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== Hardware Analysis ==
== Hardware Analysis ==


=== PCH-1000 ===
=== PCH-1100 ===
::::::::[http://www.ifixit.com/Teardown/PlayStation+Vita+Teardown/7872/1 PS Vita Teardown by ifixit]
::::::::[http://www.techinsights.com/teardowns/sony-playstation-vita-teardown/ Sony Playstation Vita Teardown & Product Analysis by TECH<span style="color:blue">INSIGHTS </span>]
::::::::[http://imaginglabo.web.fc2.com/PSvita-barabara.htm PS Vita tiny teardown]


Report by [http://www.electronicproducts.com/Sony_PlayStation_Vita_PCH-1100_Handheld_Gaming_Console-whatsinside_text-129.aspx www.electronicproducts.com] / [http://www.electronicproducts.com/Sony_PlayStation_Vita_PCH-1100_Handheld_Gaming_Console-whatsinside-129.aspx www.electronicproducts.com] via [https://technology.ihs.com/345104/teardown-analysis-sony-playstation-vita-pch-1100-handheld-gaming-console IHS technology]
Report by [http://www.electronicproducts.com/Sony_PlayStation_Vita_PCH-1100_Handheld_Gaming_Console-whatsinside_text-129.aspx www.electronicproducts.com] via [https://technology.ihs.com/345104/teardown-analysis-sony-playstation-vita-pch-1100-handheld-gaming-console IHS technology]


{| class="wikitable sortable mw-datatable" style="text-align: center;border:3px solid #123AAA;"
{| class="wikitable sortable mw-datatable" style="text-align: center;border:3px solid #123AAA;"
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!NOTES
!NOTES
|-
|-
| Battery || Battery || Battery || Li Ion || 1 || Sony Energy Devices Corporation || SP65M || Battery - Li-Ion, 3.7V, 2210mAh, w/ Power Management Circuit, Integrated 3 Discrete Wires, 1 3-Position Pin Socket Connector. (Length) 80.50mm x (Width) 45.40mm x (Height) 6.50mm || MODEL SP65M, Li-ion BATTERY PACK 3.7V 2210mAh, MADE IN CHINA, 8.2Wh 4-260-681-01 ||  || [[File:Battery.jpg|50px]] ||
| Display / Touchscreen Module || Display & Touch || Display || OLED || 1 || Samsung Mobile Display || AMS495QA01 || OLED Display Unit - 5" Diagonal, 16M Color AMOLED, 960 x 544 Pixels, 115um x 115um Pixel Size, 110mm x 62.5mm Viewable Area || Logo, AMS495QA01 REV14.2, 2011.07.20, S111101123451 || || ||
|-
| Battery || Battery || Battery || Li Ion || 1 || Sony Energy Devices Corporation || SP654580 || Battery Cell - Li-Ion, 3.7V, 2210mAh. (Length) 65mm x  (Width) 45mm x (Height) 5.80mm || Sony 26W, SP654580 A10S, 00414K045TJ09A ||  ||  ||
|-
| Display / Touchscreen Module || Display & Touch || Display || OLED || 1 || Samsung Mobile Display || AMS495QA01 || OLED Display Unit - 5" Diagonal, 16M Color AMOLED, 960 x 544 Pixels, 115um x 115um Pixel Size, 110mm x 62.5mm Viewable Area || Logo, AMS495QA01 REV14.2, 2011.07.20, S111101123451 || || || See [[Display]]
|-
|-
| Display PCB || I/O & Interface || Passive || Capacitor || 24 || || || Ceramic Multilayer - X5R/X7R || Brown || 402 || ||
| Display PCB || I/O & Interface || Passive || Capacitor || 24 || || || Ceramic Multilayer - X5R/X7R || Brown || 402 || ||
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| Half Mini PCIe Module || Baseband / RF / PA || Integrated Circuit || Analog || 1 || Avago Technologies || ACPM-7868 || PAM - Quad-Band GSM / EDGE || AVAGO, ACPM-7868, K1128, DL142 || SMD || ||
| Half Mini PCIe Module || Baseband / RF / PA || Integrated Circuit || Analog || 1 || Avago Technologies || ACPM-7868 || PAM - Quad-Band GSM / EDGE || AVAGO, ACPM-7868, K1128, DL142 || SMD || ||
|-
|-
| Half Mini PCIe Module || Power Supply || Integrated Circuit || Analog || || Qualcomm || PM8028 || 1x Die - Power Management IC || HG11-VK495-200 || || [[File:PM8028_HG11-VK495-200_diemrk.jpg|50px]] ||
| Half Mini PCIe Module || Power Supply || Integrated Circuit || Analog || || Qualcomm || PM8028 || 1x Die - Power Management IC || HG11-VK495-200 || || ||
|-
|-
| Half Mini PCIe Module || Power Supply || Integrated Circuit || Analog || 1 || Qualcomm || PM8028 || Power Management IC || QUALCOMM, PM8028, A10618.1, F11330B4 || BGA || ||
| Half Mini PCIe Module || Power Supply || Integrated Circuit || Analog || 1 || Qualcomm || PM8028 || Power Management IC || QUALCOMM, PM8028, A10618.1, F11330B4 || BGA || ||
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| Half Mini PCIe Module || Baseband / RF / PA || Integrated Circuit || Logic || 1 || Qualcomm || MDM6200 || Baseband / RF Transceiver - GSM/WCDMA/HSPA+ || QUALCOMM R, MDM6200, BN38PC, C1134007 || BGA || ||
| Half Mini PCIe Module || Baseband / RF / PA || Integrated Circuit || Logic || 1 || Qualcomm || MDM6200 || Baseband / RF Transceiver - GSM/WCDMA/HSPA+ || QUALCOMM R, MDM6200, BN38PC, C1134007 || BGA || ||
|-
|-
| Half Mini PCIe Module || Baseband / RF / PA || Integrated Circuit || Logic || || Qualcomm || MDM6200 || 1x Die 1 - Baseband || Die Marking: HG11-VJ130 || || [[File:MDM6600_HG11-VJ130_diemrk1.jpg|50px]] [[File:MDM6600_HG11-VJ130_diemrk2.jpg|50px]] ||
| Half Mini PCIe Module || Baseband / RF / PA || Integrated Circuit || Logic || || Qualcomm || MDM6200 || 1x Die 1 - Baseband || Die Marking: HG11-VJ130 || || ||
|-
|-
| Half Mini PCIe Module || Baseband / RF / PA || Integrated Circuit || Logic || || Qualcomm || MDM6200 || 1x Die 2 - RF Transceiver - Dual Mode, GSM/EDGE/EVDOrB/HSPA+, Multi-Band || Die Marking: HG11-VF535-220 || || [[File:MDM6600_HG11-VF535-220_diemrk.jpg|50px]] ||
| Half Mini PCIe Module || Baseband / RF / PA || Integrated Circuit || Logic || || Qualcomm || MDM6200 || 1x Die 2 - RF Transceiver - Dual Mode, GSM/EDGE/EVDOrB/HSPA+, Multi-Band || Die Marking: HG11-VF535-220 || || ||
|-
|-
| Half Mini PCIe Module || Power Supply || Passive || Magnetic || 4 || || || Inductor - Wound Ferrite Core, Shielded || || SMD || ||
| Half Mini PCIe Module || Power Supply || Passive || Magnetic || 4 || || || Inductor - Wound Ferrite Core, Shielded || || SMD || ||
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| Half Mini PCIe Module || Memory || Integrated Circuit || Memory || 1 || Toshiba Semiconductor || Y890A111222KA || MCP - 512Mb NAND Flash + 256Mb Mobile SDRAM || Logo CHINA, Y890A111222KA, ZX3581 1135KND || BGA || ||
| Half Mini PCIe Module || Memory || Integrated Circuit || Memory || 1 || Toshiba Semiconductor || Y890A111222KA || MCP - 512Mb NAND Flash + 256Mb Mobile SDRAM || Logo CHINA, Y890A111222KA, ZX3581 1135KND || BGA || ||
|-
|-
| Half Mini PCIe Module || Memory || Integrated Circuit || Memory || || Toshiba Semiconductor || Y890A111222KA || 1x Die 1 - Toshiba 512Mb NAND Flash || Die Marking: Toshiba GWM2 || || [[File:890A111222_GWM2_diemrk.jpg|50px]] ||
| Half Mini PCIe Module || Memory || Integrated Circuit || Memory || || Toshiba Semiconductor || Y890A111222KA || 1x Die 1 - Toshiba 512Mb NAND Flash || Die Marking: Toshiba GWM2 || || ||
|-
|-
| Half Mini PCIe Module || Memory || Integrated Circuit || Memory || || Toshiba Semiconductor || Y890A111222KA || 1x Die 2 - Hynix H55S2562J 256Mb Mobile SDRAM || Die Marking: H55S2562J, DTC05AA (see picture) || || [[File:890A111222_H55S2562J_diemrk1.jpg|50px]] [[File:890A111222_H55S2562J_diemrk2.jpg|50px]] ||
| Half Mini PCIe Module || Memory || Integrated Circuit || Memory || || Toshiba Semiconductor || Y890A111222KA || 1x Die 2 - Hynix H55S2562J 256Mb Mobile SDRAM || Die Marking: H55S2562J, DTC05AA || || ||
|-
|-
| Half Mini PCIe Module || Mechanical / Electro-Mechanical || Module || Other || 1 || Chi Mei Communications Systems || ZOEDA-BB1-S9-17618 || 3G Half Mini PCIe Module - Quad-Band WCDMA/HSUPA/HSDPA, Quad-Band GSM/EDGE || CE0682 AD110301003, 003XYA110299, 003MWA110300, Barcodes, Sony P/N:1-489-770-31, S/N:ZOEDA-BB1-S9-17618, IMEI: 358459044116214, FCC ID: QDJZOE, Made in China Model: ZOE || || [[File:Wireless-card-ZOE-MP-EMI-shields.jpg|50px]] || See [[Wireless_communications]]
| Half Mini PCIe Module || Mechanical / Electro-Mechanical || Module || Other || 1 || Chi Mei Communications Systems || ZOEDA-BB1-S9-17618 || 3G Half Mini PCIe Module - Quad-Band WCDMA/HSUPA/HSDPA, Quad-Band GSM/EDGE || CE0682 AD110301003, 003XYA110299, 003MWA110300, Barcodes, Sony P/N:1-489-770-31, S/N:ZOEDA-BB1-S9-17618, IMEI: 358459044116214, FCC ID: QDJZOE, Made in China Model: ZOE || || ||
|-
|-
| Half Mini PCIe Module || Mechanical / Electro-Mechanical || Electro Mechanical || PCB || 1 || Nan Ya Pcb || || 10-Layer - FR4/RCF HDI, 3+4+3, Lead-Free, Halogen-Free || B1P-0116202-A010 Logo NM10 94V-0, M1011-D1 S8, 1138 || || ||
| Half Mini PCIe Module || Mechanical / Electro-Mechanical || Electro Mechanical || PCB || 1 || Nan Ya Pcb || || 10-Layer - FR4/RCF HDI, 3+4+3, Lead-Free, Halogen-Free || B1P-0116202-A010 Logo NM10 94V-0, M1011-D1 S8, 1138 || || ||
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| Half Mini PCIe Module || Baseband / RF / PA || Discrete Semi || Transistor || 2 || || || Transistor || N4 || SOT723 || ||
| Half Mini PCIe Module || Baseband / RF / PA || Discrete Semi || Transistor || 2 || || || Transistor || N4 || SOT723 || ||
|-
|-
| Half Mini PCIe Module || Baseband / RF / PA || Discrete Semi || Transistor || 1 || Toshiba Semiconductor || SSM3J16FV || MOSFET - P-Channel, -20V, -100mA || DT || SOT723 || ||   [http://www.toshiba.com/taec/components2/Datasheet_Sync/201102/DST_SSM3J16FV-TDE_EN_11115.pdf Datasheet]
| Half Mini PCIe Module || Baseband / RF / PA || Discrete Semi || Transistor || 1 || Toshiba Semiconductor || SSM3J16FV || MOSFET - P-Channel, -20V, -100mA || DT || SOT723 || ||
|-
|-
| Left Button PCB || Mechanical / Electro-Mechanical || Electro Mechanical || PCB || 1 || Honghengsheng Electronical Technology(Huaian) || || 2-Layer - FR4, Lead-Free, Halogen-Free || E253117, 11421, DS1, 94V-0, IRL-002, 1-884-529-21, >EP GW<, LF, HF || || [[File:Button_PCB.jpg|50px]] ||
| Left Button PCB || Mechanical / Electro-Mechanical || Electro Mechanical || PCB || 1 || Honghengsheng Electronical Technology(Huaian) || || 2-Layer - FR4, Lead-Free, Halogen-Free || E253117, 11421, DS1, 94V-0, IRL-002, 1-884-529-21, >EP GW<, LF, HF || || ||
|-
|-
| Left Button PCB, Bottom || I/O & Interface || Passive || Capacitor || 2 || || || Ceramic Multilayer - C0G/NP0 || Violet || 402 || ||
| Left Button PCB, Bottom || I/O & Interface || Passive || Capacitor || 2 || || || Ceramic Multilayer - C0G/NP0 || Violet || 402 || ||
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| Main PCB, Bottom || Mechanical / Electro-Mechanical || Mechanical || Hardware || 2 || || || Standoff - Threaded Metal || || || ||
| Main PCB, Bottom || Mechanical / Electro-Mechanical || Mechanical || Hardware || 2 || || || Standoff - Threaded Metal || || || ||
|-
|-
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || 1 || Renesas || || ASIC || C 2011, SCEI, 1141KM40L, E066D94100 (Die Marking: NEC Electronics, Corp 2009, 56, 0109) || BGA || [[File:Scei_hadron_pack_shots_01.jpg|50px]] [[File:Scei_hadron_pack_shots_02.jpg|50px]] ||
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || 1 || Renesas || || ASIC || C 2011, SCEI, 1141KM40L, E066D94100 (Die Marking: NEC Electronics, Corp 2009, 56, 0109) || BGA || ||
|-
|-
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || 1 || Wolfson Micro || WM1803E || Audio Codec || Logo, WM1803E, 1BAKPMN || Flip Chip || ||
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || 1 || Wolfson Micro || WM1803E || Audio Codec || Logo, WM1803E, 1BAKPMN || Flip Chip || ||
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| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || || Wolfson Micro || WM1803E || 1x Die - Audio Codec || D1 D1 || || ||
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || || Wolfson Micro || WM1803E || 1x Die - Audio Codec || D1 D1 || || ||
|-
|-
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || 1 || Toshiba Semiconductor || TC7WG126FK || Buffer - Dual, w/ 3-State Output || WG, 126 || VSSOP || || [http://toshiba.semicon-storage.com/info/lookup.jsp?pid=TC7WG126FK&lang=en_us Datasheet]
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || 1 || Toshiba Semiconductor || TC7WG126FK || Buffer - Dual, w/ 3-State Output || WG, 126 || VSSOP || ||
|-
|-
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || 1 || Texas Instruments || TS3A5018RSVR || Analog Switch - Quad, SPDT, 10 Ohm || ZUN, 19H || QFN || || [http://www.ti.com/lit/ds/symlink/ts3usb31.pdf Datasheet]
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || 1 || Texas Instruments || TS3A5018RSVR || Analog Switch - Quad, SPDT, 10 Ohm || ZUN, 19H || QFN || ||
|-
|-
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || 1 || IDT || || Clock Synthesizer || 638, 139L, 67LG (Die Marking: 2006, 895-132, 2006, AT270, (M) IDT) || QFN || ||
| Main PCB, Bottom || I/O & Interface || Integrated Circuit || Logic || 1 || IDT || || Clock Synthesizer || 638, 139L, 67LG (Die Marking: 2006, 895-132, 2006, AT270, (M) IDT) || QFN || ||
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| Main PCB, Top || Power Supply || Integrated Circuit || Analog || || Texas Instruments || SN99057A5 || 1x Die - Power Management IC || SN99057A5, Logo, TI, 2010 || || ||
| Main PCB, Top || Power Supply || Integrated Circuit || Analog || || Texas Instruments || SN99057A5 || 1x Die - Power Management IC || SN99057A5, Logo, TI, 2010 || || ||
|-
|-
| Main PCB, Top || Power Supply || Integrated Circuit || Analog || 1 || Texas Instruments || bq27520YZF || Battery Fuel Gauge - System-Side, w/ Integrated LDO, for Single Li-Ion Cell || TI 18A123I, SN27520S1 (Die Marking: BDQ035, M 2009) || Flip Chip || || [http://www.ti.com/lit/ds/symlink/bq27520-g1.pdf Datasheet]
| Main PCB, Top || Power Supply || Integrated Circuit || Analog || 1 || Texas Instruments || bq27520YZF || Battery Fuel Gauge - System-Side, w/ Integrated LDO, for Single Li-Ion Cell || TI 18A123I, SN27520S1 (Die Marking: BDQ035, M 2009) || Flip Chip || ||
|-
|-
| Main PCB, Top || BT / WLAN || Passive || Capacitor || 1 || || || Ceramic Multilayer - X5R/X7R || Brown || 805 || ||
| Main PCB, Top || BT / WLAN || Passive || Capacitor || 1 || || || Ceramic Multilayer - X5R/X7R || Brown || 805 || ||
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| Main PCB, Top || Memory || Passive || Capacitor || 2 || || || Ceramic Multilayer - X5R/X7R || Brown || 201 || ||
| Main PCB, Top || Memory || Passive || Capacitor || 2 || || || Ceramic Multilayer - X5R/X7R || Brown || 201 || ||
|-
|-
| Main PCB, Top || Power Supply || Passive || Capacitor || 1 || NEC Tokin || PSLB30J476M || Tantalum Conductive Polymer - Encapsulated, 6.3V, 47uF, Low ESR || NEJ, jS7 || 594951 || || [http://www.nec-tokin.com/english/guide/cap/pdf/psl_e.pdf Datasheet]
| Main PCB, Top || Power Supply || Passive || Capacitor || 1 || NEC Tokin || PSLB30J476M || Tantalum Conductive Polymer - Encapsulated, 6.3V, 47uF, Low ESR || NEJ, jS7 || 594951 || ||
|-
|-
| Main PCB, Top || Power Supply || Passive || Capacitor || 23 || || || Ceramic Multilayer - X5R/X7R || Brown || 805 || ||
| Main PCB, Top || Power Supply || Passive || Capacitor || 23 || || || Ceramic Multilayer - X5R/X7R || Brown || 805 || ||
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| Main PCB, Top || I/O & Interface || Integrated Circuit || Logic || 1 || Texas Instruments || TS3USB31RSER || USB Switch - USB 2.0, 1-Port, w/ Single Enable || L9 || QFN || ||
| Main PCB, Top || I/O & Interface || Integrated Circuit || Logic || 1 || Texas Instruments || TS3USB31RSER || USB Switch - USB 2.0, 1-Port, w/ Single Enable || L9 || QFN || ||
|-
|-
| Main PCB, Top || Processing || Integrated Circuit || Logic || 1 || Sony || CXD5315GG || CPU - Quad-Core, ARM Cortex-A9 + 4Gb Mobile DDR2 || Sony Computer, Entertainment Inc., CXD5315GG, C 2011 SCEI, 1143HAF, 712556 || BGA || [[File:CXD5315GG_PkgTop_P1_bg.jpg|50px]] [[File:CXD5315GG_XRaySideA2_bg.jpg|50px]] ||
| Main PCB, Top || Processing || Integrated Circuit || Logic || 1 || Sony || CXD5315GG || CPU - Quad-Core, ARM Cortex-A9 + 4Gb Mobile DDR2 || Sony Computer, Entertainment Inc., CXD5315GG, C 2011 SCEI, 1143HAF, 712556 || BGA || ||
|-
|-
| Main PCB, Top || Processing || Integrated Circuit || Logic || || Sony || CXD5315GG || 1x Die 2 - 1Gb Samsung GDDR5 Assumed || Die marking: 1G-E-WIDE Samsung || || [[File:CXD5315GG_1G-E-WIDE_diemrk.jpg|50px]] ||
| Main PCB, Top || Processing || Integrated Circuit || Logic || || Sony || CXD5315GG || 1x Die 2 - 1Gb Samsung GDDR5 Assumed || Die marking: 1G-E-WIDE Samsung || || ||
|-
|-
| Main PCB, Top || Processing || Integrated Circuit || Logic || || Sony || CXD5315GG || 1x Die 1 - Toshiba Logic - Core Processor Assumed || Die Marking: T9ML7, Toshiba, LP1X01) || || [[File:CXD5315GG_T9ML7_diemrk1.jpg|50px]] ||
| Main PCB, Top || Processing || Integrated Circuit || Logic || || Sony || CXD5315GG || 1x Die 1 - Toshiba Logic - Core Processor Assumed || Die Marking: T9ML7, Toshiba, LP1X01) || || ||
|-
|-
| Main PCB, Top || Processing || Integrated Circuit || Logic || || Sony || CXD5315GG || 2x Die 3 - Samsung K4P2G324EC 2Gb Mobile DDR2 || (Die Marking: 200912, M, C, SAMSUNG, K4P2G324EC) || || [[File:K4P4G154EC-FGC1_K4P2G324EC_diemrk.jpg|50px]] ||
| Main PCB, Top || Processing || Integrated Circuit || Logic || || Sony || CXD5315GG || 2x Die 3 - Samsung K4P2G324EC 2Gb Mobile DDR2 || (Die Marking: 200912, M, C, SAMSUNG, K4P2G324EC) || || ||
|-
|-
| Main PCB, Top || I/O & Interface || Passive || Magnetic || 1 || || || Ferrite Bead - Arrayx2 || || 404 || ||
| Main PCB, Top || I/O & Interface || Passive || Magnetic || 1 || || || Ferrite Bead - Arrayx2 || || 404 || ||
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| Main PCB, Top || Power Supply || Passive || Resistor || 1 || || || Precision SMD || 5L00 || 1206 || ||
| Main PCB, Top || Power Supply || Passive || Resistor || 1 || || || Precision SMD || 5L00 || 1206 || ||
|-
|-
| Main PCB, Top || Power Supply || Passive || Resistor || 2 || || || SMD Flat Chip || SB || 0603 || || f6502/03 2.0A
| Main PCB, Top || Power Supply || Passive || Resistor || 2 || || || SMD Flat Chip || || 603 || ||
|-
|-
| Main PCB, Top || Power Supply || Passive || Resistor || 5 || || || Precision SMD || Green || 402 || ||
| Main PCB, Top || Power Supply || Passive || Resistor || 5 || || || Precision SMD || Green || 402 || ||
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| Main PCB, Top || I/O & Interface || Discrete Semi || Transistor || 5 || Rohm || DTC023JM || Bipolar - NPN, 50V, 100mA, w/ Built-In Resistors || 46 || SOT723 || ||
| Main PCB, Top || I/O & Interface || Discrete Semi || Transistor || 5 || Rohm || DTC023JM || Bipolar - NPN, 50V, 100mA, w/ Built-In Resistors || 46 || SOT723 || ||
|-
|-
| Main PCB, Top || I/O & Interface || Discrete Semi || Transistor || 2 || Toshiba Semiconductor || SSM3J16FV || MOSFET - P-Channel, -20V, -100mA || DT || SOT723 || || [http://www.toshiba.com/taec/components2/Datasheet_Sync/201102/DST_SSM3J16FV-TDE_EN_11115.pdf Datasheet]
| Main PCB, Top || I/O & Interface || Discrete Semi || Transistor || 2 || Toshiba Semiconductor || SSM3J16FV || MOSFET - P-Channel, -20V, -100mA || DT || SOT723 || ||
|-
|-
| Main PCB, Top || I/O & Interface || Discrete Semi || Transistor || 1 || Rohm || DTA023JM || Bipolar - PNP, -50V, -100mA, w/ Built-In Resistors || 36 || SOT723 || ||
| Main PCB, Top || I/O & Interface || Discrete Semi || Transistor || 1 || Rohm || DTA023JM || Bipolar - PNP, -50V, -100mA, w/ Built-In Resistors || 36 || SOT723 || ||
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| Main PCB, Top, Bluetooth / FM / WLAN Module || BT / WLAN || Passive || Resistor || 1 || || || SMD Flat Chip || || 201 || ||
| Main PCB, Top, Bluetooth / FM / WLAN Module || BT / WLAN || Passive || Resistor || 1 || || || SMD Flat Chip || || 201 || ||
|-
|-
| Primary Camera Module || Camera || Camera || Camera || 1 || || || Primary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens || || || [[File:Camera-module.jpg|50px]] || See [[Camera]]
| Primary Camera Module || Camera || Camera || Camera || 1 || || || Primary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens || || || ||
|-
|-
| Primary Camera Module || I/O & Interface || Passive || Capacitor || 5 || || || Ceramic Multilayer - X5R/X7R || Brown || 201 || ||
| Primary Camera Module || I/O & Interface || Passive || Capacitor || 5 || || || Ceramic Multilayer - X5R/X7R || Brown || 201 || ||
|-
|-
| Primary Camera Module || I/O & Interface || Optical Semi || Image Sensor || 1 || OmniVision || || Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area || OV2B1AG (M) || || [[File:OV2B1AG_diemrk.jpg|50px]] || [http://www.ovt.com/products/sensor.php?id=81 Datasheet OV7738]
| Primary Camera Module || I/O & Interface || Optical Semi || Image Sensor || 1 || OmniVision || || Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area || OV2B1AG (M) || || ||
|-
|-
| Right Button PCB || Mechanical / Electro-Mechanical || Electro Mechanical || PCB || 1 || Honghengsheng Electronical Technology(Huaian) || || 2-Layer - FR4, Lead-Free, Halogen-Free || E253117, DS194V-0, IRR-002, 1-884-528-21, >EP GW<, LF, HF || || [[File:Button_PCB.jpg|50px]] ||
| Right Button PCB || Mechanical / Electro-Mechanical || Electro Mechanical || PCB || 1 || Honghengsheng Electronical Technology(Huaian) || || 2-Layer - FR4, Lead-Free, Halogen-Free || E253117, DS194V-0, IRR-002, 1-884-528-21, >EP GW<, LF, HF || || ||
|-
|-
| Right Button PCB, Bottom || I/O & Interface || Passive || Capacitor || 8 || || || Ceramic Multilayer - X5R/X7R || Brown || 402 || ||
| Right Button PCB, Bottom || I/O & Interface || Passive || Capacitor || 8 || || || Ceramic Multilayer - X5R/X7R || Brown || 402 || ||
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| Right Button PCB, Top || I/O & Interface || Passive || Resistor || 4 || || || SMD Flat Chip || || 402 || ||
| Right Button PCB, Top || I/O & Interface || Passive || Resistor || 4 || || || SMD Flat Chip || || 402 || ||
|-
|-
| Sencondary Camera Module || Camera || Camera || Camera || 1 || || || Secondary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens || || || [[File:Camera-module.jpg|50px]] || See [[Camera]]
| Sencondary Camera Module || Camera || Camera || Camera || 1 || || || Secondary Camera Module Value Line Item - VGA, 1/6" Format, Fixed Lens || || || ||
|-
|-
| Sencondary Camera Module || I/O & Interface || Passive || Capacitor || 5 || || || Ceramic Multilayer - X5R/X7R || Brown || 201 || ||
| Sencondary Camera Module || I/O & Interface || Passive || Capacitor || 5 || || || Ceramic Multilayer - X5R/X7R || Brown || 201 || ||
|-
|-
| Sencondary Camera Module || I/O & Interface || Optical Semi || Image Sensor || 1 || OmniVision || || Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area || OV2B1AG (M) || || [[File:OV2B1AG_diemrk.jpg|50px]] || [http://www.ovt.com/products/sensor.php?id=81 Datasheet OV7738]
| Sencondary Camera Module || I/O & Interface || Optical Semi || Image Sensor || 1 || OmniVision || || Image Sensor - VGA, 1/7.5" Format, 3.0um x 3.0um Pixel Size, 2.24mm x 1.8mm Active Image Area || OV2B1AG (M) || || ||
|-
|-
| SIM Card PCB || Mechanical / Electro-Mechanical || Electro Mechanical || PCB || 1 || Honghengsheng Electronical Technology(Huaian) || || 2-Layer - FR4, Lead-Free, Halogen-Free || IRC-002, 1-884-530-21, B, 11403, E253117, LF, HF, DS194V-0, >EP GW< || || ||
| SIM Card PCB || Mechanical / Electro-Mechanical || Electro Mechanical || PCB || 1 || Honghengsheng Electronical Technology(Huaian) || || 2-Layer - FR4, Lead-Free, Halogen-Free || IRC-002, 1-884-530-21, B, 11403, E253117, LF, HF, DS194V-0, >EP GW< || || ||
Line 581: Line 580:
| Touchpad Controller PCB, Top || Mechanical / Electro-Mechanical || Electro Mechanical || Connector || 1 || Hirose || || Board to Board - Plug, Gold Plated Contacts || HRS, B || SMD || ||
| Touchpad Controller PCB, Top || Mechanical / Electro-Mechanical || Electro Mechanical || Connector || 1 || Hirose || || Board to Board - Plug, Gold Plated Contacts || HRS, B || SMD || ||
|-
|-
| Touchpad Controller PCB, Top || I/O & Interface || Integrated Circuit || Logic || 1 || Atmel || mXT224 || Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface || ATMEL, MXT224, C070S541, F35019.1 || BGA || [[File:Atmel_mXT224_Touchscreen_Controller.jpg|50px]] || [http://www.atmel.com/microsite/maxtouch_eseries/mxt224e.aspx  Atmel maXTouch]
| Touchpad Controller PCB, Top || I/O & Interface || Integrated Circuit || Logic || 1 || Atmel || mXT224 || Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface || ATMEL, MXT224, C070S541, F35019.1 || BGA || ||
|-
|-
| Touchpad Controller PCB, Top || I/O & Interface || Integrated Circuit || Logic || || Atmel || mXT224 || 1x Die - Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface || Logo, AT 25968, AVR, 2010 || || ||
| Touchpad Controller PCB, Top || I/O & Interface || Integrated Circuit || Logic || || Atmel || mXT224 || 1x Die - Touchscreen Controller - Capacitive, 12-bit, 224-Channel Configuration, 400KHz, w/ I2C Interface || Logo, AT 25968, AVR, 2010 || || ||
Line 594: Line 593:
|-
|-
|}
|}
== Disassembly / Chip analysis pictures ==
*[http://www.ifixit.com/Teardown/PlayStation+Vita+Teardown/7872/1 PS Vita Teardown by ifixit]
*[http://www.techinsights.com/teardowns/sony-playstation-vita-teardown/ Sony Playstation Vita Teardown & Product Analysis by TECH<span style="color:blue">INSIGHTS </span>]
*[http://imaginglabo.web.fc2.com/PSvita-barabara.htm PS Vita tiny teardown]
* http://www.chipworks.com/en/technical-competitive-analysis/resources/blog/sonys-ps-vita-uses-chip-on-chip-sip-3d-but-not-3d/


== Related articles ==
== Related articles ==
*[http://www.psdevwiki.com/ps4/Reference_designators Reference designators]
*[http://www.psdevwiki.com/ps4/Components PS4 Components] page & and her [http://www.psdevwiki.com/ps4/Template:Components PS4 Template:Components]  
*[http://www.psdevwiki.com/ps4/Components PS4 Components] page & and her [http://www.psdevwiki.com/ps4/Template:Components PS4 Template:Components]  
*[http://www.psdevwiki.com/ps4/Motherboard_Components PS4 Motherboard Components] and her [http://www.psdevwiki.com/ps4/Template:Motherboard_Components Template:Motherboard Components]
*[http://www.psdevwiki.com/ps4/Motherboard_Components PS4 Motherboard Components] and her [http://www.psdevwiki.com/ps4/Template:Motherboard_Components Template:Motherboard Components]
*[http://www.psdevwiki.com/ps4/Soldering_Tips/Guides Soldering/Desoldering Tips/Guides]
*[http://www.psdevwiki.com/ps4/Soldering_Tips/Guides Soldering/Desoldering Tips/Guides]
*[http://www.psdevwiki.com/ps4/Glossary Glossary] (list of terms for type of components/packaging)
*[http://www.psdevwiki.com/ps4/Reference_designators Reference designators] (list of Class Designation Letters to use for electrical and electronic assemblies)


== Tutorials ==
== Tutorials ==
*learn by sparkfun.com:
*learn by sparkfun.com:
**[https://learn.sparkfun.com/tutorials/capacitors capacitors]
**[https://learn.sparkfun.com/tutorials/capacitors capacitors]
**[https://learn.sparkfun.com/tutorials/connector-basics connector basics]
**[https://learn.sparkfun.com/tutorials/diodes diodes]
**[https://learn.sparkfun.com/tutorials/diodes diodes]
**[https://learn.sparkfun.com/tutorials/integrated-circuits/ic-packages Integrated-Circuits packages]
**[https://learn.sparkfun.com/tutorials/integrated-circuits/ic-packages Integrated-Circuits packages]
**[https://learn.sparkfun.com/tutorials/light-emitting-diodes-leds leds]
**[https://learn.sparkfun.com/tutorials/resistors resistors]
**[https://learn.sparkfun.com/tutorials/resistors resistors]
***[http://www.digikey.co.uk/en/resources/conversion-calculators/conversion-calculator-resistor-color-code-4-band 4 Band Resistor Color Code Online Calculator]
**[https://learn.sparkfun.com/tutorials/transistors transistors]
**[https://learn.sparkfun.com/tutorials/transistors transistors]
----
*https://en.wikipedia.org/wiki/Flexible_flat_cable
*http://en.wikipedia.org/wiki/List_of_integrated_circuit_packaging_types
*http://en.wikipedia.org/wiki/Ceramic_capacitor
*https://en.wikipedia.org/wiki/Inductor
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