Components

PS VITA teardown - overview

Hardware Analysis

PCH-1100

Sony Playstation Vita Teardown & Product Analysis by TECHINSIGHTS

Report by www.electronicproducts.com via IHS technology

PARENT COMPONENT	CHILD COMPONENT	PARENT CATEGORY	CHILD CATEGORY	QTY	MANUFACTURER	PART#	GENERAL DESCRIPTION	SPECIFIC DESCRIPTION	TYPE
Display / Touchscreen Module	Display & Touch	Display	OLED	1	Samsung Mobile Display	AMS495QA01	OLED Display Unit - 5" Diagonal, 16M Color AMOLED, 960 x 544 Pixels, 115um x 115um Pixel Size, 110mm x 62.5mm Viewable Area	Logo, AMS495QA01 REV14.2, 2011.07.20, S111101123451
Display PCB	I/O & Interface	Passive	Capacitor	24			Ceramic Multilayer - X5R/X7R	Brown	402
Display PCB	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1	Hirose		Board to Board - Plug, Gold Plated Contacts	HRS, 2U	SMD
Display PCB	I/O & Interface	Discrete Semi	Diode	1	Rohm	RB520S-30	Schottky Barrier - 30V, 200mA	B	SOD523
Display PCB	I/O & Interface	Passive	Magnetic	3			Ferrite Bead - Arrayx2		303
Display PCB	I/O & Interface	Passive	Resistor	6			SMD Flat Chip		402
Enclosure, Main	Mechanical / Electro-Mechanical	Electro Mechanical	Acoustics	2			Loudspeaker - w/ 2 Gold Plated Contacts & Metal Shielding	J02, q145
Enclosure, Main	Mechanical / Electro-Mechanical	Electro Mechanical	Antenna	1			Internal B - Etched Copper On Flexible Substrate, w/ PSA	29058121 D1
Enclosure, Main	Mechanical / Electro-Mechanical	Electro Mechanical	Antenna	1			GPS - Etched Copper On Flexible Substrate, w/ PSA	29058109.02, 11465B4.0
Enclosure, Main	Mechanical / Electro-Mechanical	Electro Mechanical	Antenna	1			Internal A - Etched Copper On Flexible Substrate, Painted, w/ PSA	29062968 P5 WK41
Enclosure, Main	Mechanical / Electro-Mechanical	Electro Mechanical	Antenna	1			WLAN / Bluetooth - Etched Copper On Flexible Substrate, Painted, w/ PSA	29062934 P5 WK41
Enclosure, Main	Mechanical / Electro-Mechanical	Mechanical	Hardware	3			Fastener - Machine Screw, M1.6 x 4.5mm, Philips Flat Head, Painted
Enclosure, Main	Mechanical / Electro-Mechanical	Mechanical	Hardware	15			Fastener - Machine Screw, M1.6 x 5mm, Philips Flat Head, Painted
Enclosure, Main	Mechanical / Electro-Mechanical	Mechanical	Hardware	3			Fastener - Machine Screw, M1.6 x 5.4mm, Philips Flat Head, Painted
Enclosure, Main	Mechanical / Electro-Mechanical	Mechanical	Hardware	1			Fastener - Machine Screw, M1.6 x 5.4mm, Philips Flat Head
Enclosure, Main	Mechanical / Electro-Mechanical	Mechanical	Hardware	2			Fastener - Machine Screw, M1.6 x 4.6mm, Hex Flat Head
Enclosure, Main	Mechanical / Electro-Mechanical	Mechanical	Hardware	5			Fastener - Machine Screw, M1.6 x 6.4mm, Philips Flat Head, Black Oxide Finish
Enclosure, Main	Mechanical / Electro-Mechanical	Mechanical	Metals	1			Mounting Tab - Stamped / Formed Aluminum	L 2
Enclosure, Main	Mechanical / Electro-Mechanical	Mechanical	Metals	1			Mounting Tab - Stamped / Formed Aluminum	M 2
Enclosure, Main	Mechanical / Electro-Mechanical	Mechanical	Metals	1			Mounting Tab - Stamped / Formed Aluminum	1 R
Enclosure, Main	Mechanical / Electro-Mechanical	Mechanical	Metals	1			Mounting Tab - Stamped / Formed Metal	3
Half Mini PCIe Module	Baseband / RF / PA	Integrated Circuit	Analog	1	Sony	CXM3555ER	Antenna Switch - SP10T, w/ Integrated Filters & Compatible Decoder	M3555, AS1V, 133	QFN
Half Mini PCIe Module	Baseband / RF / PA	Integrated Circuit	Analog	1			LNA - GPS	311H	SMD
Half Mini PCIe Module	Baseband / RF / PA	Integrated Circuit	Analog	1	Avago Technologies	ACPM-5005	PAM - WCDMA / HSPA+ 850, 815-849MHz	A5005, K1128, ODF144	SMD
Half Mini PCIe Module	Baseband / RF / PA	Integrated Circuit	Analog	1	Avago Technologies	ACPM-5002	PAM - WCDMA 1900, 1850-1915MHz	A5002, K1127, ODD081	SMD
Half Mini PCIe Module	Baseband / RF / PA	Integrated Circuit	Analog	1	Avago Technologies	ACPM-5008	PAM - WCDMA / HSPA+ 900, 897.5MHz	A5008, K1132, ODG015	SMD
Half Mini PCIe Module	Baseband / RF / PA	Integrated Circuit	Analog	1	Avago Technologies	ACPM-5001	PAM - WCDMA / HSPA+ 2100, 1950MHz	A5001, KI127, ODC061	SMD
Half Mini PCIe Module	Baseband / RF / PA	Integrated Circuit	Analog	1	Avago Technologies	ACPM-7868	PAM - Quad-Band GSM / EDGE	AVAGO, ACPM-7868, K1128, DL142	SMD
Half Mini PCIe Module	Power Supply	Integrated Circuit	Analog		Qualcomm	PM8028	1x Die - Power Management IC	HG11-VK495-200
Half Mini PCIe Module	Power Supply	Integrated Circuit	Analog	1	Qualcomm	PM8028	Power Management IC	QUALCOMM, PM8028, A10618.1, F11330B4	BGA
Half Mini PCIe Module	Power Supply	Passive	Capacitor	4			Ceramic Multilayer - C0G/NP0	Gray	201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Capacitor	4			Ceramic Multilayer - C0G/NP0	Violet	201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Capacitor	1			Ceramic Multilayer - C0G/NP0	Gray	402
Half Mini PCIe Module	Baseband / RF / PA	Passive	Capacitor	1			Ceramic Multilayer - X5R/X7R	Brown	201
Half Mini PCIe Module	Memory	Passive	Capacitor	8			Ceramic Multilayer - X5R/X7R	Brown	201
Half Mini PCIe Module	Memory	Passive	Capacitor	2			Ceramic Multilayer - X5R/X7R	Brown	402
Half Mini PCIe Module	Baseband / RF / PA	Passive	Capacitor	5			Ceramic Multilayer - X5R/X7R	Brown	603
Half Mini PCIe Module	Baseband / RF / PA	Passive	Capacitor	4			Ceramic Multilayer - X5R/X7R	Brown	402
Half Mini PCIe Module	Baseband / RF / PA	Passive	Capacitor	53			Ceramic Multilayer - X5R/X7R	Brown	201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Capacitor	39			Ceramic Multilayer - C0G/NP0	Violet	201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Capacitor	15			Ceramic Multilayer - C0G/NP0	Gray	402
Half Mini PCIe Module	Power Supply	Passive	Capacitor	18			Ceramic Multilayer - X5R/X7R	Brown	402
Half Mini PCIe Module	Power Supply	Passive	Capacitor	5			Ceramic Multilayer - X5R/X7R	Brown	201
Half Mini PCIe Module	Power Supply	Passive	Capacitor	13			Ceramic Multilayer - X5R/X7R	Brown	603
Half Mini PCIe Module	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	3			Coaxial Receptacle - Vertical, Subminiature, Gold Plated		SMD
Half Mini PCIe Module	Baseband / RF / PA	Passive	Crystal	1	TXC	7M Series	Crystal - 19.200MHz	T192, Mh9A	2.5x3.2 SMD
Half Mini PCIe Module	Power Supply	Passive	Crystal	1	Epson Toyocom	FC-135	Crystal - 32.768kHz	A140C	1.5x3.2 SMD
Half Mini PCIe Module	Baseband / RF / PA	Discrete Semi	Diode	2			Diode	5V	SOD923
Half Mini PCIe Module	Baseband / RF / PA	Passive	Filter	1	Murata	SAFEA942MFL0F00	Rx RF SAW Filter - GSM 900, 942.5MHz	Logo R, MZ	1.05x1.35 SMD
Half Mini PCIe Module	Baseband / RF / PA	Passive	Filter	1	Murata		RX RF SAW Filter - Dual-Band GSM	Logo e, SR	1.35x1.8 SMD
Half Mini PCIe Module	Baseband / RF / PA	Passive	Filter	1	Murata	SAFEA1G58FB0F00	RX RF SAW Filter - GPS/GLONASS, 1575.42/1602MHz	Logo g, DW	1.05x1.35 SMD
Half Mini PCIe Module	Baseband / RF / PA	Passive	Filter	1	Murata	SAFEA1G58KA0F00	RX RF SAW Filter - GPS/GLONASS, 1575.42/1602MHz	Logo g, D1	1.05x1.35 SMD
Half Mini PCIe Module	Baseband / RF / PA	Passive	Filter	1	Avago Technologies	ACMD-7410	Duplexer - CDMA 1900, 1850.48/1909.52MHz	AVAGO, A2FI132, 092623	SMD
Half Mini PCIe Module	Baseband / RF / PA	Passive	Filter	1	Murata	SAYFP897MCA0B00	Duplexer - WCDMA 900, 897.5/942.5MHz	Logo Fb, S2B	2x2.5 SMD
Half Mini PCIe Module	Baseband / RF / PA	Passive	Filter	1	Murata	SAYFP836MCA0F00	Duplexer - WCDMA 850, 836.5/881.5MHz	Logo wg, S00	2x2.5 SMD
Half Mini PCIe Module	Baseband / RF / PA	Passive	Filter	1	Epcos	B39212B7964P810	Duplexer - WCDMA 2100, 1950/2140MHz	EPCOS, 7964, JP87	2x2.5 SMD
Half Mini PCIe Module	Baseband / RF / PA	Integrated Circuit	Logic	1	Qualcomm	MDM6200	Baseband / RF Transceiver - GSM/WCDMA/HSPA+	QUALCOMM R, MDM6200, BN38PC, C1134007	BGA
Half Mini PCIe Module	Baseband / RF / PA	Integrated Circuit	Logic		Qualcomm	MDM6200	1x Die 1 - Baseband	Die Marking: HG11-VJ130
Half Mini PCIe Module	Baseband / RF / PA	Integrated Circuit	Logic		Qualcomm	MDM6200	1x Die 2 - RF Transceiver - Dual Mode, GSM/EDGE/EVDOrB/HSPA+, Multi-Band	Die Marking: HG11-VF535-220
Half Mini PCIe Module	Power Supply	Passive	Magnetic	4			Inductor - Wound Ferrite Core, Shielded		SMD
Half Mini PCIe Module	Baseband / RF / PA	Passive	Magnetic	1			Inductor - Ceramic Multilayer	1/2 Gray / White	201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Magnetic	2			Inductor - Ceramic Multilayer	1/2 Black / White	201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Magnetic	3			Inductor - Ceramic Multilayer	Blue w/ White Dot	201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Magnetic	21			Inductor - Ceramic Multilayer	1/2 Gray / White	201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Magnetic	22			Inductor - Ceramic Multilayer	Blue w/ White Dot	201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Magnetic	19			Inductor - Ceramic Multilayer	1/2 Gray / White	402
Half Mini PCIe Module	Baseband / RF / PA	Passive	Magnetic	3			Inductor - Ceramic Multilayer	1/2 Black / Green	402
Half Mini PCIe Module	Baseband / RF / PA	Passive	Magnetic	1			Ferrite Bead		402
Half Mini PCIe Module	Memory	Integrated Circuit	Memory	1	Toshiba Semiconductor	Y890A111222KA	MCP - 512Mb NAND Flash + 256Mb Mobile SDRAM	Logo CHINA, Y890A111222KA, ZX3581 1135KND	BGA
Half Mini PCIe Module	Memory	Integrated Circuit	Memory		Toshiba Semiconductor	Y890A111222KA	1x Die 1 - Toshiba 512Mb NAND Flash	Die Marking: Toshiba GWM2
Half Mini PCIe Module	Memory	Integrated Circuit	Memory		Toshiba Semiconductor	Y890A111222KA	1x Die 2 - Hynix H55S2562J 256Mb Mobile SDRAM	Die Marking: H55S2562J, DTC05AA
Half Mini PCIe Module	Mechanical / Electro-Mechanical	Module	Other	1	Chi Mei Communications Systems	ZOEDA-BB1-S9-17618	3G Half Mini PCIe Module - Quad-Band WCDMA/HSUPA/HSDPA, Quad-Band GSM/EDGE	CE0682 AD110301003, 003XYA110299, 003MWA110300, Barcodes, Sony P/N:1-489-770-31, S/N:ZOEDA-BB1-S9-17618, IMEI: 358459044116214, FCC ID: QDJZOE, Made in China Model: ZOE
Half Mini PCIe Module	Mechanical / Electro-Mechanical	Electro Mechanical	PCB	1	Nan Ya Pcb		10-Layer - FR4/RCF HDI, 3+4+3, Lead-Free, Halogen-Free	B1P-0116202-A010 Logo NM10 94V-0, M1011-D1 S8, 1138
Half Mini PCIe Module	Power Supply	Passive	Resistor	10			SMD Flat Chip		201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Resistor	2			SMD Flat Chip		201
Half Mini PCIe Module	Memory	Passive	Resistor	1			SMD Flat Chip		402
Half Mini PCIe Module	Baseband / RF / PA	Passive	Resistor	16			SMD Flat Chip		201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Resistor	1			SMD Flat Chip		402
Half Mini PCIe Module	Baseband / RF / PA	Passive	Resistor	23			SMD Flat Chip		201
Half Mini PCIe Module	Baseband / RF / PA	Passive	Resistor	1			SMD Flat Chip		402
Half Mini PCIe Module	Baseband / RF / PA	Module	RF	1			SAW Module	SWUA, D88, D136	SMD
Half Mini PCIe Module	Baseband / RF / PA	Discrete Semi	Transistor	1			Transistor	L8	SOT563
Half Mini PCIe Module	Baseband / RF / PA	Discrete Semi	Transistor	2			Transistor	N4	SOT723
Half Mini PCIe Module	Baseband / RF / PA	Discrete Semi	Transistor	1	Toshiba Semiconductor	SSM3J16FV	MOSFET - P-Channel, -20V, -100mA	DT	SOT723
Left Button PCB	Mechanical / Electro-Mechanical	Electro Mechanical	PCB	1	Honghengsheng Electronical Technology(Huaian)		2-Layer - FR4, Lead-Free, Halogen-Free	E253117, 11421, DS1, 94V-0, IRL-002, 1-884-529-21, >EP GW<, LF, HF
Left Button PCB, Bottom	I/O & Interface	Passive	Capacitor	2			Ceramic Multilayer - C0G/NP0	Violet	402
Left Button PCB, Bottom	I/O & Interface	Passive	Capacitor	5			Ceramic Multilayer - C0G/NP0	Violet	201
Left Button PCB, Bottom	I/O & Interface	Passive	Capacitor	5			Ceramic Multilayer - X5R/X7R	Brown	402
Left Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Ground Contact - Stamped / Formed Metal		SMD
Left Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Ground Contact - Stamped Metal, Gold Plated		SMD
Left Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	B1	SMD
Left Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	A8	SMD
Left Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	MXJ, A5	SMD
Left Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	2			Loudspeaker Contact - Stamped Metal, Gold Plated		SMD
Left Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Coaxial Receptacle - Vertical, Subminiature, Gold Plated		SMD
Left Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	2			Antenna Contact - Stamped / Formed Metal, Gold Plated		SMD
Left Button PCB, Bottom	I/O & Interface	Passive	Magnetic	2			Inductor - Ceramic Multilayer	1/2 Gray / White	402
Left Button PCB, Bottom	I/O & Interface	Passive	Resistor	3			SMD Flat Chip		402
Left Button PCB, Bottom	I/O & Interface	Passive	Resistor	1			SMD Flat Chip		402
Left Button PCB, Top	I/O & Interface	Passive	Capacitor	5			Ceramic Multilayer - X5R/X7R	Brown	402
Left Button PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	2			Ground Contact - Stamped / Formed Metal		SMD
Left Button PCB, Top	I/O & Interface	Optical Semi	LED	1			Blue, Right Angle		SMD
Left Button PCB, Top	I/O & Interface	Optical Semi	LED	1			Red, Right Angle		SMD
Left Button PCB, Top	I/O & Interface	Passive	Magnetic	2			Ferrite Bead		402
Left Button PCB, Top	I/O & Interface	Passive	Resistor	5			SMD Flat Chip		402
Main PCB	Mechanical / Electro-Mechanical	Electro Mechanical	PCB	1	UniMicron Technology		10-Layer - FR4/RCF HDI, 1+8+1, Lead-Free, Halogen-Free	HF LF, IRS-002, >EP GW<, 1-883-949, -11, 1143 10-01, 2V 94V-0 A7, UMT-KS
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Acoustics	1	Knowles Acoustics	SPQ2410HR5H-PD	Microphone Element - MEMS, w/ Maximum RF Protection	S582, 6073	SMD
Main PCB, Bottom	I/O & Interface	Passive	Capacitor	95			Ceramic Multilayer - X5R/X7R	Brown	201
Main PCB, Bottom	I/O & Interface	Passive	Capacitor	4			Ceramic Multilayer - C0G/NP0	Gray	201
Main PCB, Bottom	I/O & Interface	Passive	Capacitor	1			Ceramic Multilayer - C0G/NP0	Violet	402
Main PCB, Bottom	I/O & Interface	Passive	Capacitor	11			Ceramic Multilayer - C0G/NP0	Violet	201
Main PCB, Bottom	I/O & Interface	Passive	Capacitor	26			Ceramic Multilayer - X5R/X7R	Brown	603
Main PCB, Bottom	I/O & Interface	Passive	Capacitor	51			Ceramic Multilayer - X5R/X7R	Brown	402
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Ground Contact - Stamped Metal, Gold Plated		SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	4			Antenna Contact - Stamped / Formed Metal, Gold Plated		SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Ground Contact - Stamped Metal, Gold Plated		SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Coaxial Receptacle - Vertical, Subminiature, Gold Plated		SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1	Hirose		FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	HRS, J4, B1	SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1	Hirose		FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	HRS, D1, A3	SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1	Hirose		FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	HRS, D1, A6	SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	A5	SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			FFC / FPC - Right Angle, w/ Metal Housing & Locking Clip	B	SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1	Alps Electric		Memory Stick Micro (m2) Memory Card Slot - Push-Push, Right Angle, Gold Plated Contacts, w/ Metal Housing	ALPS, 11NA	SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1	Hirose		Board to Board - Receptacle, Gold Plated Contacts	HRS, B	SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Pin Header - Shrouded, Right Angle, Gold Plated Contacts		SMD
Main PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1	Foxconn		Mini PCI Express Card Edge - Right Angle, Gold Plated Contacts	1BFMA, FOXCONN	SMD
Main PCB, Bottom	I/O & Interface	Passive	Crystal	1	NDK	NX3225GA	Crystal - 27.000MHz	27.000, Logo :138	2.5x3.2 SMD
Main PCB, Bottom	I/O & Interface	Passive	Crystal	1	Epson Toyocom	FC-135	Crystal - 32.768kHz	A140C	1.5x3.2 SMD
Main PCB, Bottom	BT / WLAN	Passive	Filter	1			Filter - Ceramic, Bandpass	Gray w/ Black Dot	603
Main PCB, Bottom	Mechanical / Electro-Mechanical	Mechanical	Hardware	2			Standoff - Threaded Metal
Main PCB, Bottom	I/O & Interface	Integrated Circuit	Logic	1	Renesas		ASIC	C 2011, SCEI, 1141KM40L, E066D94100 (Die Marking: NEC Electronics, Corp 2009, 56, 0109)	BGA
Main PCB, Bottom	I/O & Interface	Integrated Circuit	Logic	1	Wolfson Micro	WM1803E	Audio Codec	Logo, WM1803E, 1BAKPMN	Flip Chip
Main PCB, Bottom	I/O & Interface	Integrated Circuit	Logic		Wolfson Micro	WM1803E	1x Die - Audio Codec	D1 D1
Main PCB, Bottom	I/O & Interface	Integrated Circuit	Logic	1	Toshiba Semiconductor	TC7WG126FK	Buffer - Dual, w/ 3-State Output	WG, 126	VSSOP
Main PCB, Bottom	I/O & Interface	Integrated Circuit	Logic	1	Texas Instruments	TS3A5018RSVR	Analog Switch - Quad, SPDT, 10 Ohm	ZUN, 19H	QFN
Main PCB, Bottom	I/O & Interface	Integrated Circuit	Logic	1	IDT		Clock Synthesizer	638, 139L, 67LG (Die Marking: 2006, 895-132, 2006, AT270, (M) IDT)	QFN
Main PCB, Bottom	BT / WLAN	Passive	Magnetic	2			Inductor - Ceramic Multilayer	1/2 Gray / White	402
Main PCB, Bottom	I/O & Interface	Passive	Magnetic	5			Ferrite Bead		603
Main PCB, Bottom	I/O & Interface	Passive	Magnetic	8			Ferrite Bead		402
Main PCB, Bottom	I/O & Interface	Passive	Magnetic	4			Ferrite Bead - Arrayx2		303
Main PCB, Bottom	I/O & Interface	Passive	Magnetic	1			Ferrite Bead - Arrayx2		404
Main PCB, Bottom	I/O & Interface	Integrated Circuit	MEMS	1	ST Microelectronics		Gyroscope - 3-Axis, Analog Output	3GA51H, 2135, MB9DP	LGA
Main PCB, Bottom	I/O & Interface	Integrated Circuit	MEMS		ST Microelectronics		Die 1 - Logic
Main PCB, Bottom	I/O & Interface	Integrated Circuit	MEMS		ST Microelectronics		Die 2 - MEMS	Die Marking: Logo 2010, V706A
Main PCB, Bottom	I/O & Interface	Integrated Circuit	MEMS	1	Kionix	KXTC9 Series	Accelerometer & Inclinometer - 3-Axis, Analog Output	KXTC9, 20763, 3811	LGA
Main PCB, Bottom	I/O & Interface	Integrated Circuit	MEMS	1	AKM Semiconductor	AKM8975B	Electronic Compass - 3-Axis, w/ Built-In ADC, 8-Bit Digital Output & Supplementary Substrate	8975C, D137L	Flip Chip
Main PCB, Bottom	BT / WLAN	Passive	Resistor	5			SMD Flat Chip		402
Main PCB, Bottom	I/O & Interface	Passive	Resistor	12			SMD Flat Chip		402
Main PCB, Bottom	I/O & Interface	Passive	Resistor	2			Precision SMD	Green	402
Main PCB, Bottom	I/O & Interface	Passive	Resistor	101			SMD Flat Chip		201
Main PCB, Bottom	I/O & Interface	Passive	Resistor	11			Precision SMD	Green	201
Main PCB, Bottom	I/O & Interface	Passive	Resistor	1			SMD Flat Chip		603
Main PCB, Bottom	I/O & Interface	Passive	Resistor	1			SMD Flat Chip		805
Main PCB, Bottom	I/O & Interface	Passive	Resistor	1			Precision SMD	Blue	402
Main PCB, Bottom	I/O & Interface	Passive	Resonator	1			Ceramic Resonator	80k	1.3x3.2 SMD
Main PCB, Top	Power Supply	Integrated Circuit	Analog	1	Fujitsu	MB44C026A	Power Management Module - Contains PMIC, & Ceramic Inductors	MB44C026A, 1139 J17, E1	BGA
Main PCB, Top	Power Supply	Integrated Circuit	Analog		Fujitsu	MB44C026A	1x Die - Power Management IC	MB44C026
Main PCB, Top	Power Supply	Integrated Circuit	Analog	1	ST Microelectronics	STOD03ATPUR	DC-DC Converter - Dual, Step-Up / Inverting, 4.6V, 200mA, 1.5MHz, for Powering AMOLED Display	Y136, D03A, S	DFN
Main PCB, Top	Power Supply	Integrated Circuit	Analog	1	Intersil	ISL9110IRTAZ	Regulator - Buck-Boost Switching, Adjustable, 1.2A, 2.5MHz	Logo, GAUA, HG5K	DFN
Main PCB, Top	Power Supply	Integrated Circuit	Analog	1	Texas Instruments	SN99057A5	Power Management IC	99057, TI 19K, ARY6, G4	QFN
Main PCB, Top	Power Supply	Integrated Circuit	Analog		Texas Instruments	SN99057A5	1x Die - Power Management IC	SN99057A5, Logo, TI, 2010
Main PCB, Top	Power Supply	Integrated Circuit	Analog	1	Texas Instruments	bq27520YZF	Battery Fuel Gauge - System-Side, w/ Integrated LDO, for Single Li-Ion Cell	TI 18A123I, SN27520S1 (Die Marking: BDQ035, M 2009)	Flip Chip
Main PCB, Top	BT / WLAN	Passive	Capacitor	1			Ceramic Multilayer - X5R/X7R	Brown	805
Main PCB, Top	BT / WLAN	Passive	Capacitor	2			Ceramic Multilayer - X5R/X7R	Brown	603
Main PCB, Top	BT / WLAN	Passive	Capacitor	1			Ceramic Multilayer - X5R/X7R	Brown	402
Main PCB, Top	BT / WLAN	Passive	Capacitor	4			Ceramic Multilayer - X5R/X7R	Brown	201
Main PCB, Top	Power Supply	Passive	Capacitor	2			Ceramic Multilayer - C0G/NP0	Violet	402
Main PCB, Top	I/O & Interface	Passive	Capacitor	1			Ceramic Multilayer - C0G/NP0	Violet	201
Main PCB, Top	I/O & Interface	Passive	Capacitor	13			Ceramic Multilayer - C0G/NP0	Gray	201
Main PCB, Top	I/O & Interface	Passive	Capacitor	1			Ceramic Multilayer - X5R/X7R	Brown	805
Main PCB, Top	I/O & Interface	Passive	Capacitor	2			Ceramic Multilayer - X5R/X7R	Brown	603
Main PCB, Top	I/O & Interface	Passive	Capacitor	7			Ceramic Multilayer - X5R/X7R	Brown	402
Main PCB, Top	I/O & Interface	Passive	Capacitor	11			Ceramic Multilayer - X5R/X7R	Brown	201
Main PCB, Top	Memory	Passive	Capacitor	4			Ceramic Multilayer - X5R/X7R	Brown	603
Main PCB, Top	Memory	Passive	Capacitor	2			Ceramic Multilayer - X5R/X7R	Brown	201
Main PCB, Top	Power Supply	Passive	Capacitor	1	NEC Tokin	PSLB30J476M	Tantalum Conductive Polymer - Encapsulated, 6.3V, 47uF, Low ESR	NEJ, jS7	594951
Main PCB, Top	Power Supply	Passive	Capacitor	23			Ceramic Multilayer - X5R/X7R	Brown	805
Main PCB, Top	Power Supply	Passive	Capacitor	14			Ceramic Multilayer - X5R/X7R	Brown	603
Main PCB, Top	Power Supply	Passive	Capacitor	21			Ceramic Multilayer - X5R/X7R	Brown	402
Main PCB, Top	Power Supply	Passive	Capacitor	19			Ceramic Multilayer - X5R/X7R	Brown	201
Main PCB, Top	Power Supply	Passive	Capacitor	1			Ceramic Multilayer - C0G/NP0	Gray	201
Main PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			FFC / FPC - Right Angle, w/ Metal Housing & Locking Clip		SMD
Main PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Ground Contact - Stamped / Formed Metal		SMD
Main PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1	Hirose		Board to Board - Receptacle, Gold Plated Contacts	HRS, C	SMD
Main PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Jack - Micro USB, Right Angle, w/ Plastic Housing		SMD
Main PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			PS Vita Card Slot - Push-Push, Right Angle, w/ Metal Housing	A1NF	SMD
Main PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Jack - Audio, 3.5mm, Right Angle, Gold Plated Contacts in Plastic Housing	1BCB, 3	Thru Hole
Main PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Main I/O & Power - Right Angle, w/ Metal Housing		SMD
Main PCB, Top	Power Supply	Discrete Semi	Diode	1	Rohm	RB161VA-20	Schottky Barrier - 20V, 1A	X	SOD323
Main PCB, Top	I/O & Interface	Optical Semi	LED	1			Amber		402
Main PCB, Top	I/O & Interface	Integrated Circuit	Logic	1	ST Microelectronics		I/O Controller	32P10SOD, GK0MU 93, CHN 140, Logo e2 Z (Die Marking: T420A, ST 2009)	BGA
Main PCB, Top	I/O & Interface	Integrated Circuit	Logic	1	Texas Instruments	TS3USB31RSER	USB Switch - USB 2.0, 1-Port, w/ Single Enable	L9	QFN
Main PCB, Top	Processing	Integrated Circuit	Logic	1	Sony	CXD5315GG	CPU - Quad-Core, ARM Cortex-A9 + 4Gb Mobile DDR2	Sony Computer, Entertainment Inc., CXD5315GG, C 2011 SCEI, 1143HAF, 712556	BGA
Main PCB, Top	Processing	Integrated Circuit	Logic		Sony	CXD5315GG	1x Die 2 - 1Gb Samsung GDDR5 Assumed	Die marking: 1G-E-WIDE Samsung
Main PCB, Top	Processing	Integrated Circuit	Logic		Sony	CXD5315GG	1x Die 1 - Toshiba Logic - Core Processor Assumed	Die Marking: T9ML7, Toshiba, LP1X01)
Main PCB, Top	Processing	Integrated Circuit	Logic		Sony	CXD5315GG	2x Die 3 - Samsung K4P2G324EC 2Gb Mobile DDR2	(Die Marking: 200912, M, C, SAMSUNG, K4P2G324EC)
Main PCB, Top	I/O & Interface	Passive	Magnetic	1			Ferrite Bead - Arrayx2		404
Main PCB, Top	I/O & Interface	Passive	Magnetic	4			Ferrite Bead		402
Main PCB, Top	I/O & Interface	Passive	Magnetic	1			Ferrite Bead		603
Main PCB, Top	Power Supply	Passive	Magnetic	1			Inductor - Wound Ferrite Core, Shielded	2R2	SMD
Main PCB, Top	Power Supply	Passive	Magnetic	3			Ferrite Bead		1008
Main PCB, Top	Power Supply	Passive	Magnetic	10			Ferrite Bead		603
Main PCB, Top	Processing	Passive	Magnetic	1			Ferrite Bead - Arrayx2		404
Main PCB, Top	Processing	Passive	Magnetic	3			Ferrite Bead - Arrayx2		303
Main PCB, Top	Processing	Passive	Magnetic	5			Ferrite Bead		402
Main PCB, Top	Memory	Integrated Circuit	Memory	1	Toshiba Semiconductor	THGBM3G5D1FBAIE	Flash - eMMC NAND, 4GB, MLC	TOSHIBA, THGBM3G5D1FBAIE, GT4164, TAIWAN, 11409AE	BGA
Main PCB, Top	BT / WLAN	Passive	Resistor	2			SMD Flat Chip		402
Main PCB, Top	BT / WLAN	Passive	Resistor	1			SMD Flat Chip		201
Main PCB, Top	BT / WLAN	Passive	Resistor	5			Precision SMD	Green	201
Main PCB, Top	I/O & Interface	Passive	Resistor	5			Precision SMD	Green	201
Main PCB, Top	I/O & Interface	Passive	Resistor	44			SMD Flat Chip		201
Main PCB, Top	I/O & Interface	Passive	Resistor	13			SMD Flat Chip		402
Main PCB, Top	Power Supply	Passive	Resistor	15			SMD Flat Chip		402
Main PCB, Top	I/O & Interface	Passive	Resistor	4			SMD Flat Chip		603
Main PCB, Top	Memory	Passive	Resistor	2			SMD Flat Chip		201
Main PCB, Top	Power Supply	Passive	Resistor	1			Precision SMD	5L00	1206
Main PCB, Top	Power Supply	Passive	Resistor	2			SMD Flat Chip		603
Main PCB, Top	Power Supply	Passive	Resistor	5			Precision SMD	Green	402
Main PCB, Top	Power Supply	Passive	Resistor	12			SMD Flat Chip		201
Main PCB, Top	Power Supply	Passive	Resistor	3			Precision SMD	Green	201
Main PCB, Top	Processing	Passive	Resistor	56			SMD Flat Chip		201
Main PCB, Top	Processing	Passive	Resistor	7			Precision SMD	Green	201
Main PCB, Top	Processing	Passive	Resistor	3			Precision SMD	Green	402
Main PCB, Top	I/O & Interface	Passive	Resonator	1			Ceramic Resonator	Jk	1.5x2 SMD
Main PCB, Top	Power Supply	Discrete Semi	Transistor	2			Transistor	TA	SOT363 Wide
Main PCB, Top	Power Supply	Discrete Semi	Transistor	1			Transistor	T4	SOT363 Wide
Main PCB, Top	I/O & Interface	Discrete Semi	Transistor	5	Rohm	DTC023JM	Bipolar - NPN, 50V, 100mA, w/ Built-In Resistors	46	SOT723
Main PCB, Top	I/O & Interface	Discrete Semi	Transistor	2	Toshiba Semiconductor	SSM3J16FV	MOSFET - P-Channel, -20V, -100mA	DT	SOT723
Main PCB, Top	I/O & Interface	Discrete Semi	Transistor	1	Rohm	DTA023JM	Bipolar - PNP, -50V, -100mA, w/ Built-In Resistors	36	SOT723
Main PCB, Top	Power Supply	Discrete Semi	Transistor	1	Rohm	DTA023JM	Bipolar - PNP, -50V, -100mA, w/ Built-In Resistors	36	SOT723
Main PCB, Top	Power Supply	Discrete Semi	Transistor	1	Rohm	DTC023JM	Bipolar - NPN, 50V, 100mA, w/ Built-In Resistors	46	SOT723
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Integrated Circuit	Analog	1			Analog IC	2568, 140Q	DFN
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Integrated Circuit	Analog	1	Renesas	uPG2406T6R-E2-A	RF Switch- SPDT, L/S Band	G9	DFN
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Passive	Capacitor	1			Ceramic Multilayer - X5R/X7R	Brown	402
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Passive	Capacitor	9			Ceramic Multilayer - X5R/X7R	Brown	201
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Passive	Capacitor	5			Ceramic Multilayer - C0G/NP0	Violet	201
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Passive	Capacitor	8			Ceramic Multilayer - C0G/NP0	Gray	201
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Module	Combo (BT/WiFi…)	1			Bluetooth / FM / WLAN Module - 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter, Contains Marvell 88W8787S-BKB2 SoC	WYSBMVDXA-1S, 1NF3 V	SMD
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Passive	Crystal	1	Epson Toyocom	FA-128	Crystal - 26.000MHz	2600P, E17RA	1.6x2 SMD
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Passive	Filter	1			Filter - Ceramic, Bandpass	Pink w/ Gray Dot	603
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Integrated Circuit	Logic	1	Marvell	88W8787S-BKB2	Bluetooth / FM / WLAN - SoC, 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter	Logo R, 88W8787S-BKB2, PCM2170.3, 1137 B0P, TW E	BGA
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Integrated Circuit	Logic				1x Die - Bluetooth / FM / WLAN - SoC, 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter	Logo 2010, MARVELL, 19C, AP0
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Passive	Magnetic	11			Inductor - Ceramic Multilayer	1/2 Gray / White	201
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Integrated Circuit	Memory	1	Seiko	S-24C08CI-I8T1U3	EEPROM - 8Kb, 2-Wire Serial	C08C, 3A7, 408	SMD
Main PCB, Top, Bluetooth / FM / WLAN Module	BT / WLAN	Passive	Resistor	1			SMD Flat Chip		201
Primary Camera Module	Camera	Camera	Camera	1			Primary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens
Primary Camera Module	I/O & Interface	Passive	Capacitor	5			Ceramic Multilayer - X5R/X7R	Brown	201
Primary Camera Module	I/O & Interface	Optical Semi	Image Sensor	1	OmniVision		Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area	OV2B1AG (M)
Right Button PCB	Mechanical / Electro-Mechanical	Electro Mechanical	PCB	1	Honghengsheng Electronical Technology(Huaian)		2-Layer - FR4, Lead-Free, Halogen-Free	E253117, DS194V-0, IRR-002, 1-884-528-21, >EP GW<, LF, HF
Right Button PCB, Bottom	I/O & Interface	Passive	Capacitor	8			Ceramic Multilayer - X5R/X7R	Brown	402
Right Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	B6	SMD
Right Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	A8	SMD
Right Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	MXJ, A8	SMD
Right Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	2			Loudspeaker Contact - Stamped Metal, Gold Plated		SMD
Right Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Coaxial Receptacle - Vertical, Subminiature, Gold Plated		SMD
Right Button PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Antenna Contact - Stamped / Formed Metal, Gold Plated		SMD
Right Button PCB, Bottom	I/O & Interface	Passive	Magnetic	1			Inductor - Ceramic Multilayer	1/2 Gray / White	402
Right Button PCB, Bottom	I/O & Interface	Passive	Resistor	2			SMD Flat Chip		402
Right Button PCB, Bottom	I/O & Interface	Passive	Resistor	4			SMD Flat Chip		402
Right Button PCB, Top	I/O & Interface	Passive	Capacitor	3			Ceramic Multilayer - X5R/X7R	Brown	402
Right Button PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Ground Contact - Stamped / Formed Metal, Gold Plated		SMD
Right Button PCB, Top	I/O & Interface	Passive	Resistor	4			SMD Flat Chip		402
Sencondary Camera Module	Camera	Camera	Camera	1			Secondary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens
Sencondary Camera Module	I/O & Interface	Passive	Capacitor	5			Ceramic Multilayer - X5R/X7R	Brown	201
Sencondary Camera Module	I/O & Interface	Optical Semi	Image Sensor	1	OmniVision		Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area	OV2B1AG (M)
SIM Card PCB	Mechanical / Electro-Mechanical	Electro Mechanical	PCB	1	Honghengsheng Electronical Technology(Huaian)		2-Layer - FR4, Lead-Free, Halogen-Free	IRC-002, 1-884-530-21, B, 11403, E253117, LF, HF, DS194V-0, >EP GW<
SIM Card PCB, Bottom	I/O & Interface	Passive	Capacitor	1			Ceramic Multilayer - X5R/X7R	Brown	402
SIM Card PCB, Bottom	I/O & Interface	Passive	Capacitor	1			Ceramic Multilayer - X5R/X7R	Brown	201
SIM Card PCB, Bottom	I/O & Interface	Passive	Capacitor	2			Ceramic Multilayer - C0G/NP0	Gray	201
SIM Card PCB, Bottom	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	MXJ, A6	SMD
SIM Card PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			SIM Card - 6 Gold-Plated Contacts in Plastic Carrier, w/ Metal Housing	1BG2	SMD
SIM Card PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1			Ground Contact - Stamped Metal, Gold Plated		SMD
Touchpad Controller PCB	Mechanical / Electro-Mechanical	Electro Mechanical	PCB	1			2-Layer - Flex Kapton, w/ Stiffener	Logo F, M9Z, 4
Touchpad Controller PCB, Top	I/O & Interface	Passive	Capacitor	3			Ceramic Multilayer - X5R/X7R	Brown	402
Touchpad Controller PCB, Top	I/O & Interface	Passive	Capacitor	3			Ceramic Multilayer - X5R/X7R	Brown	201
Touchpad Controller PCB, Top	I/O & Interface	Passive	Capacitor	4			SMD Flat Chip		201
Touchpad Controller PCB, Top	Mechanical / Electro-Mechanical	Electro Mechanical	Connector	1	Hirose		Board to Board - Plug, Gold Plated Contacts	HRS, B	SMD
Touchpad Controller PCB, Top	I/O & Interface	Integrated Circuit	Logic	1	Atmel	mXT224	Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface	ATMEL, MXT224, C070S541, F35019.1	BGA
Touchpad Controller PCB, Top	I/O & Interface	Integrated Circuit	Logic		Atmel	mXT224	1x Die - Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface	Logo, AT 25968, AVR, 2010
Touchpad Controller PCB, Top	Mechanical / Electro-Mechanical	Mechanical	Metals	1			Stiffener - Stamped Metal, w/ PSA
Touchscreen PCB	I/O & Interface	Passive	Capacitor	3			Ceramic Multilayer - X5R/X7R	Brown	402
Touchscreen PCB	I/O & Interface	Passive	Capacitor	3			Ceramic Multilayer - X5R/X7R	Brown	201
Touchscreen PCB	I/O & Interface	Passive	Resistor	3			SMD Flat Chip		201