Editing Components

[[Category:Hardware]]<noinclude>[[Category:Main]]</noinclude>

<div style="float:right">[[File:PSVita_teardown_-_overview.jpg|200px|thumb|left|PS VITA teardown - overview]]</div>
== Hardware Analysis ==

=== PCH-1000 ===

Report by [http://www.electronicproducts.com/Sony_PlayStation_Vita_PCH-1100_Handheld_Gaming_Console-whatsinside_text-129.aspx www.electronicproducts.com] via [https://technology.ihs.com/345104/teardown-analysis-sony-playstation-vita-pch-1100-handheld-gaming-console IHS technology]

{| class="wikitable sortable mw-datatable" style="text-align: center;border:3px solid #123AAA;"																			
|-																			
!PARENT COMPONENT																			
!CHILD COMPONENT																			
!PARENT CATEGORY																			
!CHILD CATEGORY																			
!QTY																			
!MANUFACTURER																			
!PART#																			
!GENERAL DESCRIPTION																			
!SPECIFIC DESCRIPTION																			
!TYPE
!PHOTOS	
!NOTES																		
|-
|	Display / Touchscreen Module	||	Display & Touch	||	Display	||	OLED	||	1	||	Samsung Mobile Display	||	AMS495QA01	||	OLED Display Unit - 5" Diagonal, 16M Color AMOLED, 960 x 544 Pixels, 115um x 115um Pixel Size, 110mm x 62.5mm Viewable Area	||	Logo, AMS495QA01 REV14.2, 2011.07.20, S111101123451	||		||		|| See [[Display]]
|-																						
|	Display PCB	||	I/O & Interface	||	Passive	||	Capacitor	||	24	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Display PCB	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||	Hirose	||		||	Board to Board - Plug, Gold Plated Contacts	||	HRS, 2U	||	SMD	||		||
|-																						
|	Display PCB	||	I/O & Interface	||	Discrete Semi	||	Diode	||	1	||	Rohm	||	RB520S-30	||	Schottky Barrier - 30V, 200mA	||	B	||	SOD523	||		||
|-																						
|	Display PCB	||	I/O & Interface	||	Passive	||	Magnetic	||	3	||		||		||	Ferrite Bead - Arrayx2	||		||	303	||		||
|-																						
|	Display PCB	||	I/O & Interface	||	Passive	||	Resistor	||	6	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Acoustics	||	2	||		||		||	Loudspeaker - w/ 2 Gold Plated Contacts & Metal Shielding	||	J02, q145	||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Antenna	||	1	||		||		||	Internal B - Etched Copper On Flexible Substrate, w/ PSA	||	29058121 D1	||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Antenna	||	1	||		||		||	GPS - Etched Copper On Flexible Substrate, w/ PSA	||	29058109.02, 11465B4.0	||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Antenna	||	1	||		||		||	Internal A - Etched Copper On Flexible Substrate, Painted, w/ PSA	||	29062968 P5 WK41	||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Antenna	||	1	||		||		||	WLAN / Bluetooth - Etched Copper On Flexible Substrate, Painted, w/ PSA	||	29062934 P5 WK41	||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Hardware	||	3	||		||		||	Fastener - Machine Screw, M1.6 x 4.5mm, Philips Flat Head, Painted	||		||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Hardware	||	15	||		||		||	Fastener - Machine Screw, M1.6 x 5mm, Philips Flat Head, Painted	||		||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Hardware	||	3	||		||		||	Fastener - Machine Screw, M1.6 x 5.4mm, Philips Flat Head, Painted	||		||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Hardware	||	1	||		||		||	Fastener - Machine Screw, M1.6 x 5.4mm, Philips Flat Head	||		||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Hardware	||	2	||		||		||	Fastener - Machine Screw, M1.6 x 4.6mm, Hex Flat Head	||		||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Hardware	||	5	||		||		||	Fastener - Machine Screw, M1.6 x 6.4mm, Philips Flat Head, Black Oxide Finish	||		||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Metals	||	1	||		||		||	Mounting Tab - Stamped / Formed Aluminum	||	L 2	||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Metals	||	1	||		||		||	Mounting Tab - Stamped / Formed Aluminum	||	M 2	||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Metals	||	1	||		||		||	Mounting Tab - Stamped / Formed Aluminum	||	1 R	||		||		||
|-																						
|	Enclosure, Main	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Metals	||	1	||		||		||	Mounting Tab - Stamped / Formed Metal	||	3	||		||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Integrated Circuit	||	Analog	||	1	||	Sony	||	CXM3555ER	||	Antenna Switch - SP10T, w/ Integrated Filters & Compatible Decoder	||	M3555, AS1V, 133	||	QFN	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Integrated Circuit	||	Analog	||	1	||		||		||	LNA - GPS	||	311H	||	SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Integrated Circuit	||	Analog	||	1	||	Avago Technologies	||	ACPM-5005	||	PAM - WCDMA / HSPA+ 850, 815-849MHz	||	A5005, K1128, ODF144	||	SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Integrated Circuit	||	Analog	||	1	||	Avago Technologies	||	ACPM-5002	||	PAM - WCDMA 1900, 1850-1915MHz	||	A5002, K1127, ODD081	||	SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Integrated Circuit	||	Analog	||	1	||	Avago Technologies	||	ACPM-5008	||	PAM - WCDMA / HSPA+ 900, 897.5MHz	||	A5008, K1132, ODG015	||	SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Integrated Circuit	||	Analog	||	1	||	Avago Technologies	||	ACPM-5001	||	PAM - WCDMA / HSPA+ 2100, 1950MHz	||	A5001, KI127, ODC061	||	SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Integrated Circuit	||	Analog	||	1	||	Avago Technologies	||	ACPM-7868	||	PAM - Quad-Band GSM / EDGE	||	AVAGO, ACPM-7868, K1128, DL142	||	SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Power Supply	||	Integrated Circuit	||	Analog	||		||	Qualcomm	||	PM8028	||	1x Die - Power Management IC	||	HG11-VK495-200	||		|| [[File:PM8028_HG11-VK495-200_diemrk.jpg|50px]]		||
|-																						
|	Half Mini PCIe Module	||	Power Supply	||	Integrated Circuit	||	Analog	||	1	||	Qualcomm	||	PM8028	||	Power Management IC	||	QUALCOMM, PM8028, A10618.1, F11330B4	||	BGA	||		||
|-																						
|	Half Mini PCIe Module	||	Power Supply	||	Passive	||	Capacitor	||	4	||		||		||	Ceramic Multilayer - C0G/NP0	||	Gray	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Capacitor	||	4	||		||		||	Ceramic Multilayer - C0G/NP0	||	Violet	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - C0G/NP0	||	Gray	||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Memory	||	Passive	||	Capacitor	||	8	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Memory	||	Passive	||	Capacitor	||	2	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Capacitor	||	5	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	603	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Capacitor	||	4	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Capacitor	||	53	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Capacitor	||	39	||		||		||	Ceramic Multilayer - C0G/NP0	||	Violet	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Capacitor	||	15	||		||		||	Ceramic Multilayer - C0G/NP0	||	Gray	||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Power Supply	||	Passive	||	Capacitor	||	18	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Power Supply	||	Passive	||	Capacitor	||	5	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Power Supply	||	Passive	||	Capacitor	||	13	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	603	||		||
|-																						
|	Half Mini PCIe Module	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	3	||		||		||	Coaxial Receptacle - Vertical, Subminiature, Gold Plated	||		||	SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Crystal	||	1	||	TXC	||	7M Series	||	Crystal - 19.200MHz	||	T192, Mh9A	||	2.5x3.2 SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Power Supply	||	Passive	||	Crystal	||	1	||	Epson Toyocom	||	FC-135	||	Crystal - 32.768kHz	||	A140C	||	1.5x3.2 SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Discrete Semi	||	Diode	||	2	||		||		||	Diode	||	5V	||	SOD923	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Filter	||	1	||	Murata	||	SAFEA942MFL0F00	||	Rx RF SAW Filter - GSM 900, 942.5MHz	||	Logo R, MZ	||	1.05x1.35 SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Filter	||	1	||	Murata	||		||	RX RF SAW Filter - Dual-Band GSM	||	Logo e, SR	||	1.35x1.8 SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Filter	||	1	||	Murata	||	SAFEA1G58FB0F00	||	RX RF SAW Filter - GPS/GLONASS, 1575.42/1602MHz	||	Logo g, DW	||	1.05x1.35 SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Filter	||	1	||	Murata	||	SAFEA1G58KA0F00	||	RX RF SAW Filter - GPS/GLONASS, 1575.42/1602MHz	||	Logo g, D1	||	1.05x1.35 SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Filter	||	1	||	Avago Technologies	||	ACMD-7410	||	Duplexer - CDMA 1900, 1850.48/1909.52MHz	||	AVAGO, A2FI132, 092623	||	SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Filter	||	1	||	Murata	||	SAYFP897MCA0B00	||	Duplexer - WCDMA 900, 897.5/942.5MHz	||	Logo Fb, S2B	||	2x2.5 SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Filter	||	1	||	Murata	||	SAYFP836MCA0F00	||	Duplexer - WCDMA 850, 836.5/881.5MHz	||	Logo wg, S00	||	2x2.5 SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Filter	||	1	||	Epcos	||	B39212B7964P810	||	Duplexer - WCDMA 2100, 1950/2140MHz	||	EPCOS, 7964, JP87	||	2x2.5 SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Integrated Circuit	||	Logic	||	1	||	Qualcomm	||	MDM6200	||	Baseband / RF Transceiver - GSM/WCDMA/HSPA+	||	QUALCOMM R, MDM6200, BN38PC, C1134007	||	BGA	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Integrated Circuit	||	Logic	||		||	Qualcomm	||	MDM6200	||	1x Die 1 - Baseband	||	Die Marking: HG11-VJ130	||		||	[[File:MDM6600_HG11-VJ130_diemrk1.jpg|50px]] [[File:MDM6600_HG11-VJ130_diemrk2.jpg|50px]]		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Integrated Circuit	||	Logic	||		||	Qualcomm	||	MDM6200	||	1x Die 2 - RF Transceiver - Dual Mode, GSM/EDGE/EVDOrB/HSPA+, Multi-Band	||	Die Marking: HG11-VF535-220	||		||	[[File:MDM6600_HG11-VF535-220_diemrk.jpg|50px]]	||
|-																						
|	Half Mini PCIe Module	||	Power Supply	||	Passive	||	Magnetic	||	4	||		||		||	Inductor - Wound Ferrite Core, Shielded	||		||	SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Magnetic	||	1	||		||		||	Inductor - Ceramic Multilayer	||	1/2 Gray / White	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Magnetic	||	2	||		||		||	Inductor - Ceramic Multilayer	||	1/2 Black / White	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Magnetic	||	3	||		||		||	Inductor - Ceramic Multilayer	||	Blue w/ White Dot	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Magnetic	||	21	||		||		||	Inductor - Ceramic Multilayer	||	1/2 Gray / White	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Magnetic	||	22	||		||		||	Inductor - Ceramic Multilayer	||	Blue w/ White Dot	||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Magnetic	||	19	||		||		||	Inductor - Ceramic Multilayer	||	1/2 Gray / White	||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Magnetic	||	3	||		||		||	Inductor - Ceramic Multilayer	||	1/2 Black / Green	||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Magnetic	||	1	||		||		||	Ferrite Bead	||		||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Memory	||	Integrated Circuit	||	Memory	||	1	||	Toshiba Semiconductor	||	Y890A111222KA	||	MCP - 512Mb NAND Flash + 256Mb Mobile SDRAM	||	Logo CHINA, Y890A111222KA, ZX3581 1135KND	||	BGA	||		||
|-																						
|	Half Mini PCIe Module	||	Memory	||	Integrated Circuit	||	Memory	||		||	Toshiba Semiconductor	||	Y890A111222KA	||	1x Die 1 - Toshiba 512Mb NAND Flash	||	Die Marking: Toshiba GWM2	||		||	[[File:890A111222_GWM2_diemrk.jpg|50px]]	||
|-																						
|	Half Mini PCIe Module	||	Memory	||	Integrated Circuit	||	Memory	||		||	Toshiba Semiconductor	||	Y890A111222KA	||	1x Die 2 - Hynix H55S2562J 256Mb Mobile SDRAM	||	Die Marking: H55S2562J, DTC05AA	(see picture) ||		||	[[File:890A111222_H55S2562J_diemrk1.jpg|50px]] [[File:890A111222_H55S2562J_diemrk2.jpg|50px]]	||
|-																						
|	Half Mini PCIe Module	||	Mechanical / Electro-Mechanical	||	Module	||	Other	||	1	||	Chi Mei Communications Systems	||	ZOEDA-BB1-S9-17618	||	3G Half Mini PCIe Module - Quad-Band WCDMA/HSUPA/HSDPA, Quad-Band GSM/EDGE	||	CE0682 AD110301003, 003XYA110299, 003MWA110300, Barcodes, Sony P/N:1-489-770-31, S/N:ZOEDA-BB1-S9-17618, IMEI: 358459044116214, FCC ID: QDJZOE, Made in China Model: ZOE	||		||	[[File:Wireless-card-ZOE-MP-EMI-shields.jpg|50px]]	|| See [[Wireless_communications]]
|-																						
|	Half Mini PCIe Module	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	PCB	||	1	||	Nan Ya Pcb	||		||	10-Layer - FR4/RCF HDI, 3+4+3, Lead-Free, Halogen-Free	||	B1P-0116202-A010 Logo NM10 94V-0, M1011-D1 S8, 1138	||		||		||
|-																						
|	Half Mini PCIe Module	||	Power Supply	||	Passive	||	Resistor	||	10	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Resistor	||	2	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Memory	||	Passive	||	Resistor	||	1	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Resistor	||	16	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Resistor	||	1	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Resistor	||	23	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Passive	||	Resistor	||	1	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Module	||	RF	||	1	||		||		||	SAW Module	||	SWUA, D88, D136	||	SMD	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Discrete Semi	||	Transistor	||	1	||		||		||	Transistor	||	L8	||	SOT563	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Discrete Semi	||	Transistor	||	2	||		||		||	Transistor	||	N4	||	SOT723	||		||
|-																						
|	Half Mini PCIe Module	||	Baseband / RF / PA	||	Discrete Semi	||	Transistor	||	1	||	Toshiba Semiconductor	||	SSM3J16FV	||	MOSFET - P-Channel, -20V, -100mA	||	DT	||	SOT723	||		||   [http://www.toshiba.com/taec/components2/Datasheet_Sync/201102/DST_SSM3J16FV-TDE_EN_11115.pdf Datasheet] 
|-																						
|	Left Button PCB	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	PCB	||	1	||	Honghengsheng Electronical Technology(Huaian)	||		||	2-Layer - FR4, Lead-Free, Halogen-Free	||	E253117, 11421, DS1, 94V-0, IRL-002, 1-884-529-21, >EP GW<, LF, HF	||		||		||
|-																						
|	Left Button PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	2	||		||		||	Ceramic Multilayer - C0G/NP0	||	Violet	||	402	||		||
|-																						
|	Left Button PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	5	||		||		||	Ceramic Multilayer - C0G/NP0	||	Violet	||	201	||		||
|-																						
|	Left Button PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	5	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Left Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Ground Contact - Stamped / Formed Metal	||		||	SMD	||		||
|-																						
|	Left Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Ground Contact - Stamped Metal, Gold Plated	||		||	SMD	||		||
|-																						
|	Left Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	B1	||	SMD	||		||
|-																						
|	Left Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	A8	||	SMD	||		||
|-																						
|	Left Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	MXJ, A5	||	SMD	||		||
|-																						
|	Left Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	2	||		||		||	Loudspeaker Contact - Stamped Metal, Gold Plated	||		||	SMD	||		||
|-																						
|	Left Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Coaxial Receptacle - Vertical, Subminiature, Gold Plated	||		||	SMD	||		||
|-																						
|	Left Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	2	||		||		||	Antenna Contact - Stamped / Formed Metal, Gold Plated	||		||	SMD	||		||
|-																						
|	Left Button PCB, Bottom	||	I/O & Interface	||	Passive	||	Magnetic	||	2	||		||		||	Inductor - Ceramic Multilayer	||	1/2 Gray / White	||	402	||		||
|-																						
|	Left Button PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	3	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Left Button PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	1	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Left Button PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	5	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Left Button PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	2	||		||		||	Ground Contact - Stamped / Formed Metal	||		||	SMD	||		||
|-																						
|	Left Button PCB, Top	||	I/O & Interface	||	Optical Semi	||	LED	||	1	||		||		||	Blue, Right Angle	||		||	SMD	||		||
|-																						
|	Left Button PCB, Top	||	I/O & Interface	||	Optical Semi	||	LED	||	1	||		||		||	Red, Right Angle	||		||	SMD	||		||
|-																						
|	Left Button PCB, Top	||	I/O & Interface	||	Passive	||	Magnetic	||	2	||		||		||	Ferrite Bead	||		||	402	||		||
|-																						
|	Left Button PCB, Top	||	I/O & Interface	||	Passive	||	Resistor	||	5	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Main PCB	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	PCB	||	1	||	UniMicron Technology	||		||	10-Layer - FR4/RCF HDI, 1+8+1, Lead-Free, Halogen-Free	||	HF LF, IRS-002, >EP GW<, 1-883-949, -11, 1143 10-01, 2V 94V-0 A7, UMT-KS	||		||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Acoustics	||	1	||	Knowles Acoustics	||	SPQ2410HR5H-PD	||	Microphone Element - MEMS, w/ Maximum RF Protection	||	S582, 6073	||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	95	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	4	||		||		||	Ceramic Multilayer - C0G/NP0	||	Gray	||	201	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - C0G/NP0	||	Violet	||	402	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	11	||		||		||	Ceramic Multilayer - C0G/NP0	||	Violet	||	201	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	26	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	603	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	51	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Ground Contact - Stamped Metal, Gold Plated	||		||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	4	||		||		||	Antenna Contact - Stamped / Formed Metal, Gold Plated	||		||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Ground Contact - Stamped Metal, Gold Plated	||		||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Coaxial Receptacle - Vertical, Subminiature, Gold Plated	||		||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||	Hirose	||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	HRS, J4, B1	||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||	Hirose	||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	HRS, D1, A3	||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||	Hirose	||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	HRS, D1, A6	||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	A5	||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	FFC / FPC - Right Angle, w/ Metal Housing & Locking Clip	||	B	||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||	Alps Electric	||		||	Memory Stick Micro (m2) Memory Card Slot - Push-Push, Right Angle, Gold Plated Contacts, w/ Metal Housing	||	ALPS, 11NA	||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||	Hirose	||		||	Board to Board - Receptacle, Gold Plated Contacts	||	HRS, B	||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Pin Header - Shrouded, Right Angle, Gold Plated Contacts	||		||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||	Foxconn	||		||	Mini PCI Express Card Edge - Right Angle, Gold Plated Contacts	||	1BFMA, FOXCONN	||	SMD	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Crystal	||	1	||	NDK	||	NX3225GA	||	Crystal - 27.000MHz	||	27.000, Logo :138	||	2.5x3.2 SMD	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Crystal	||	1	||	Epson Toyocom	||	FC-135	||	Crystal - 32.768kHz	||	A140C	||	1.5x3.2 SMD	||		||
|-																						
|	Main PCB, Bottom	||	BT / WLAN	||	Passive	||	Filter	||	1	||		||		||	Filter - Ceramic, Bandpass	||	Gray w/ Black Dot	||	603	||		||
|-																						
|	Main PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Hardware	||	2	||		||		||	Standoff - Threaded Metal	||		||		||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	Logic	||	1	||	Renesas	||		||	ASIC	||	C 2011, SCEI, 1141KM40L, E066D94100 (Die Marking: NEC Electronics, Corp 2009, 56, 0109)	||	BGA	||	[[File:Scei_hadron_pack_shots_01.jpg|50px]]	||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	Logic	||	1	||	Wolfson Micro	||	WM1803E	||	Audio Codec	||	Logo, WM1803E, 1BAKPMN	||	Flip Chip	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	Logic	||		||	Wolfson Micro	||	WM1803E	||	1x Die - Audio Codec	||	D1 D1	||		||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	Logic	||	1	||	Toshiba Semiconductor	||	TC7WG126FK	||	Buffer - Dual, w/ 3-State Output	||	WG, 126	||	VSSOP	||		|| [http://toshiba.semicon-storage.com/info/lookup.jsp?pid=TC7WG126FK&lang=en_us Datasheet]
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	Logic	||	1	||	Texas Instruments	||	TS3A5018RSVR	||	Analog Switch - Quad, SPDT, 10 Ohm	||	ZUN, 19H	||	QFN	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	Logic	||	1	||	IDT	||		||	Clock Synthesizer	||	638, 139L, 67LG (Die Marking: 2006, 895-132, 2006, AT270, (M) IDT)	||	QFN	||		||
|-																						
|	Main PCB, Bottom	||	BT / WLAN	||	Passive	||	Magnetic	||	2	||		||		||	Inductor - Ceramic Multilayer	||	1/2 Gray / White	||	402	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Magnetic	||	5	||		||		||	Ferrite Bead	||		||	603	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Magnetic	||	8	||		||		||	Ferrite Bead	||		||	402	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Magnetic	||	4	||		||		||	Ferrite Bead - Arrayx2	||		||	303	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Magnetic	||	1	||		||		||	Ferrite Bead - Arrayx2	||		||	404	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	MEMS	||	1	||	ST Microelectronics	||		||	Gyroscope - 3-Axis, Analog Output	||	3GA51H, 2135, MB9DP	||	LGA	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	MEMS	||		||	ST Microelectronics	||		||	Die 1 - Logic	||		||		||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	MEMS	||		||	ST Microelectronics	||		||	Die 2 - MEMS	||	Die Marking: Logo 2010, V706A	||		||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	MEMS	||	1	||	Kionix	||	KXTC9 Series	||	Accelerometer & Inclinometer - 3-Axis, Analog Output	||	KXTC9, 20763, 3811	||	LGA	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Integrated Circuit	||	MEMS	||	1	||	AKM Semiconductor	||	AKM8975B	||	Electronic Compass - 3-Axis, w/ Built-In ADC, 8-Bit Digital Output & Supplementary Substrate	||	8975C, D137L	||	Flip Chip	||		||
|-																						
|	Main PCB, Bottom	||	BT / WLAN	||	Passive	||	Resistor	||	5	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	12	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	2	||		||		||	Precision SMD	||	Green	||	402	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	101	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	11	||		||		||	Precision SMD	||	Green	||	201	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	1	||		||		||	SMD Flat Chip	||		||	603	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	1	||		||		||	SMD Flat Chip	||		||	805	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	1	||		||		||	Precision SMD	||	Blue	||	402	||		||
|-																						
|	Main PCB, Bottom	||	I/O & Interface	||	Passive	||	Resonator	||	1	||		||		||	Ceramic Resonator	||	80k	||	1.3x3.2 SMD	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Integrated Circuit	||	Analog	||	1	||	Fujitsu	||	MB44C026A	||	Power Management Module - Contains PMIC, & Ceramic Inductors	||	MB44C026A, 1139 J17, E1	||	BGA	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Integrated Circuit	||	Analog	||		||	Fujitsu	||	MB44C026A	||	1x Die - Power Management IC	||	MB44C026	||		||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Integrated Circuit	||	Analog	||	1	||	ST Microelectronics	||	STOD03ATPUR	||	DC-DC Converter - Dual, Step-Up / Inverting, 4.6V, 200mA, 1.5MHz, for Powering AMOLED Display	||	Y136, D03A, S	||	DFN	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Integrated Circuit	||	Analog	||	1	||	Intersil	||	ISL9110IRTAZ	||	Regulator - Buck-Boost Switching, Adjustable, 1.2A, 2.5MHz	||	Logo, GAUA, HG5K	||	DFN	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Integrated Circuit	||	Analog	||	1	||	Texas Instruments	||	SN99057A5	||	Power Management IC	||	99057, TI 19K, ARY6, G4	||	QFN	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Integrated Circuit	||	Analog	||		||	Texas Instruments	||	SN99057A5	||	1x Die - Power Management IC	||	SN99057A5, Logo, TI, 2010	||		||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Integrated Circuit	||	Analog	||	1	||	Texas Instruments	||	bq27520YZF	||	Battery Fuel Gauge - System-Side, w/ Integrated LDO, for Single Li-Ion Cell	||	TI 18A123I, SN27520S1 (Die Marking: BDQ035, M 2009)	||	Flip Chip	||		||
|-																						
|	Main PCB, Top	||	BT / WLAN	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	805	||		||
|-																						
|	Main PCB, Top	||	BT / WLAN	||	Passive	||	Capacitor	||	2	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	603	||		||
|-																						
|	Main PCB, Top	||	BT / WLAN	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Main PCB, Top	||	BT / WLAN	||	Passive	||	Capacitor	||	4	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Capacitor	||	2	||		||		||	Ceramic Multilayer - C0G/NP0	||	Violet	||	402	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - C0G/NP0	||	Violet	||	201	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	13	||		||		||	Ceramic Multilayer - C0G/NP0	||	Gray	||	201	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	805	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	2	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	603	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	7	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	11	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Main PCB, Top	||	Memory	||	Passive	||	Capacitor	||	4	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	603	||		||
|-																						
|	Main PCB, Top	||	Memory	||	Passive	||	Capacitor	||	2	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Capacitor	||	1	||	NEC Tokin	||	PSLB30J476M	||	Tantalum Conductive Polymer - Encapsulated, 6.3V, 47uF, Low ESR	||	NEJ, jS7	||	594951	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Capacitor	||	23	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	805	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Capacitor	||	14	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	603	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Capacitor	||	21	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Capacitor	||	19	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - C0G/NP0	||	Gray	||	201	||		||
|-																						
|	Main PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	FFC / FPC - Right Angle, w/ Metal Housing & Locking Clip	||		||	SMD	||		||
|-																						
|	Main PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Ground Contact - Stamped / Formed Metal	||		||	SMD	||		||
|-																						
|	Main PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||	Hirose	||		||	Board to Board - Receptacle, Gold Plated Contacts	||	HRS, C	||	SMD	||		||
|-																						
|	Main PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Jack - Micro USB, Right Angle, w/ Plastic Housing	||		||	SMD	||		||
|-																						
|	Main PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	PS Vita Card Slot - Push-Push, Right Angle, w/ Metal Housing	||	A1NF	||	SMD	||		||
|-																						
|	Main PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Jack - Audio, 3.5mm, Right Angle, Gold Plated Contacts in Plastic Housing	||	1BCB, 3	||	Thru Hole	||		||
|-																						
|	Main PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Main I/O & Power - Right Angle, w/ Metal Housing	||		||	SMD	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Discrete Semi	||	Diode	||	1	||	Rohm	||	RB161VA-20	||	Schottky Barrier - 20V, 1A	||	X	||	SOD323	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Optical Semi	||	LED	||	1	||		||		||	Amber	||		||	402	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Integrated Circuit	||	Logic	||	1	||	ST Microelectronics	||		||	I/O Controller	||	32P10SOD, GK0MU 93, CHN 140, Logo e2 Z (Die Marking: T420A, ST 2009)	||	BGA	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Integrated Circuit	||	Logic	||	1	||	Texas Instruments	||	TS3USB31RSER	||	USB Switch - USB 2.0, 1-Port, w/ Single Enable	||	L9	||	QFN	||		||
|-																						
|	Main PCB, Top	||	Processing	||	Integrated Circuit	||	Logic	||	1	||	Sony	||	CXD5315GG	||	CPU - Quad-Core, ARM Cortex-A9 + 4Gb Mobile DDR2	||	Sony Computer, Entertainment Inc., CXD5315GG, C 2011 SCEI, 1143HAF, 712556	||	BGA	||	[[File:CXD5315GG_PkgTop_P1_bg.jpg|50px]] [[File:CXD5315GG_XRaySideA2_bg.jpg|50px]]	||
|-																						
|	Main PCB, Top	||	Processing	||	Integrated Circuit	||	Logic	||		||	Sony	||	CXD5315GG	||	1x Die 2 - 1Gb Samsung GDDR5 Assumed	||	Die marking: 1G-E-WIDE Samsung	||		||	[[File:CXD5315GG_1G-E-WIDE_diemrk.jpg|50px]]	||
|-																						
|	Main PCB, Top	||	Processing	||	Integrated Circuit	||	Logic	||		||	Sony	||	CXD5315GG	||	1x Die 1 - Toshiba Logic - Core Processor Assumed	||	Die Marking: T9ML7, Toshiba, LP1X01)	||		||	[[File:CXD5315GG_T9ML7_diemrk1.jpg|50px]]	||
|-																						
|	Main PCB, Top	||	Processing	||	Integrated Circuit	||	Logic	||		||	Sony	||	CXD5315GG	||	2x Die 3 - Samsung K4P2G324EC 2Gb Mobile DDR2	||	(Die Marking: 200912, M, C, SAMSUNG, K4P2G324EC)	||		||	[[File:K4P4G154EC-FGC1_K4P2G324EC_diemrk.jpg|50px]]	||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Magnetic	||	1	||		||		||	Ferrite Bead - Arrayx2	||		||	404	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Magnetic	||	4	||		||		||	Ferrite Bead	||		||	402	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Magnetic	||	1	||		||		||	Ferrite Bead	||		||	603	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Magnetic	||	1	||		||		||	Inductor - Wound Ferrite Core, Shielded	||	2R2	||	SMD	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Magnetic	||	3	||		||		||	Ferrite Bead	||		||	1008	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Magnetic	||	10	||		||		||	Ferrite Bead	||		||	603	||		||
|-																						
|	Main PCB, Top	||	Processing	||	Passive	||	Magnetic	||	1	||		||		||	Ferrite Bead - Arrayx2	||		||	404	||		||
|-																						
|	Main PCB, Top	||	Processing	||	Passive	||	Magnetic	||	3	||		||		||	Ferrite Bead - Arrayx2	||		||	303	||		||
|-																						
|	Main PCB, Top	||	Processing	||	Passive	||	Magnetic	||	5	||		||		||	Ferrite Bead	||		||	402	||		||
|-																						
|	Main PCB, Top	||	Memory	||	Integrated Circuit	||	Memory	||	1	||	Toshiba Semiconductor	||	THGBM3G5D1FBAIE	||	Flash - eMMC NAND, 4GB, MLC	||	TOSHIBA, THGBM3G5D1FBAIE, GT4164, TAIWAN, 11409AE	||	BGA	||		||
|-																						
|	Main PCB, Top	||	BT / WLAN	||	Passive	||	Resistor	||	2	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Main PCB, Top	||	BT / WLAN	||	Passive	||	Resistor	||	1	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Main PCB, Top	||	BT / WLAN	||	Passive	||	Resistor	||	5	||		||		||	Precision SMD	||	Green	||	201	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Resistor	||	5	||		||		||	Precision SMD	||	Green	||	201	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Resistor	||	44	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Resistor	||	13	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Resistor	||	15	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Resistor	||	4	||		||		||	SMD Flat Chip	||		||	603	||		||
|-																						
|	Main PCB, Top	||	Memory	||	Passive	||	Resistor	||	2	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Resistor	||	1	||		||		||	Precision SMD	||	5L00	||	1206	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Resistor	||	2	||		||		||	SMD Flat Chip	||		||	603	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Resistor	||	5	||		||		||	Precision SMD	||	Green	||	402	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Resistor	||	12	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Passive	||	Resistor	||	3	||		||		||	Precision SMD	||	Green	||	201	||		||
|-																						
|	Main PCB, Top	||	Processing	||	Passive	||	Resistor	||	56	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Main PCB, Top	||	Processing	||	Passive	||	Resistor	||	7	||		||		||	Precision SMD	||	Green	||	201	||		||
|-																						
|	Main PCB, Top	||	Processing	||	Passive	||	Resistor	||	3	||		||		||	Precision SMD	||	Green	||	402	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Passive	||	Resonator	||	1	||		||		||	Ceramic Resonator	||	Jk	||	1.5x2 SMD	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Discrete Semi	||	Transistor	||	2	||		||		||	Transistor	||	TA	||	SOT363 Wide	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Discrete Semi	||	Transistor	||	1	||		||		||	Transistor	||	T4	||	SOT363 Wide	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Discrete Semi	||	Transistor	||	5	||	Rohm	||	DTC023JM	||	Bipolar - NPN, 50V, 100mA, w/ Built-In Resistors	||	46	||	SOT723	||		||
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Discrete Semi	||	Transistor	||	2	||	Toshiba Semiconductor	||	SSM3J16FV	||	MOSFET - P-Channel, -20V, -100mA	||	DT	||	SOT723	||		|| [http://www.toshiba.com/taec/components2/Datasheet_Sync/201102/DST_SSM3J16FV-TDE_EN_11115.pdf Datasheet]
|-																						
|	Main PCB, Top	||	I/O & Interface	||	Discrete Semi	||	Transistor	||	1	||	Rohm	||	DTA023JM	||	Bipolar - PNP, -50V, -100mA, w/ Built-In Resistors	||	36	||	SOT723	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Discrete Semi	||	Transistor	||	1	||	Rohm	||	DTA023JM	||	Bipolar - PNP, -50V, -100mA, w/ Built-In Resistors	||	36	||	SOT723	||		||
|-																						
|	Main PCB, Top	||	Power Supply	||	Discrete Semi	||	Transistor	||	1	||	Rohm	||	DTC023JM	||	Bipolar - NPN, 50V, 100mA, w/ Built-In Resistors	||	46	||	SOT723	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Integrated Circuit	||	Analog	||	1	||		||		||	Analog IC	||	2568, 140Q	||	DFN	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Integrated Circuit	||	Analog	||	1	||	Renesas	||	uPG2406T6R-E2-A	||	RF Switch- SPDT, L/S Band	||	G9	||	DFN	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Passive	||	Capacitor	||	9	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Passive	||	Capacitor	||	5	||		||		||	Ceramic Multilayer - C0G/NP0	||	Violet	||	201	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Passive	||	Capacitor	||	8	||		||		||	Ceramic Multilayer - C0G/NP0	||	Gray	||	201	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Module	||	Combo (BT/WiFi…)	||	1	||		||		||	Bluetooth / FM / WLAN Module - 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter, Contains Marvell 88W8787S-BKB2 SoC	||	WYSBMVDXA-1S, 1NF3 V	||	SMD	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Passive	||	Crystal	||	1	||	Epson Toyocom	||	FA-128	||	Crystal - 26.000MHz	||	2600P, E17RA	||	1.6x2 SMD	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Passive	||	Filter	||	1	||		||		||	Filter - Ceramic, Bandpass	||	Pink w/ Gray Dot	||	603	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Integrated Circuit	||	Logic	||	1	||	Marvell	||	88W8787S-BKB2	||	Bluetooth / FM / WLAN - SoC, 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter	||	Logo R, 88W8787S-BKB2, PCM2170.3, 1137 B0P, TW E	||	BGA	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Integrated Circuit	||	Logic	||		||		||		||	1x Die - Bluetooth / FM / WLAN - SoC, 802.11a/b/g/n, Bluetooth 3.0+HS, FM Receiver & Transmitter	||	Logo 2010, MARVELL, 19C, AP0	||		||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Passive	||	Magnetic	||	11	||		||		||	Inductor - Ceramic Multilayer	||	1/2 Gray / White	||	201	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Integrated Circuit	||	Memory	||	1	||	Seiko	||	S-24C08CI-I8T1U3	||	EEPROM - 8Kb, 2-Wire Serial	||	C08C, 3A7, 408	||	SMD	||		||
|-																						
|	Main PCB, Top, Bluetooth / FM / WLAN Module	||	BT / WLAN	||	Passive	||	Resistor	||	1	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Primary Camera Module	||	Camera	||	Camera	||	Camera	||	1	||		||		||	Primary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens	||		||		||	[[File:Camera-module.jpg|50px]]	|| See [[Camera]]
|-																						
|	Primary Camera Module	||	I/O & Interface	||	Passive	||	Capacitor	||	5	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Primary Camera Module	||	I/O & Interface	||	Optical Semi	||	Image Sensor	||	1	||	OmniVision	||		||	Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area	||	OV2B1AG (M)	||		||	[[File:OV2B1AG_diemrk.jpg|50px]]	||
|-																						
|	Right Button PCB	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	PCB	||	1	||	Honghengsheng Electronical Technology(Huaian)	||		||	2-Layer - FR4, Lead-Free, Halogen-Free	||	E253117, DS194V-0, IRR-002, 1-884-528-21, >EP GW<, LF, HF	||		||		||
|-																						
|	Right Button PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	8	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Right Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	B6	||	SMD	||		||
|-																						
|	Right Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	A8	||	SMD	||		||
|-																						
|	Right Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	MXJ, A8	||	SMD	||		||
|-																						
|	Right Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	2	||		||		||	Loudspeaker Contact - Stamped Metal, Gold Plated	||		||	SMD	||		||
|-																						
|	Right Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Coaxial Receptacle - Vertical, Subminiature, Gold Plated	||		||	SMD	||		||
|-																						
|	Right Button PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Antenna Contact - Stamped / Formed Metal, Gold Plated	||		||	SMD	||		||
|-																						
|	Right Button PCB, Bottom	||	I/O & Interface	||	Passive	||	Magnetic	||	1	||		||		||	Inductor - Ceramic Multilayer	||	1/2 Gray / White	||	402	||		||
|-																						
|	Right Button PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	2	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Right Button PCB, Bottom	||	I/O & Interface	||	Passive	||	Resistor	||	4	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Right Button PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	3	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Right Button PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Ground Contact - Stamped / Formed Metal, Gold Plated	||		||	SMD	||		||
|-																						
|	Right Button PCB, Top	||	I/O & Interface	||	Passive	||	Resistor	||	4	||		||		||	SMD Flat Chip	||		||	402	||		||
|-																						
|	Sencondary Camera Module	||	Camera	||	Camera	||	Camera	||	1	||		||		||	Secondary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens	||		||		||	[[File:Camera-module.jpg|50px]]	|| See [[Camera]]
|-																						
|	Sencondary Camera Module	||	I/O & Interface	||	Passive	||	Capacitor	||	5	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Sencondary Camera Module	||	I/O & Interface	||	Optical Semi	||	Image Sensor	||	1	||	OmniVision	||		||	Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area	||	OV2B1AG (M)	||		|| [[File:OV2B1AG_diemrk.jpg|50px]]		||
|-																						
|	SIM Card PCB	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	PCB	||	1	||	Honghengsheng Electronical Technology(Huaian)	||		||	2-Layer - FR4, Lead-Free, Halogen-Free	||	IRC-002, 1-884-530-21, B, 11403, E253117, LF, HF, DS194V-0, >EP GW<	||		||		||
|-																						
|	SIM Card PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	SIM Card PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	1	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	SIM Card PCB, Bottom	||	I/O & Interface	||	Passive	||	Capacitor	||	2	||		||		||	Ceramic Multilayer - C0G/NP0	||	Gray	||	201	||		||
|-																						
|	SIM Card PCB, Bottom	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	FFC / FPC - Right Angle, Gold Plated Contacts, w/ Locking Clip	||	MXJ, A6	||	SMD	||		||
|-																						
|	SIM Card PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	SIM Card - 6 Gold-Plated Contacts in Plastic Carrier, w/ Metal Housing	||	1BG2	||	SMD	||		||
|-																						
|	SIM Card PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||		||		||	Ground Contact - Stamped Metal, Gold Plated	||		||	SMD	||		||
|-																						
|	Touchpad Controller PCB	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	PCB	||	1	||		||		||	2-Layer - Flex Kapton, w/ Stiffener	||	Logo F, M9Z, 4	||		||		||
|-																						
|	Touchpad Controller PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	3	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Touchpad Controller PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	3	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Touchpad Controller PCB, Top	||	I/O & Interface	||	Passive	||	Capacitor	||	4	||		||		||	SMD Flat Chip	||		||	201	||		||
|-																						
|	Touchpad Controller PCB, Top	||	Mechanical / Electro-Mechanical	||	Electro Mechanical	||	Connector	||	1	||	Hirose	||		||	Board to Board - Plug, Gold Plated Contacts	||	HRS, B	||	SMD	||		||
|-																						
|	Touchpad Controller PCB, Top	||	I/O & Interface	||	Integrated Circuit	||	Logic	||	1	||	Atmel	||	mXT224	||	Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface	||	ATMEL, MXT224, C070S541, F35019.1	||	BGA	||		||
|-																						
|	Touchpad Controller PCB, Top	||	I/O & Interface	||	Integrated Circuit	||	Logic	||		||	Atmel	||	mXT224	||	1x Die - Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface	||	Logo, AT 25968, AVR, 2010	||		||		||
|-																						
|	Touchpad Controller PCB, Top	||	Mechanical / Electro-Mechanical	||	Mechanical	||	Metals	||	1	||		||		||	Stiffener - Stamped Metal, w/ PSA	||		||		||		||
|-																						
|	Touchscreen PCB	||	I/O & Interface	||	Passive	||	Capacitor	||	3	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	402	||		||
|-																						
|	Touchscreen PCB	||	I/O & Interface	||	Passive	||	Capacitor	||	3	||		||		||	Ceramic Multilayer - X5R/X7R	||	Brown	||	201	||		||
|-																						
|	Touchscreen PCB	||	I/O & Interface	||	Passive	||	Resistor	||	3	||		||		||	SMD Flat Chip	||		||	201	||		||
|-
|}

== Disassembly / Chip analysis pictures ==

*[http://www.ifixit.com/Teardown/PlayStation+Vita+Teardown/7872/1 PS Vita Teardown by ifixit]
*[http://www.techinsights.com/teardowns/sony-playstation-vita-teardown/ Sony Playstation Vita Teardown & Product Analysis by TECH<span style="color:blue">INSIGHTS </span>]
*[http://imaginglabo.web.fc2.com/PSvita-barabara.htm PS Vita tiny teardown]
* http://www.chipworks.com/en/technical-competitive-analysis/resources/blog/sonys-ps-vita-uses-chip-on-chip-sip-3d-but-not-3d/

== Related articles ==
*[http://www.psdevwiki.com/ps4/Reference_designators Reference designators]
*[http://www.psdevwiki.com/ps4/Components PS4 Components] page & and her [http://www.psdevwiki.com/ps4/Template:Components PS4 Template:Components] 
*[http://www.psdevwiki.com/ps4/Motherboard_Components PS4 Motherboard Components] and her [http://www.psdevwiki.com/ps4/Template:Motherboard_Components Template:Motherboard Components]
*[http://www.psdevwiki.com/ps4/Soldering_Tips/Guides Soldering/Desoldering Tips/Guides]

== Tutorials ==
*learn by sparkfun.com:
**[https://learn.sparkfun.com/tutorials/capacitors capacitors]
**[https://learn.sparkfun.com/tutorials/connector-basics connector basics]
**[https://learn.sparkfun.com/tutorials/diodes diodes]
**[https://learn.sparkfun.com/tutorials/integrated-circuits/ic-packages Integrated-Circuits packages]
**[https://learn.sparkfun.com/tutorials/light-emitting-diodes-leds leds]
**[https://learn.sparkfun.com/tutorials/resistors resistors]
**[https://learn.sparkfun.com/tutorials/transistors transistors]

----

*http://en.wikipedia.org/wiki/Ceramic_capacitor