Talk:RAM

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Main System Memory

The PS3 has 256MB of 64 bit bus Rambus XDR main system memory. Some models use four 64MB Samsung chips, while other models uses four 64MB Elpida chips. Note that another 256MB of GDDR3 memory is located inside the RSX chip using four 64MB Samsung chips. The earlier models with hardware PS2 compatibility also contained an extra 32MB of RDRAM using two 16MB Samsung chips.

A sample of the Memory chips in different PS3 models:

Type Size Speed Voltage Packaging Manufacturer Serial Number Description
Rambus XDR 64MB 400MHz 1.8V+/-0.09V FBGA-104 Elpida EDX5116ACSE-3C-E 256MB total (4 chips) for PS3 System Memory (Initial Models)
Rambus XDR 64MB 400MHz 1.8V+/-0.09V FBGA-104 Samsung K4Y50164UC-JCB3 256MB total (4 chips) for PS3 System Memory (Initial Models)
Rambus XDR 64MB 400MHz 1.8V+/-0.09V FBGA-100 Samsung K4Y50164UE-JCB3 256MB total (4 chips) for PS3 System Memory (CECHG,CECHK)
Rambus XDR 64MB 400MHz 1.8V+/-0.09V FBGA-104 Elpida X5116ADSE-3C-E 256MB total (4 chips) for PS3 System Memory (CECH-20xx)
Rambus XDR 128MB 400MHz 1.5V+/-0.075V FBGA-150 Elpida X1032BASE-3C-F 256MB total (2 chips) for PS3 System Memory (CECH-21xx and later)

Elpida EDX5116ACSE-3C-E

104-ball FBGA
Elpida EDX5116ACSE-3C-E

Datasheet: Elpida EDX5116ACSE

productcode meaning:
E - Elpida Memory
D - Type : Monolithic Device
X - Product Family : XDR RAM
51 - Density : 512M (x16bit)
16 - Organisation : x16bit
A - Supply Voltage : 1.8V, DRSL
C - Die Revision: C
SE - Package : FBGA (with back cover)
-
3C - Speed : 3.2G (tRAC = 35, C Bin)
-
E - Environmental Code : Lead Free


Samsung K4Y50164UC-JCB3

100-ball FBGA
Samsung K4Y50164UC-JCB3

Datasheet: Samsung K4Y50164UC-JCB3

productcode meaning:
K - Samsung Memory
4 - DRAM
Y - Product : XDR RAM
50 - Density : 512M, 32K/16ms(0,49us)
16 - Organisation : x16
4 - Banks : 8
U - Interface : DRSL(1.8V, 1.2V)
C - Generation : 4th
-
J - Packagetype: BOC lead free
C - Temperature & Power: Commercial, Normal Power
B3 - Speed (Data frequency, tRAC, tRC) : 3.2Gbps, 35ns, 24cycles


Samsung K4Y50164UE-JCB3

104-ball FBGA
Samsung K4Y50164UE-JCB3

Datasheet: Samsung K4Y50164UE-JCB3

productcode meaning:
K - Samsung Memory
4 - DRAM
Y - Product : XDR RAM
50 - Density : 512M, 32K/16ms(0,49us)
16 - Organisation : x16
4 - Banks : 8
U - Interface : DRSL(1.8V, 1.2V)
E - Generation : 6th
-
J - Packagetype: BOC lead free
C - Temperature & Power: Commercial, Normal Power
B3 - Speed (Data frequency, tRAC, tRC) : 3.2Gbps, 35ns, 24cycles


Elpida X5116ADSE-3C-E

104-ball FBGA
Elpida X5116ADSE-3C-E

Datasheet: Elpida X5116ADSE-3C-E

productcode meaning:
X - Product Family : XDR RAM
51 - Density : 512M (x16bit)
16 - Organisation : x16bit
A - Supply Voltage : 1.8V, DRSL
D - Die Revision: D
SE - Package : FBGA (with back cover)
-
3C - Speed : 3.2G (tRAC = 35, C Bin)
-
E - Environmental Code : Lead Free


Elpida X1032BASE-3C-F

Datasheet: E1332E50 (EOL)

productcode meaning:
E - Elpida Memory
D - Type : Monolithic Device
X - Product Family : XDR RAM
13 - Density : 1Gbit (128MB) 32Mbitx32 
32 - Organisation : x32bit
B - Supply Voltage : 1.5V +/- 0.075V, DRSL
A - Die Revision: A
SE - Package : FBGA (with back cover)
-
3C - Speed : 3.2G (tRAC = 35, C Bin)
-
F - Environmental Code : Lead & Halogen Free

Graphics Memory

256MB of GDDR3 memory is located inside the RSX chip using four 64MB Samsung chips.

Type Size Speed Voltage Packaging Manufacturer Serial Number Description
GDDR3 64MB 700MHz Samsung K4J52324QC-SC14 256MB total (4 chips) for PS3 Graphics Memory

PS2 Compatibility Memory

The earlier models with hardware PS2 compatibility also contained an extra 32MB of RDRAM using two 16MB Samsung chips.

Type Size Speed Voltage Packaging Manufacturer Serial Number Description
RDRAM 16MB 800MHz 54-pin Samsung K4R271669F 32MB total (2 chips) for Hardware PS2 Compatibility System Memory

source: http://www.edepot.com/playstation3.html#PS3_Motherboard

todo: add datasheet links, more package & pad/pin info, cleanup