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|
Mounting Tab - Stamped / Formed Aluminum |
M 2 |
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Enclosure, Main |
Mechanical / Electro-Mechanical |
Mechanical |
Metals |
1 |
|
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Mounting Tab - Stamped / Formed Aluminum |
1 R |
|
|
|
Enclosure, Main |
Mechanical / Electro-Mechanical |
Mechanical |
Metals |
1 |
|
|
Mounting Tab - Stamped / Formed Metal |
3 |
|
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Integrated Circuit |
Analog |
1 |
Sony |
CXM3555ER |
Antenna Switch - SP10T, w/ Integrated Filters & Compatible Decoder |
M3555, AS1V, 133 |
QFN |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Integrated Circuit |
Analog |
1 |
|
|
LNA - GPS |
311H |
SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Integrated Circuit |
Analog |
1 |
Avago Technologies |
ACPM-5005 |
PAM - WCDMA / HSPA+ 850, 815-849MHz |
A5005, K1128, ODF144 |
SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Integrated Circuit |
Analog |
1 |
Avago Technologies |
ACPM-5002 |
PAM - WCDMA 1900, 1850-1915MHz |
A5002, K1127, ODD081 |
SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Integrated Circuit |
Analog |
1 |
Avago Technologies |
ACPM-5008 |
PAM - WCDMA / HSPA+ 900, 897.5MHz |
A5008, K1132, ODG015 |
SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Integrated Circuit |
Analog |
1 |
Avago Technologies |
ACPM-5001 |
PAM - WCDMA / HSPA+ 2100, 1950MHz |
A5001, KI127, ODC061 |
SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Integrated Circuit |
Analog |
1 |
Avago Technologies |
ACPM-7868 |
PAM - Quad-Band GSM / EDGE |
AVAGO, ACPM-7868, K1128, DL142 |
SMD |
|
|
Half Mini PCIe Module |
Power Supply |
Integrated Circuit |
Analog |
|
Qualcomm |
PM8028 |
1x Die - Power Management IC |
HG11-VK495-200 |
|
|
|
Half Mini PCIe Module |
Power Supply |
Integrated Circuit |
Analog |
1 |
Qualcomm |
PM8028 |
Power Management IC |
QUALCOMM, PM8028, A10618.1, F11330B4 |
BGA |
|
|
Half Mini PCIe Module |
Power Supply |
Passive |
Capacitor |
4 |
|
|
Ceramic Multilayer - C0G/NP0 |
Gray |
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Capacitor |
4 |
|
|
Ceramic Multilayer - C0G/NP0 |
Violet |
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - C0G/NP0 |
Gray |
402 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Half Mini PCIe Module |
Memory |
Passive |
Capacitor |
8 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Half Mini PCIe Module |
Memory |
Passive |
Capacitor |
2 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Capacitor |
5 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
603 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Capacitor |
4 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Capacitor |
53 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Capacitor |
39 |
|
|
Ceramic Multilayer - C0G/NP0 |
Violet |
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Capacitor |
15 |
|
|
Ceramic Multilayer - C0G/NP0 |
Gray |
402 |
|
|
Half Mini PCIe Module |
Power Supply |
Passive |
Capacitor |
18 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Half Mini PCIe Module |
Power Supply |
Passive |
Capacitor |
5 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Half Mini PCIe Module |
Power Supply |
Passive |
Capacitor |
13 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
603 |
|
|
Half Mini PCIe Module |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
3 |
|
|
Coaxial Receptacle - Vertical, Subminiature, Gold Plated |
|
SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Crystal |
1 |
TXC |
7M Series |
Crystal - 19.200MHz |
T192, Mh9A |
2.5x3.2 SMD |
|
|
Half Mini PCIe Module |
Power Supply |
Passive |
Crystal |
1 |
Epson Toyocom |
FC-135 |
Crystal - 32.768kHz |
A140C |
1.5x3.2 SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Discrete Semi |
Diode |
2 |
|
|
Diode |
5V |
SOD923 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Filter |
1 |
Murata |
SAFEA942MFL0F00 |
Rx RF SAW Filter - GSM 900, 942.5MHz |
Logo R, MZ |
1.05x1.35 SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Filter |
1 |
Murata |
|
RX RF SAW Filter - Dual-Band GSM |
Logo e, SR |
1.35x1.8 SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Filter |
1 |
Murata |
SAFEA1G58FB0F00 |
RX RF SAW Filter - GPS/GLONASS, 1575.42/1602MHz |
Logo g, DW |
1.05x1.35 SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Filter |
1 |
Murata |
SAFEA1G58KA0F00 |
RX RF SAW Filter - GPS/GLONASS, 1575.42/1602MHz |
Logo g, D1 |
1.05x1.35 SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Filter |
1 |
Avago Technologies |
ACMD-7410 |
Duplexer - CDMA 1900, 1850.48/1909.52MHz |
AVAGO, A2FI132, 092623 |
SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Filter |
1 |
Murata |
SAYFP897MCA0B00 |
Duplexer - WCDMA 900, 897.5/942.5MHz |
Logo Fb, S2B |
2x2.5 SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Filter |
1 |
Murata |
SAYFP836MCA0F00 |
Duplexer - WCDMA 850, 836.5/881.5MHz |
Logo wg, S00 |
2x2.5 SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Filter |
1 |
Epcos |
B39212B7964P810 |
Duplexer - WCDMA 2100, 1950/2140MHz |
EPCOS, 7964, JP87 |
2x2.5 SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Integrated Circuit |
Logic |
1 |
Qualcomm |
MDM6200 |
Baseband / RF Transceiver - GSM/WCDMA/HSPA+ |
QUALCOMM R, MDM6200, BN38PC, C1134007 |
BGA |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Integrated Circuit |
Logic |
|
Qualcomm |
MDM6200 |
1x Die 1 - Baseband |
Die Marking: HG11-VJ130 |
|
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Integrated Circuit |
Logic |
|
Qualcomm |
MDM6200 |
1x Die 2 - RF Transceiver - Dual Mode, GSM/EDGE/EVDOrB/HSPA+, Multi-Band |
Die Marking: HG11-VF535-220 |
|
|
|
Half Mini PCIe Module |
Power Supply |
Passive |
Magnetic |
4 |
|
|
Inductor - Wound Ferrite Core, Shielded |
|
SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Magnetic |
1 |
|
|
Inductor - Ceramic Multilayer |
1/2 Gray / White |
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Magnetic |
2 |
|
|
Inductor - Ceramic Multilayer |
1/2 Black / White |
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Magnetic |
3 |
|
|
Inductor - Ceramic Multilayer |
Blue w/ White Dot |
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Magnetic |
21 |
|
|
Inductor - Ceramic Multilayer |
1/2 Gray / White |
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Magnetic |
22 |
|
|
Inductor - Ceramic Multilayer |
Blue w/ White Dot |
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Magnetic |
19 |
|
|
Inductor - Ceramic Multilayer |
1/2 Gray / White |
402 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Magnetic |
3 |
|
|
Inductor - Ceramic Multilayer |
1/2 Black / Green |
402 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Magnetic |
1 |
|
|
Ferrite Bead |
|
402 |
|
|
Half Mini PCIe Module |
Memory |
Integrated Circuit |
Memory |
1 |
Toshiba Semiconductor |
Y890A111222KA |
MCP - 512Mb NAND Flash + 256Mb Mobile SDRAM |
Logo CHINA, Y890A111222KA, ZX3581 1135KND |
BGA |
|
|
Half Mini PCIe Module |
Memory |
Integrated Circuit |
Memory |
|
Toshiba Semiconductor |
Y890A111222KA |
1x Die 1 - Toshiba 512Mb NAND Flash |
Die Marking: Toshiba GWM2 |
|
|
|
Half Mini PCIe Module |
Memory |
Integrated Circuit |
Memory |
|
Toshiba Semiconductor |
Y890A111222KA |
1x Die 2 - Hynix H55S2562J 256Mb Mobile SDRAM |
Die Marking: H55S2562J, DTC05AA (see picture) |
|
|
|
Half Mini PCIe Module |
Mechanical / Electro-Mechanical |
Module |
Other |
1 |
Chi Mei Communications Systems |
ZOEDA-BB1-S9-17618 |
3G Half Mini PCIe Module - Quad-Band WCDMA/HSUPA/HSDPA, Quad-Band GSM/EDGE |
CE0682 AD110301003, 003XYA110299, 003MWA110300, Barcodes, Sony P/N:1-489-770-31, S/N:ZOEDA-BB1-S9-17618, IMEI: 358459044116214, FCC ID: QDJZOE, Made in China Model: ZOE |
|
|
|
Half Mini PCIe Module |
Mechanical / Electro-Mechanical |
Electro Mechanical |
PCB |
1 |
Nan Ya Pcb |
|
10-Layer - FR4/RCF HDI, 3+4+3, Lead-Free, Halogen-Free |
B1P-0116202-A010 Logo NM10 94V-0, M1011-D1 S8, 1138 |
|
|
|
Half Mini PCIe Module |
Power Supply |
Passive |
Resistor |
10 |
|
|
SMD Flat Chip |
|
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Resistor |
2 |
|
|
SMD Flat Chip |
|
201 |
|
|
Half Mini PCIe Module |
Memory |
Passive |
Resistor |
1 |
|
|
SMD Flat Chip |
|
402 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Resistor |
16 |
|
|
SMD Flat Chip |
|
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Resistor |
1 |
|
|
SMD Flat Chip |
|
402 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Resistor |
23 |
|
|
SMD Flat Chip |
|
201 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Passive |
Resistor |
1 |
|
|
SMD Flat Chip |
|
402 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Module |
RF |
1 |
|
|
SAW Module |
SWUA, D88, D136 |
SMD |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Discrete Semi |
Transistor |
1 |
|
|
Transistor |
L8 |
SOT563 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Discrete Semi |
Transistor |
2 |
|
|
Transistor |
N4 |
SOT723 |
|
|
Half Mini PCIe Module |
Baseband / RF / PA |
Discrete Semi |
Transistor |
1 |
Toshiba Semiconductor |
SSM3J16FV |
MOSFET - P-Channel, -20V, -100mA |
DT |
SOT723 |
|
|
Left Button PCB |
Mechanical / Electro-Mechanical |
Electro Mechanical |
PCB |
1 |
Honghengsheng Electronical Technology(Huaian) |
|
2-Layer - FR4, Lead-Free, Halogen-Free |
E253117, 11421, DS1, 94V-0, IRL-002, 1-884-529-21, >EP GW<, LF, HF |
|
|
|
Left Button PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
2 |
|
|
Ceramic Multilayer - C0G/NP0 |
Violet |
402 |
|
|
Left Button PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
5 |
|
|
Ceramic Multilayer - C0G/NP0 |
Violet |
201 |
|
|
Left Button PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
5 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Left Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Ground Contact - Stamped / Formed Metal |
|
SMD |
|
|
Left Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Ground Contact - Stamped Metal, Gold Plated |
|
SMD |
|
|
Left Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
B1 |
SMD |
|
|
Left Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
A8 |
SMD |
|
|
Left Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
MXJ, A5 |
SMD |
|
|
Left Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
2 |
|
|
Loudspeaker Contact - Stamped Metal, Gold Plated |
|
SMD |
|
|
Left Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Coaxial Receptacle - Vertical, Subminiature, Gold Plated |
|
SMD |
|
|
Left Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
2 |
|
|
Antenna Contact - Stamped / Formed Metal, Gold Plated |
|
SMD |
|
|
Left Button PCB, Bottom |
I/O & Interface |
Passive |
Magnetic |
2 |
|
|
Inductor - Ceramic Multilayer |
1/2 Gray / White |
402 |
|
|
Left Button PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
3 |
|
|
SMD Flat Chip |
|
402 |
|
|
Left Button PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
1 |
|
|
SMD Flat Chip |
|
402 |
|
|
Left Button PCB, Top |
I/O & Interface |
Passive |
Capacitor |
5 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Left Button PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
2 |
|
|
Ground Contact - Stamped / Formed Metal |
|
SMD |
|
|
Left Button PCB, Top |
I/O & Interface |
Optical Semi |
LED |
1 |
|
|
Blue, Right Angle |
|
SMD |
|
|
Left Button PCB, Top |
I/O & Interface |
Optical Semi |
LED |
1 |
|
|
Red, Right Angle |
|
SMD |
|
|
Left Button PCB, Top |
I/O & Interface |
Passive |
Magnetic |
2 |
|
|
Ferrite Bead |
|
402 |
|
|
Left Button PCB, Top |
I/O & Interface |
Passive |
Resistor |
5 |
|
|
SMD Flat Chip |
|
402 |
|
|
Main PCB |
Mechanical / Electro-Mechanical |
Electro Mechanical |
PCB |
1 |
UniMicron Technology |
|
10-Layer - FR4/RCF HDI, 1+8+1, Lead-Free, Halogen-Free |
HF LF, IRS-002, >EP GW<, 1-883-949, -11, 1143 10-01, 2V 94V-0 A7, UMT-KS |
|
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Acoustics |
1 |
Knowles Acoustics |
SPQ2410HR5H-PD |
Microphone Element - MEMS, w/ Maximum RF Protection |
S582, 6073 |
SMD |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
95 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
4 |
|
|
Ceramic Multilayer - C0G/NP0 |
Gray |
201 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - C0G/NP0 |
Violet |
402 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
11 |
|
|
Ceramic Multilayer - C0G/NP0 |
Violet |
201 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
26 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
603 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
51 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Ground Contact - Stamped Metal, Gold Plated |
|
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
4 |
|
|
Antenna Contact - Stamped / Formed Metal, Gold Plated |
|
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Ground Contact - Stamped Metal, Gold Plated |
|
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Coaxial Receptacle - Vertical, Subminiature, Gold Plated |
|
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
Hirose |
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
HRS, J4, B1 |
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
Hirose |
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
HRS, D1, A3 |
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
Hirose |
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
HRS, D1, A6 |
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
A5 |
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
FFC / FPC - Right Angle, w/ Metal Housing & Locking Clip |
B |
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
Alps Electric |
|
Memory Stick Micro (m2) Memory Card Slot - Push-Push, Right Angle, Gold Plated Contacts, w/ Metal Housing |
ALPS, 11NA |
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
Hirose |
|
Board to Board - Receptacle, Gold Plated Contacts |
HRS, B |
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Pin Header - Shrouded, Right Angle, Gold Plated Contacts |
|
SMD |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
Foxconn |
|
Mini PCI Express Card Edge - Right Angle, Gold Plated Contacts |
1BFMA, FOXCONN |
SMD |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Crystal |
1 |
NDK |
NX3225GA |
Crystal - 27.000MHz |
27.000, Logo :138 |
2.5x3.2 SMD |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Crystal |
1 |
Epson Toyocom |
FC-135 |
Crystal - 32.768kHz |
A140C |
1.5x3.2 SMD |
|
|
Main PCB, Bottom |
BT / WLAN |
Passive |
Filter |
1 |
|
|
Filter - Ceramic, Bandpass |
Gray w/ Black Dot |
603 |
|
|
Main PCB, Bottom |
Mechanical / Electro-Mechanical |
Mechanical |
Hardware |
2 |
|
|
Standoff - Threaded Metal |
|
|
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
Logic |
1 |
Renesas |
|
ASIC |
C 2011, SCEI, 1141KM40L, E066D94100 (Die Marking: NEC Electronics, Corp 2009, 56, 0109) |
BGA |
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
Logic |
1 |
Wolfson Micro |
WM1803E |
Audio Codec |
Logo, WM1803E, 1BAKPMN |
Flip Chip |
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
Logic |
|
Wolfson Micro |
WM1803E |
1x Die - Audio Codec |
D1 D1 |
|
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
Logic |
1 |
Toshiba Semiconductor |
TC7WG126FK |
Buffer - Dual, w/ 3-State Output |
WG, 126 |
VSSOP |
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
Logic |
1 |
Texas Instruments |
TS3A5018RSVR |
Analog Switch - Quad, SPDT, 10 Ohm |
ZUN, 19H |
QFN |
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
Logic |
1 |
IDT |
|
Clock Synthesizer |
638, 139L, 67LG (Die Marking: 2006, 895-132, 2006, AT270, (M) IDT) |
QFN |
|
|
Main PCB, Bottom |
BT / WLAN |
Passive |
Magnetic |
2 |
|
|
Inductor - Ceramic Multilayer |
1/2 Gray / White |
402 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Magnetic |
5 |
|
|
Ferrite Bead |
|
603 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Magnetic |
8 |
|
|
Ferrite Bead |
|
402 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Magnetic |
4 |
|
|
Ferrite Bead - Arrayx2 |
|
303 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Magnetic |
1 |
|
|
Ferrite Bead - Arrayx2 |
|
404 |
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
MEMS |
1 |
ST Microelectronics |
|
Gyroscope - 3-Axis, Analog Output |
3GA51H, 2135, MB9DP |
LGA |
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
MEMS |
|
ST Microelectronics |
|
Die 1 - Logic |
|
|
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
MEMS |
|
ST Microelectronics |
|
Die 2 - MEMS |
Die Marking: Logo 2010, V706A |
|
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
MEMS |
1 |
Kionix |
KXTC9 Series |
Accelerometer & Inclinometer - 3-Axis, Analog Output |
KXTC9, 20763, 3811 |
LGA |
|
|
Main PCB, Bottom |
I/O & Interface |
Integrated Circuit |
MEMS |
1 |
AKM Semiconductor |
AKM8975B |
Electronic Compass - 3-Axis, w/ Built-In ADC, 8-Bit Digital Output & Supplementary Substrate |
8975C, D137L |
Flip Chip |
|
|
Main PCB, Bottom |
BT / WLAN |
Passive |
Resistor |
5 |
|
|
SMD Flat Chip |
|
402 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
12 |
|
|
SMD Flat Chip |
|
402 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
2 |
|
|
Precision SMD |
Green |
402 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
101 |
|
|
SMD Flat Chip |
|
201 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
11 |
|
|
Precision SMD |
Green |
201 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
1 |
|
|
SMD Flat Chip |
|
603 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
1 |
|
|
SMD Flat Chip |
|
805 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
1 |
|
|
Precision SMD |
Blue |
402 |
|
|
Main PCB, Bottom |
I/O & Interface |
Passive |
Resonator |
1 |
|
|
Ceramic Resonator |
80k |
1.3x3.2 SMD |
|
|
Main PCB, Top |
Power Supply |
Integrated Circuit |
Analog |
1 |
Fujitsu |
MB44C026A |
Power Management Module - Contains PMIC, & Ceramic Inductors |
MB44C026A, 1139 J17, E1 |
BGA |
|
|
Main PCB, Top |
Power Supply |
Integrated Circuit |
Analog |
|
Fujitsu |
MB44C026A |
1x Die - Power Management IC |
MB44C026 |
|
|
|
Main PCB, Top |
Power Supply |
Integrated Circuit |
Analog |
1 |
ST Microelectronics |
STOD03ATPUR |
DC-DC Converter - Dual, Step-Up / Inverting, 4.6V, 200mA, 1.5MHz, for Powering AMOLED Display |
Y136, D03A, S |
DFN |
|
|
Main PCB, Top |
Power Supply |
Integrated Circuit |
Analog |
1 |
Intersil |
ISL9110IRTAZ |
Regulator - Buck-Boost Switching, Adjustable, 1.2A, 2.5MHz |
Logo, GAUA, HG5K |
DFN |
|
|
Main PCB, Top |
Power Supply |
Integrated Circuit |
Analog |
1 |
Texas Instruments |
SN99057A5 |
Power Management IC |
99057, TI 19K, ARY6, G4 |
QFN |
|
|
Main PCB, Top |
Power Supply |
Integrated Circuit |
Analog |
|
Texas Instruments |
SN99057A5 |
1x Die - Power Management IC |
SN99057A5, Logo, TI, 2010 |
|
|
|
Main PCB, Top |
Power Supply |
Integrated Circuit |
Analog |
1 |
Texas Instruments |
bq27520YZF |
Battery Fuel Gauge - System-Side, w/ Integrated LDO, for Single Li-Ion Cell |
TI 18A123I, SN27520S1 (Die Marking: BDQ035, M 2009) |
Flip Chip |
|
|
Main PCB, Top |
BT / WLAN |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
805 |
|
|
Main PCB, Top |
BT / WLAN |
Passive |
Capacitor |
2 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
603 |
|
|
Main PCB, Top |
BT / WLAN |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Main PCB, Top |
BT / WLAN |
Passive |
Capacitor |
4 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Capacitor |
2 |
|
|
Ceramic Multilayer - C0G/NP0 |
Violet |
402 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - C0G/NP0 |
Violet |
201 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Capacitor |
13 |
|
|
Ceramic Multilayer - C0G/NP0 |
Gray |
201 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
805 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Capacitor |
2 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
603 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Capacitor |
7 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Capacitor |
11 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Main PCB, Top |
Memory |
Passive |
Capacitor |
4 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
603 |
|
|
Main PCB, Top |
Memory |
Passive |
Capacitor |
2 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Capacitor |
1 |
NEC Tokin |
PSLB30J476M |
Tantalum Conductive Polymer - Encapsulated, 6.3V, 47uF, Low ESR |
NEJ, jS7 |
594951 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Capacitor |
23 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
805 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Capacitor |
14 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
603 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Capacitor |
21 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Capacitor |
19 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - C0G/NP0 |
Gray |
201 |
|
|
Main PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
FFC / FPC - Right Angle, w/ Metal Housing & Locking Clip |
|
SMD |
|
|
Main PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Ground Contact - Stamped / Formed Metal |
|
SMD |
|
|
Main PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
Hirose |
|
Board to Board - Receptacle, Gold Plated Contacts |
HRS, C |
SMD |
|
|
Main PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Jack - Micro USB, Right Angle, w/ Plastic Housing |
|
SMD |
|
|
Main PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
PS Vita Card Slot - Push-Push, Right Angle, w/ Metal Housing |
A1NF |
SMD |
|
|
Main PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Jack - Audio, 3.5mm, Right Angle, Gold Plated Contacts in Plastic Housing |
1BCB, 3 |
Thru Hole |
|
|
Main PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Main I/O & Power - Right Angle, w/ Metal Housing |
|
SMD |
|
|
Main PCB, Top |
Power Supply |
Discrete Semi |
Diode |
1 |
Rohm |
RB161VA-20 |
Schottky Barrier - 20V, 1A |
X |
SOD323 |
|
|
Main PCB, Top |
I/O & Interface |
Optical Semi |
LED |
1 |
|
|
Amber |
|
402 |
|
|
Main PCB, Top |
I/O & Interface |
Integrated Circuit |
Logic |
1 |
ST Microelectronics |
|
I/O Controller |
32P10SOD, GK0MU 93, CHN 140, Logo e2 Z (Die Marking: T420A, ST 2009) |
BGA |
|
|
Main PCB, Top |
I/O & Interface |
Integrated Circuit |
Logic |
1 |
Texas Instruments |
TS3USB31RSER |
USB Switch - USB 2.0, 1-Port, w/ Single Enable |
L9 |
QFN |
|
|
Main PCB, Top |
Processing |
Integrated Circuit |
Logic |
1 |
Sony |
CXD5315GG |
CPU - Quad-Core, ARM Cortex-A9 + 4Gb Mobile DDR2 |
Sony Computer, Entertainment Inc., CXD5315GG, C 2011 SCEI, 1143HAF, 712556 |
BGA |
|
|
Main PCB, Top |
Processing |
Integrated Circuit |
Logic |
|
Sony |
CXD5315GG |
1x Die 2 - 1Gb Samsung GDDR5 Assumed |
Die marking: 1G-E-WIDE Samsung |
|
|
|
Main PCB, Top |
Processing |
Integrated Circuit |
Logic |
|
Sony |
CXD5315GG |
1x Die 1 - Toshiba Logic - Core Processor Assumed |
Die Marking: T9ML7, Toshiba, LP1X01) |
|
|
|
Main PCB, Top |
Processing |
Integrated Circuit |
Logic |
|
Sony |
CXD5315GG |
2x Die 3 - Samsung K4P2G324EC 2Gb Mobile DDR2 |
(Die Marking: 200912, M, C, SAMSUNG, K4P2G324EC) |
|
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Magnetic |
1 |
|
|
Ferrite Bead - Arrayx2 |
|
404 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Magnetic |
4 |
|
|
Ferrite Bead |
|
402 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Magnetic |
1 |
|
|
Ferrite Bead |
|
603 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Magnetic |
1 |
|
|
Inductor - Wound Ferrite Core, Shielded |
2R2 |
SMD |
|
|
Main PCB, Top |
Power Supply |
Passive |
Magnetic |
3 |
|
|
Ferrite Bead |
|
1008 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Magnetic |
10 |
|
|
Ferrite Bead |
|
603 |
|
|
Main PCB, Top |
Processing |
Passive |
Magnetic |
1 |
|
|
Ferrite Bead - Arrayx2 |
|
404 |
|
|
Main PCB, Top |
Processing |
Passive |
Magnetic |
3 |
|
|
Ferrite Bead - Arrayx2 |
|
303 |
|
|
Main PCB, Top |
Processing |
Passive |
Magnetic |
5 |
|
|
Ferrite Bead |
|
402 |
|
|
Main PCB, Top |
Memory |
Integrated Circuit |
Memory |
1 |
Toshiba Semiconductor |
THGBM3G5D1FBAIE |
Flash - eMMC NAND, 4GB, MLC |
TOSHIBA, THGBM3G5D1FBAIE, GT4164, TAIWAN, 11409AE |
BGA |
|
|
Main PCB, Top |
BT / WLAN |
Passive |
Resistor |
2 |
|
|
SMD Flat Chip |
|
402 |
|
|
Main PCB, Top |
BT / WLAN |
Passive |
Resistor |
1 |
|
|
SMD Flat Chip |
|
201 |
|
|
Main PCB, Top |
BT / WLAN |
Passive |
Resistor |
5 |
|
|
Precision SMD |
Green |
201 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Resistor |
5 |
|
|
Precision SMD |
Green |
201 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Resistor |
44 |
|
|
SMD Flat Chip |
|
201 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Resistor |
13 |
|
|
SMD Flat Chip |
|
402 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Resistor |
15 |
|
|
SMD Flat Chip |
|
402 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Resistor |
4 |
|
|
SMD Flat Chip |
|
603 |
|
|
Main PCB, Top |
Memory |
Passive |
Resistor |
2 |
|
|
SMD Flat Chip |
|
201 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Resistor |
1 |
|
|
Precision SMD |
5L00 |
1206 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Resistor |
2 |
|
|
SMD Flat Chip |
|
603 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Resistor |
5 |
|
|
Precision SMD |
Green |
402 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Resistor |
12 |
|
|
SMD Flat Chip |
|
201 |
|
|
Main PCB, Top |
Power Supply |
Passive |
Resistor |
3 |
|
|
Precision SMD |
Green |
201 |
|
|
Main PCB, Top |
Processing |
Passive |
Resistor |
56 |
|
|
SMD Flat Chip |
|
201 |
|
|
Main PCB, Top |
Processing |
Passive |
Resistor |
7 |
|
|
Precision SMD |
Green |
201 |
|
|
Main PCB, Top |
Processing |
Passive |
Resistor |
3 |
|
|
Precision SMD |
Green |
402 |
|
|
Main PCB, Top |
I/O & Interface |
Passive |
Resonator |
1 |
|
|
Ceramic Resonator |
Jk |
1.5x2 SMD |
|
|
Main PCB, Top |
Power Supply |
Discrete Semi |
Transistor |
2 |
|
|
Transistor |
TA |
SOT363 Wide |
|
|
Main PCB, Top |
Power Supply |
Discrete Semi |
Transistor |
1 |
|
|
Transistor |
T4 |
SOT363 Wide |
|
|
Main PCB, Top |
I/O & Interface |
Discrete Semi |
Transistor |
5 |
Rohm |
DTC023JM |
Bipolar - NPN, 50V, 100mA, w/ Built-In Resistors |
46 |
SOT723 |
|
|
Main PCB, Top |
I/O & Interface |
Discrete Semi |
Transistor |
2 |
Toshiba Semiconductor |
SSM3J16FV |
MOSFET - P-Channel, -20V, -100mA |
DT |
SOT723 |
|
|
Main PCB, Top |
I/O & Interface |
Discrete Semi |
Transistor |
1 |
Rohm |
DTA023JM |
Bipolar - PNP, -50V, -100mA, w/ Built-In Resistors |
36 |
SOT723 |
|
|
Main PCB, Top |
Power Supply |
Discrete Semi |
Transistor |
1 |
Rohm |
DTA023JM |
Bipolar - PNP, -50V, -100mA, w/ Built-In Resistors |
36 |
SOT723 |
|
|
Main PCB, Top |
Power Supply |
Discrete Semi |
Transistor |
1 |
Rohm |
DTC023JM |
Bipolar - NPN, 50V, 100mA, w/ Built-In Resistors |
46 |
SOT723 |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Integrated Circuit |
Analog |
1 |
|
|
Analog IC |
2568, 140Q |
DFN |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Integrated Circuit |
Analog |
1 |
Renesas |
uPG2406T6R-E2-A |
RF Switch- SPDT, L/S Band |
G9 |
DFN |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Passive |
Capacitor |
9 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Passive |
Capacitor |
5 |
|
|
Ceramic Multilayer - C0G/NP0 |
Violet |
201 |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Passive |
Capacitor |
8 |
|
|
Ceramic Multilayer - C0G/NP0 |
Gray |
201 |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Module |
Combo (BT/WiFi…) |
1 |
|
|
Bluetooth / FM / WLAN Module - 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter, Contains Marvell 88W8787S-BKB2 SoC |
WYSBMVDXA-1S, 1NF3 V |
SMD |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Passive |
Crystal |
1 |
Epson Toyocom |
FA-128 |
Crystal - 26.000MHz |
2600P, E17RA |
1.6x2 SMD |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Passive |
Filter |
1 |
|
|
Filter - Ceramic, Bandpass |
Pink w/ Gray Dot |
603 |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Integrated Circuit |
Logic |
1 |
Marvell |
88W8787S-BKB2 |
Bluetooth / FM / WLAN - SoC, 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter |
Logo R, 88W8787S-BKB2, PCM2170.3, 1137 B0P, TW E |
BGA |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Integrated Circuit |
Logic |
|
|
|
1x Die - Bluetooth / FM / WLAN - SoC, 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter |
Logo 2010, MARVELL, 19C, AP0 |
|
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Passive |
Magnetic |
11 |
|
|
Inductor - Ceramic Multilayer |
1/2 Gray / White |
201 |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Integrated Circuit |
Memory |
1 |
Seiko |
S-24C08CI-I8T1U3 |
EEPROM - 8Kb, 2-Wire Serial |
C08C, 3A7, 408 |
SMD |
|
|
Main PCB, Top, Bluetooth / FM / WLAN Module |
BT / WLAN |
Passive |
Resistor |
1 |
|
|
SMD Flat Chip |
|
201 |
|
|
Primary Camera Module |
Camera |
Camera |
Camera |
1 |
|
|
Primary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens |
|
|
|
|
Primary Camera Module |
I/O & Interface |
Passive |
Capacitor |
5 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Primary Camera Module |
I/O & Interface |
Optical Semi |
Image Sensor |
1 |
OmniVision |
|
Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area |
OV2B1AG (M) |
|
|
|
Right Button PCB |
Mechanical / Electro-Mechanical |
Electro Mechanical |
PCB |
1 |
Honghengsheng Electronical Technology(Huaian) |
|
2-Layer - FR4, Lead-Free, Halogen-Free |
E253117, DS194V-0, IRR-002, 1-884-528-21, >EP GW<, LF, HF |
|
|
|
Right Button PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
8 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Right Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
B6 |
SMD |
|
|
Right Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
A8 |
SMD |
|
|
Right Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
MXJ, A8 |
SMD |
|
|
Right Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
2 |
|
|
Loudspeaker Contact - Stamped Metal, Gold Plated |
|
SMD |
|
|
Right Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Coaxial Receptacle - Vertical, Subminiature, Gold Plated |
|
SMD |
|
|
Right Button PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Antenna Contact - Stamped / Formed Metal, Gold Plated |
|
SMD |
|
|
Right Button PCB, Bottom |
I/O & Interface |
Passive |
Magnetic |
1 |
|
|
Inductor - Ceramic Multilayer |
1/2 Gray / White |
402 |
|
|
Right Button PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
2 |
|
|
SMD Flat Chip |
|
402 |
|
|
Right Button PCB, Bottom |
I/O & Interface |
Passive |
Resistor |
4 |
|
|
SMD Flat Chip |
|
402 |
|
|
Right Button PCB, Top |
I/O & Interface |
Passive |
Capacitor |
3 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Right Button PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Ground Contact - Stamped / Formed Metal, Gold Plated |
|
SMD |
|
|
Right Button PCB, Top |
I/O & Interface |
Passive |
Resistor |
4 |
|
|
SMD Flat Chip |
|
402 |
|
|
Sencondary Camera Module |
Camera |
Camera |
Camera |
1 |
|
|
Secondary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens |
|
|
|
|
Sencondary Camera Module |
I/O & Interface |
Passive |
Capacitor |
5 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Sencondary Camera Module |
I/O & Interface |
Optical Semi |
Image Sensor |
1 |
OmniVision |
|
Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area |
OV2B1AG (M) |
|
|
|
SIM Card PCB |
Mechanical / Electro-Mechanical |
Electro Mechanical |
PCB |
1 |
Honghengsheng Electronical Technology(Huaian) |
|
2-Layer - FR4, Lead-Free, Halogen-Free |
IRC-002, 1-884-530-21, B, 11403, E253117, LF, HF, DS194V-0, >EP GW< |
|
|
|
SIM Card PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
SIM Card PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
1 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
SIM Card PCB, Bottom |
I/O & Interface |
Passive |
Capacitor |
2 |
|
|
Ceramic Multilayer - C0G/NP0 |
Gray |
201 |
|
|
SIM Card PCB, Bottom |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip |
MXJ, A6 |
SMD |
|
|
SIM Card PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
SIM Card - 6 Gold-Plated Contacts in Plastic Carrier, w/ Metal Housing |
1BG2 |
SMD |
|
|
SIM Card PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
|
|
Ground Contact - Stamped Metal, Gold Plated |
|
SMD |
|
|
Touchpad Controller PCB |
Mechanical / Electro-Mechanical |
Electro Mechanical |
PCB |
1 |
|
|
2-Layer - Flex Kapton, w/ Stiffener |
Logo F, M9Z, 4 |
|
|
|
Touchpad Controller PCB, Top |
I/O & Interface |
Passive |
Capacitor |
3 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Touchpad Controller PCB, Top |
I/O & Interface |
Passive |
Capacitor |
3 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Touchpad Controller PCB, Top |
I/O & Interface |
Passive |
Capacitor |
4 |
|
|
SMD Flat Chip |
|
201 |
|
|
Touchpad Controller PCB, Top |
Mechanical / Electro-Mechanical |
Electro Mechanical |
Connector |
1 |
Hirose |
|
Board to Board - Plug, Gold Plated Contacts |
HRS, B |
SMD |
|
|
Touchpad Controller PCB, Top |
I/O & Interface |
Integrated Circuit |
Logic |
1 |
Atmel |
mXT224 |
Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface |
ATMEL, MXT224, C070S541, F35019.1 |
BGA |
|
|
Touchpad Controller PCB, Top |
I/O & Interface |
Integrated Circuit |
Logic |
|
Atmel |
mXT224 |
1x Die - Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface |
Logo, AT 25968, AVR, 2010 |
|
|
|
Touchpad Controller PCB, Top |
Mechanical / Electro-Mechanical |
Mechanical |
Metals |
1 |
|
|
Stiffener - Stamped Metal, w/ PSA |
|
|
|
|
Touchscreen PCB |
I/O & Interface |
Passive |
Capacitor |
3 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
402 |
|
|
Touchscreen PCB |
I/O & Interface |
Passive |
Capacitor |
3 |
|
|
Ceramic Multilayer - X5R/X7R |
Brown |
201 |
|
|
Touchscreen PCB |
I/O & Interface |
Passive |
Resistor |
3 |
|
|
SMD Flat Chip |
|
201 |
|
|