User talk:Zecoxao: Difference between revisions

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* 1.01 Kernel ->  Number of Symbols:16748, Number of Unknown subs:1, Total: 16749, Ratio: 99%
* 1.01 Kernel ->  Number of Symbols:16748, Number of Unknown subs:1, Total: 16749, Ratio: 99%
* 1.01 EapCore -> Number of Symbols:11372, Number of Unknown subs:95,Total: 11467, Ratio: 99%
* 1.01 EapCore -> Number of Symbols:11372, Number of Unknown subs:95,Total: 11467, Ratio: 99%
* 1.02 Kernel -> to look
* 1.03 Kernel -> to look
* 1.05 Kernel -> Number of Symbols:9805, Number of Unknown subs:2954, Total:12759, Ratio: 76%
* 1.05 Kernel -> Number of Symbols:9805, Number of Unknown subs:2954, Total:12759, Ratio: 76%
* 1.05 Devkit Kernel (with Rizzo) -> Number of Symbols: 14054, Number of Unknown subs: 1347, Total: 15401
* 1.62 EapCore -> Number of Symbols:13126,  Number of Unknown subs:119,  Total:13245, Ratio: 99%
* 1.62 EapCore -> Number of Symbols:13126,  Number of Unknown subs:119,  Total:13245, Ratio: 99%
* 1.76 Kernel -> Number of Symbols:10383, Number of Unknown subs:2982, Total:13365, Ratio: 77%
* 1.76 Kernel -> Number of Symbols:10383, Number of Unknown subs:2982, Total:13365, Ratio: 77%
= Cavern Chip Labels =
<pre>
IDT6V4
1265NLG
1252L
QT14H599Y
MXIC X124511
MX25L25635FMI-10G -> Nor Flash (256Mbit, 32Mbyte)
8A024000A3
32.768K -> External 32K Clock
E BMN
Panasonic
MN86471A -> HDMI Chip
248P2090
88EC120-BNS2
N6K28600 8JW -> MediaCon
1250 C0 ES
TW
SEC 237 HCH9
K4B4G0846B
GMH146D1
F TAIWAN
MB86C311B
1252 B27
E2
ARM
R5F100PLA -> SysCon
1235KM412
MALAYSIA
20689DD25A0D
TRS8797-E2 Rev.XX -> Wifi/Bluetooth Chip
SP88W8797-MA0-2E2T00-001
CP-CC007W L-EVT2
F DC37AH
FDMF
6820C
ZG100273F845G -> APU Engineering Sample
ES L3 S2 FL3
F377301B30114
DIFFUSED IN TAIWAN
MADE IN TAIWAN
IOR
3585A
N249P
DAF0
PW554A
2AK __G4
D85C
53123A
28K __G4
D5XX
MXIC MX
25L8006E
M2I-12G
3L325700
L124875
88EC060-NN82
NAX8340.19
1202 AQP
TW
SAMSUNG 303
K4G41325FC-HC03 - GDDR5 RAM
</pre>
= MTW Chip Labels =
<pre>
M
88E6172-TFJ2
PMK8840.1JW
1240 A1R
TW
PLX
TECHNOLOGY
USB3380-ABSONI G
1245
8598E
TAIWAN
GL3520
???????????
??????????????
WINBOND
25X10CLNIG -> usb hub firmware (1Mbit, 128KByte)
1245
53123A
24K__G4
C4KS
</pre>
= BRG Chip Labels =
<pre>
BD7763EFV
251 T52
BD9685
2421
RENESAS SCEI
R8J32841FP3 -> bluray main chip
0011M 1246
21CBF759 TAIWAN
</pre>


= Kernel Sizes (Encrypted,Compressed) =
= Kernel Sizes (Encrypted,Compressed) =
Line 18: Line 147:
| GEN3-1_000_091 || testkit || 9.572.626 bytes ||
| GEN3-1_000_091 || testkit || 9.572.626 bytes ||
|-
|-
| GEN3-1_010_031 || testkit || 9.775.906 bytes ||
| GEN3-1_010_031 || testkit || 9.775.906 bytes || Similar size to 1.01 retail (diff 128 bytes)
|-
| GEN3-1_010_031 || devkit  || 9.856.066 bytes || Larger than 1.01 retail (diff 80288 bytes)
|-
| GEN3-1_020_041 || testkit || 9.800.018 bytes || Larger than 1.01 retail (diff 24240 bytes)
|-
| 1.01 || retail  || 9.775.778 bytes || Internal Symtab Inside
|-
| 1.05 || retail || 8.413.713 bytes || External Symtab Inside Only
|-
| 2.04 || retail || 9.293.121 bytes ||
|-
| 2.50 || retail || 9.138.369 bytes ||
|-
|-
|}
|}
hey do you have any more insight into the main-flash? id love some feedback whilst i am developing my nor validator.
* i do not, sorry. samu keys are required to decrypt it and they're not public
bummer, it is not fun validating and re-validating the CID by myself :(
* i like what you're doing/contributing - you're officially my new idol, seeing as EussNL has disappeared
= Testkit Links =
* https://disk.yandex.com/d/zB7e2AgxxMMtbQ
= Devkit Links =
* https://disk.yandex.com/d/UDvlHH1zC4FJwA
= Retail Links (SYS) =
* https://disk.yandex.com/d/yBhjiqAU-F0cYA
= DEM-3000P Chip Labels =
<pre>
Main Board IRT-002
(NAND EMMC Below)
TOSHIBA
THGBM3G5D1FBAIE
SV4979
TAIWAN
11130AE
(Kermit Below)
T9ML7MBG-T
(Syscon Below)
D79F0109
(Audio Codec Below)
WM1803E
CP Board GCP-002
(Unknown, Microcontroller)
PIC16F724
(EMMC, Samsung Manufacturer)
Samsung KLMG1DEHE - B101
(RAM, Samsung Manufacturer)
Samsung K4X2G323PC 8GD8
(Main CPU, Renesas Manufacturer)
Renesas KD77630AF1 EMI-S (Emma Mobile)
</pre>

Latest revision as of 23:01, 17 October 2023

Symbols on Kernel[edit source]

  • 0.80 Kernel -> Number of Symbols:11540, Number of Unknown subs:2, Total:11542, Ratio: 99%
  • 1.01 Kernel -> Number of Symbols:16748, Number of Unknown subs:1, Total: 16749, Ratio: 99%
  • 1.01 EapCore -> Number of Symbols:11372, Number of Unknown subs:95,Total: 11467, Ratio: 99%
  • 1.02 Kernel -> to look
  • 1.03 Kernel -> to look
  • 1.05 Kernel -> Number of Symbols:9805, Number of Unknown subs:2954, Total:12759, Ratio: 76%
  • 1.05 Devkit Kernel (with Rizzo) -> Number of Symbols: 14054, Number of Unknown subs: 1347, Total: 15401
  • 1.62 EapCore -> Number of Symbols:13126, Number of Unknown subs:119, Total:13245, Ratio: 99%
  • 1.76 Kernel -> Number of Symbols:10383, Number of Unknown subs:2982, Total:13365, Ratio: 77%

Cavern Chip Labels[edit source]

IDT6V4
1265NLG
1252L
QT14H599Y

MXIC X124511
MX25L25635FMI-10G -> Nor Flash (256Mbit, 32Mbyte)
8A024000A3

32.768K -> External 32K Clock
E BMN

Panasonic
MN86471A -> HDMI Chip
248P2090

88EC120-BNS2
N6K28600 8JW -> MediaCon
1250 C0 ES
TW

SEC 237 HCH9
K4B4G0846B
GMH146D1

F TAIWAN
MB86C311B
1252 B27
E2
ARM

R5F100PLA -> SysCon
1235KM412
MALAYSIA

20689DD25A0D
TRS8797-E2 Rev.XX -> Wifi/Bluetooth Chip
SP88W8797-MA0-2E2T00-001
CP-CC007W L-EVT2

F DC37AH
FDMF
6820C

ZG100273F845G -> APU Engineering Sample
ES L3 S2 FL3
F377301B30114
DIFFUSED IN TAIWAN
MADE IN TAIWAN

IOR
3585A
N249P
DAF0

PW554A
2AK __G4
D85C

53123A
28K __G4
D5XX

MXIC MX
25L8006E
M2I-12G
3L325700
L124875

88EC060-NN82
NAX8340.19
1202 AQP
TW

SAMSUNG 303
K4G41325FC-HC03 - GDDR5 RAM

MTW Chip Labels[edit source]

M
88E6172-TFJ2
PMK8840.1JW
1240 A1R
TW

PLX
TECHNOLOGY
USB3380-ABSONI G
1245
8598E
TAIWAN

GL3520
???????????
??????????????

WINBOND
25X10CLNIG -> usb hub firmware (1Mbit, 128KByte)
1245

53123A
24K__G4
C4KS

BRG Chip Labels[edit source]

BD7763EFV
251 T52

BD9685
2421

RENESAS SCEI
R8J32841FP3 -> bluray main chip 
0011M 1246
21CBF759 TAIWAN

Kernel Sizes (Encrypted,Compressed)[edit source]

Version Type Size Notes
GEN3-1_000_051 devkit 9.674.642 bytes
GEN3-1_000_091 testkit 9.572.626 bytes
GEN3-1_010_031 testkit 9.775.906 bytes Similar size to 1.01 retail (diff 128 bytes)
GEN3-1_010_031 devkit 9.856.066 bytes Larger than 1.01 retail (diff 80288 bytes)
GEN3-1_020_041 testkit 9.800.018 bytes Larger than 1.01 retail (diff 24240 bytes)
1.01 retail 9.775.778 bytes Internal Symtab Inside
1.05 retail 8.413.713 bytes External Symtab Inside Only
2.04 retail 9.293.121 bytes
2.50 retail 9.138.369 bytes

hey do you have any more insight into the main-flash? id love some feedback whilst i am developing my nor validator.

  • i do not, sorry. samu keys are required to decrypt it and they're not public

bummer, it is not fun validating and re-validating the CID by myself :(

  • i like what you're doing/contributing - you're officially my new idol, seeing as EussNL has disappeared

Testkit Links[edit source]

Devkit Links[edit source]

Retail Links (SYS)[edit source]

DEM-3000P Chip Labels[edit source]


Main Board IRT-002

(NAND EMMC Below)
TOSHIBA
THGBM3G5D1FBAIE
SV4979
TAIWAN
11130AE

(Kermit Below)
T9ML7MBG-T

(Syscon Below)
D79F0109

(Audio Codec Below)
WM1803E

CP Board GCP-002

(Unknown, Microcontroller)
PIC16F724

(EMMC, Samsung Manufacturer)
Samsung KLMG1DEHE - B101

(RAM, Samsung Manufacturer)
Samsung K4X2G323PC 8GD8

(Main CPU, Renesas Manufacturer)
Renesas KD77630AF1 EMI-S (Emma Mobile)
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