Thermal

CELL BE internal Powermanagement

CELL BE heatdistribution (on die)

Characteristics:

• Dynamic Power Managment with 5 power managment states

• 1 linear sensor

• 10 digital thermal sensors (8xSPE, PPE and?)

• THERM signal(s) are sent to Syscon Hardware via SMbus

Speculation:

• Readable in software?
• Attackvector for clock-slowdown?

AD51/067ARMZ-REEL (2 channel Thermal Monitor SMbus IC)

6-710-287-01 / IC1101
Used for monitoring the CELL BE

Pin	Signal	Description
1	VCC	+3.3_Thermal
2	D+	from STI_THERMAL0 via R1106 100 Ohm and C1103 0.001uF 50V
3	D-	from STI_THERMAL0 via R1107 100 Ohm and C1103 0.001uF 50V
4	/THERM
5	GND	Ground
6	/THERM2	to /SYS_THR_ALRT
7	SDATA	from THR_I2C_SDA
8	SCLK	from THR_I2C_SCL

OnSemi ADT7461A0002RMZR (2 channel Thermal Monitor SMbus IC CELL BE/RSX)

OnSemi ADT7461A0002RMZR
6-710-287-01
Used for monitoring the CELL BE (IC1101) & RSX (IC2101)

6-710-286-01 / IC2101
Used for monitoring the RSX
Datasheet: ADT7461-D.PDF

Pin	Signal	Description
1	VCC	+3.3_Thermal
2	D+	from RSX_TDR via R2101 100 Ohm and C2103 0.001uF 50V
3	D-	from RSX_TDN via R2102 100 Ohm and C2103 0.001uF 50V
4	/THERM	to RSX_GPIO6 / RSX_THR_EVENT
5	GND	Ground
6	/THERM2	to /THRRSX_SENS_ALRT
7	SDATA	from THR_I2C_SDA
8	SCLK	from THR_I2C_SCL

Template:Models