User:Ada L0ve Lace

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Dear Ada,

Traitor!

the end.

I'll be back! in few weeks ~~months~~.--Ada L0ve Lace (talk) 10:32, 26 February 2015 (EST)

22 March 2015 Barcelona vs Real Madrid

2-1 - meuuuuuussi

Notes:

Matyrant, Seussarez, Adanaldo scored (and get false positive offside on his assist), Meussi just no.

Real notes: Meussi did the assist on the 1st goal and Meussi is the leader. Meussi 1-0 Adanaldo

cya next time for another clasico!

http://en.wikipedia.org/wiki/2014–15_La_Liga#Top_goalscorers

Ctyriano Adanaldo 36 Meussi 32 i saw it live today 9-1

you went to Madrid? to watch Adanaldo? if so, you are traitor and became Adanaldo fan

Live from Madrid on Teevee.

Fourth goal Adanaldo is wayyyyy offside. Game was rigged!

Meussi: 71pts / 32
Adanaldo: 67pts / 36

Meussi still wins the liga (for now) but not the next ballon or.

Quotes

While working on it ps4 Dev wiki was a lifesaver. I noticed it had a lot of the USB descriptors and such already on there.

Notebook

http://www.hpl.hp.com/research/ptm/ Polynomial Texture Maps
http://www.cl.cam.ac.uk/~sps32/ Dr Sergei Skorobogatov - University of Cambridge
http://home.deib.polimi.it/barenghi/doku.php?id=publist Alessandro Barenghi - Politecnico di Milano
https://www.youtube.com/watch?v=Ps8jOj7diA0 Programming Paradigms (Stanford)
http://epublications.uef.fi/pub/urn_isbn_978-951-27-0111-7/urn_isbn_978-951-27-0111-7.pdf Security Threats and Countermeasures in Bluetooth-Enabled Systems (Doctoral dissertation - University of Kuopio, Finland)
http://www.curtain-damashii.com/index_ag/game/meruru/

To Ask

http://www.psdevwiki.com/ps3/File:CECHC_FUSE-TH3401.JPG

ToDo

my user pages and user boxs.

Decap page/section

References

http://www.cl.cam.ac.uk/~sps32/mcu_lock.html Copy Protection in Modern Microcontrollers - Dr Sergei Skorobogatov

https://www.youtube.com/watch?v=0Z4aF-qiziM Defcon 21 - Decapping Chips The Strike Easy Hard Way

https://siliconpr0n.org/wiki/doku.php?id=decap:start

http://zeptobars.ru/en/read/how-to-open-microchip-asic-what-inside

http://travisgoodspeed.blogspot.fr/2009/06/cold-labless-hno3-decapping-procedure.html Cold, Labless HNO3 Decapping Procedure

Decap a (epoxy packaged) chip, but why?

to damage (beyond repair) the chip and things around you (including you) and end up ,if lucky, in the great Wall of Shame or much worst (dead, blind & anosmia ...)
for fun (then, use razorblade but not as you were going to tearing a part of the human scalp)
photograph for forensics purposes (with good magnificient if you didn t get blind during the process - to look for damage or to get die numbers.
microprobing
if somehow you end up here for making explosive things/dispose body, it s not the right place.

The Strike Easy Hard Way (be blind & anosmia)

Epoxy resin around the chip could be removed using fuming nitric acid (HNO3). Hot fuming nitric acid dissolves the package without affecting the chip. The procedure should preferably be carried out under very dry conditions, as the presence of water could corrode exposed aluminium interconnects. Alternatives to heated HN03 (70% concentration is enough) can be with cold white HNO3 (99% concentration), with sulfuric acid (H2SO4) or with (boilting) rosin (for 20 minutes).

The chip is then washed with acetone in an ultrasonic bath, followed optionally by a short bath in deionized water and isopropanol. After that chip could be glued into a test package and bonded manually. Having enough experience it might be possible to remove epoxy without destroying bonding wires and smartcard contacts.

On the depackaged chip, the top-layer aluminium interconnect lines are still covered by a passivation layer (usually silicon oxide or nitride), which protects the chip from the environment and ion migration.

On top of this, we might also find a polyimide layer that was not entirely removed by HNO3 but which can be dissolved with ethylenediamine. We have to remove the passivation layer (top layer of the die) before the probes can establish contact.

Passivation layer

Growth of an oxide layer on the surface of a semiconductor to provide electrical stability by isolating the transistor surface from electrical and chemical conditions in the environment; this reduces reverse-current leakage, increases breakdown voltage, and raises power dissipation rating.

The most convenient depassivation technique is the use of a laser cutter. The UV or green laser is mounted on the camera port of the microscope and fires laser pulses through the microscope onto rectangular areas of the chip with micrometer precision. Carefully dosed laser flashes remove patches of the passivation layer.

The resulting hole in the passivation layer can be made so small that only a single bus line is exposed. This prevents accidental contacts with neighboring lines and the hole also stabilizes the position of the probe and makes it less sensitive to vibrations and temperature changes.

An other way to remove the passivation layer is by using hydrofluoric acid.

Nitric acid

Warning:

You can burn/intoxicate by fumes (like countless of experimented and certified chemists). Chemical burn traumata with nitric acid lead to 
specific yellow- to brown-stained wounds with slower accumulation of eschar and slower demarcation compared with thermal burns; skins stains/coloration can happens later  
on without you noiticing any traumata/burn on the spot.

https://www.youtube.com/watch?v=8YWVBBGSxZ8 How to make Fuming Nitric Acid
http://www.instructables.com/id/Make-Nitric-acid-The-Complete-Guide/

Sulfuric acid

Warning:

causing very severe burns, apidly attacks the cornea and can induce permanent blindness if splashed onto eyes.

http://uvicrec.blogspot.com/2013/04/heatgun-h2so4-decap.html

Hydrofluoric acid

Warning:

In addition to being a highly corrosive liquid, hydrofluoric acid is also a contact poison. It should therefore be handled with extreme care.
Because of the ability of hydrofluoric acid to penetrate tissue, poisoning can occur. Rinsing off is not enough. 
Accidental exposures can go unnoticed until a day after (too late).

http://en.wikipedia.org/wiki/Hydrofluoric_acid#Health_and_safety

Porcelain etch gel contain low (9.6%) concentration of Hydrofluoric acid

Rosin

Warning:

Boil a chip for a few hours in rosin, like used for soldering. Refluxing equipment is ideal. Should eat away the casing. Might be best used with Dremeling or other techniques to remove the majority of the epoxy first. The active ingredient for this is abietic acid.

Acetone

Warning:

Acetone is flammable for everyone (advanced/certified user or not), can enter the body by inhalation, skin contact or ingestion.

Common Products Containing Acetone:

Nail polish and nail polish removers
lot of others daily products

Isopropanol

Warning:

Symptoms of isopropyl alcohol poisoning include flushing, headache, dizziness, CNS depression, nausea, vomiting, anesthesia, and coma.
Poisoning can occur from ingestion, inhalation, or absorption; therefore, well-ventilated areas and protective gloves are recommended. 
Around 15 g of isopropyl alcohol can have a toxic effect on a 70 kg human (the bigger they are the harder they fall).

Ethylenediamine

Warning:

Ethylenediamine is a skin and respiratory irritant. Unless tightly contained, liquid ethylenediamine will release toxic and irritating vapors into its surroundings, 
especially on heating. The vapors react with moisture in humid air to form a characteristic white mist, which is extremely irritating to skin, eyes, lungs and mucus
membranes. Exposure to a relatively small amount of vapor or mist by inhalation can seriously damage health and may even result in death.

Safety

Most if the items listed here are Prohibited Items (no fly)-hazardous materials (e.g. http://www.tsa.gov/traveler-information/prohibited-items)
In most of countries, having them/making them/speaking/thinking/dreaming about them (with or without an proper license) is enough to put you in jail and being raped many time.