User talk:Zecoxao: Difference between revisions
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D79F0109 | D79F0109 | ||
( | (Audio Codec Below) | ||
WM1803E | WM1803E | ||
Revision as of 02:02, 8 September 2022
Symbols on Kernel
- 0.80 Kernel -> Number of Symbols:11540, Number of Unknown subs:2, Total:11542, Ratio: 99%
- 1.01 Kernel -> Number of Symbols:16748, Number of Unknown subs:1, Total: 16749, Ratio: 99%
- 1.01 EapCore -> Number of Symbols:11372, Number of Unknown subs:95,Total: 11467, Ratio: 99%
- 1.02 Kernel -> to look
- 1.03 Kernel -> to look
- 1.05 Kernel -> Number of Symbols:9805, Number of Unknown subs:2954, Total:12759, Ratio: 76%
- 1.05 Devkit Kernel (with Rizzo) -> Number of Symbols: 14054, Number of Unknown subs: 1347, Total: 15401
- 1.62 EapCore -> Number of Symbols:13126, Number of Unknown subs:119, Total:13245, Ratio: 99%
- 1.76 Kernel -> Number of Symbols:10383, Number of Unknown subs:2982, Total:13365, Ratio: 77%
Cavern Chip Labels
IDT6V4 1265NLG 1252L QT14H599Y MXIC X124511 MX25L25635FMI-10G -> Nor Flash (256Mbit, 32Mbyte) 8A024000A3 32.768K -> External 32K Clock E BMN Panasonic MN86471A -> HDMI Chip 248P2090 88EC120-BNS2 N6K28600 8JW -> MediaCon 1250 C0 ES TW SEC 237 HCH9 K4B4G0846B GMH146D1 F TAIWAN MB86C311B 1252 B27 E2 ARM R5F100PLA -> SysCon 1235KM412 MALAYSIA 20689DD25A0D TRS8797-E2 Rev.XX -> Wifi/Bluetooth Chip SP88W8797-MA0-2E2T00-001 CP-CC007W L-EVT2 F DC37AH FDMF 6820C ZG100273F845G -> APU Engineering Sample ES L3 S2 FL3 F377301B30114 DIFFUSED IN TAIWAN MADE IN TAIWAN IOR 3585A N249P DAF0 PW554A 2AK __G4 D85C 53123A 28K __G4 D5XX MXIC MX 25L8006E M2I-12G 3L325700 L124875 88EC060-NN82 NAX8340.19 1202 AQP TW SAMSUNG 303 K4G41325FC-HC03 - GDDR5 RAM
MTW Chip Labels
M 88E6172-TFJ2 PMK8840.1JW 1240 A1R TW PLX TECHNOLOGY USB3380-ABSONI G 1245 8598E TAIWAN GL3520 ??????????? ?????????????? WINBOND 25X10CLNIG -> usb hub firmware (1Mbit, 128KByte) 1245 53123A 24K__G4 C4KS
BRG Chip Labels
BD7763EFV 251 T52 BD9685 2421 RENESAS SCEI R8J32841FP3 -> bluray main chip 0011M 1246 21CBF759 TAIWAN
Kernel Sizes (Encrypted,Compressed)
| Version | Type | Size | Notes |
|---|---|---|---|
| GEN3-1_000_051 | devkit | 9.674.642 bytes | |
| GEN3-1_000_091 | testkit | 9.572.626 bytes | |
| GEN3-1_010_031 | testkit | 9.775.906 bytes | Similar size to 1.01 retail (diff 128 bytes) |
| GEN3-1_010_031 | devkit | 9.856.066 bytes | Larger than 1.01 retail (diff 80288 bytes) |
| GEN3-1_020_041 | testkit | 9.800.018 bytes | Larger than 1.01 retail (diff 24240 bytes) |
| 1.01 | retail | 9.775.778 bytes | Internal Symtab Inside |
| 1.05 | retail | 8.413.713 bytes | External Symtab Inside Only |
| 2.04 | retail | 9.293.121 bytes | |
| 2.50 | retail | 9.138.369 bytes |
hey do you have any more insight into the main-flash? id love some feedback whilst i am developing my nor validator.
- i do not, sorry. samu keys are required to decrypt it and they're not public
bummer, it is not fun validating and re-validating the CID by myself :(
- i like what you're doing/contributing - you're officially my new idol, seeing as EussNL has disappeared
Testkit Links
Devkit Links
Retail Links (SYS)
DEM3000P Chip Labels
Main Board IRT-002 (Unknown) TOSHIBA THGBM3G5D1FBAIE SV4979 TAIWAN 11130AE (Kermit Below) T9ML7MBG-T (Syscon Below) D79F0109 (Audio Codec Below) WM1803E CP Board GCP-002 (Unknown, Microcontroller) PIC16F724 (Unknown, Samsung Manufacturer) Samsung KLMG1DEHE - B101 (Unknown, Samsung Manufacturer) Samsung K4X2G323PC 8GD8 (Main CPU, Renesas Manufacturer) Renesas KD77630AF1 EMI-S (Emma Mobile)