User:Ada L0ve Lace

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put your user to user message in this section :)

Dear Ada,

Traitor!

the end.

I'll be back! in few weeks ~~months~~.--Ada L0ve Lace (talk) 10:32, 26 February 2015 (EST)

22 March 2015 Barcelona vs Real Madrid

2-1 - meuuuuuussi

Notes:

Matyrant, Seussarez, Adanaldo scored (and get false positive offside on his assist), Meussi just no.

Real notes: Meussi did the assist on the 1st goal and Meussi is the leader. Meussi 1-0 Adanaldo

cya next time for another clasico!

http://en.wikipedia.org/wiki/2014–15_La_Liga#Top_goalscorers

Ctyriano Adanaldo 36 Meussi 32 i saw it live today 9-1

you went to Madrid? to watch Adanaldo? if so, you are traitor and became Adanaldo fan

Notebook

http://www.hpl.hp.com/research/ptm/ Polynomial Texture Maps
http://www.cl.cam.ac.uk/~sps32/ Dr Sergei Skorobogatov - University of Cambridge
http://home.deib.polimi.it/barenghi/doku.php?id=publist Alessandro Barenghi - Politecnico di Milano
https://www.youtube.com/watch?v=Ps8jOj7diA0 Programming Paradigms (Stanford)
http://epublications.uef.fi/pub/urn_isbn_978-951-27-0111-7/urn_isbn_978-951-27-0111-7.pdf Security Threats and Countermeasures in Bluetooth-Enabled Systems (Doctoral dissertation - University of Kuopio, Finland)
http://www.curtain-damashii.com/index_ag/game/meruru/

ToDo

Decap

http://www.cl.cam.ac.uk/~sps32/mcu_lock.html Copy Protection in Modern Microcontrollers - Dr Sergei Skorobogatov (to be moved on later to decap page/section)

Epoxy resin around the chip could be removed using fuming nitric acid. Hot fuming nitric acid dissolves the package without affecting the chip. The procedure should preferably be carried out under very dry conditions, as the presence of water could corrode exposed aluminium interconnects.

The chip is then washed with acetone in an ultrasonic bath, followed optionally by a short bath in deionized water and isopropanol. After that chip could be glued into a test package and bonded manually. Having enough experience it might be possible to remove epoxy without destroying bonding wires and smartcard contacts.

On the depackaged chip, the top-layer aluminium interconnect lines are still covered by a passivation layer (usually silicon oxide or nitride), which protects the chip from the environment and ion migration.

On top of this, we might also find a polyimide layer that was not entirely removed by HNO3 but which can be dissolved with ethylendiamine. We have to remove the passivation layer before the probes can establish contact.

The most convenient depassivation technique is the use of a laser cutter. The UV or green laser is mounted on the camera port of the microscope and fires laser pulses through the microscope onto rectangular areas of the chip with micrometer precision. Carefully dosed laser flashes remove patches of the passivation layer.

The resulting hole in the passivation layer can be made so small that only a single bus line is exposed. This prevents accidental contacts with neighboring lines and the hole also stabilizes the position of the probe and makes it less sensitive to vibrations and temperature changes.