Talk:Flash (Hardware): Difference between revisions
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r - Lead & Halogen free</pre> | r - Lead & Halogen free</pre> | ||
Datasheet: [http://www.multiupload.com/T1TWVRYV8S AAFDEd01.pdf (1.58 MB)] | Datasheet: [http://www.multiupload.com/T1TWVRYV8S AAFDEd01.pdf (1.58 MB)] | ||
= product serial breakdown = | |||
== Macronix == | |||
=== Serial Flash === | |||
==== Device ==== | |||
<pre>25L: 3V, Serial Flash | |||
25U: 1.8V, Serial Flash | |||
25V: 2.5V, Serial Flash</pre> | |||
==== Density ==== | |||
<pre>10: 1Mb | |||
20: 2Mb | |||
40: 4Mb | |||
80: 8Mb | |||
16: 16Mb | |||
32: 32Mb | |||
64: 64 Mb | |||
128: 128Mb | |||
256/257: 256Mb</pre> | |||
==== Mode ==== | |||
<pre>05: Standard single I/O | |||
06: Single in, Dual out | |||
08: Unique ID | |||
25/26: Default lock protection | |||
33/35: MXSMIO - Multi in, Multi out | |||
36: MXSMIO - Single in, Multi out | |||
45: MXSMIO Duplex - Multi I/O with DTR | |||
55: MXSMIO - Security type</pre> | |||
==== Generation ==== | |||
==== Package Type ==== | |||
<pre>P: 300mil 8-PDIP | |||
ZN: 8-WSON (6x5mm) | |||
Z2: 8-WSON (8x6mm) | |||
ZU: 8-USON | |||
M: SOP | |||
O: 173mil 8-TSSOP | |||
XC: 24-ball TFBGA</pre> | |||
==== Temperature Range ==== | |||
<pre>I: Industrial (-40'C to 85'C) | |||
S: Automotive Grade 3 (-40'C to 85'C) | |||
R: Automotive Grade 2 (-40'C to 105'C) | |||
Q: Automotive Grade 1 (-40'C to 125'C)</pre> | |||
==== Speed ==== | |||
<pre>10: 104MHz | |||
12: 85MHz/86MHz | |||
13: 75MHz | |||
15: 66MHz | |||
20: 50MHz | |||
25: 40MHz</pre> | |||
==== Option ==== | |||
<pre>G: RoHS Compliant</pre> | |||
=== Parallel Flash === | |||
==== Device ==== | |||
<pre>29F: 5V, Parallel Flash | |||
29LV / 29GL / 68GL: 3V, Parallel Flash | |||
29LA / 29GA: Security Type, Parallel Flash</pre> | |||
==== Density ==== | |||
<pre>20x: 2Mb | |||
40x: 4Mb | |||
80x: 8Mb | |||
16x: 16Mb | |||
32x: 32Mb | |||
64x: 64 Mb | |||
12x: 128Mb | |||
25x: 256Mb | |||
51x: 512Mb</pre> | |||
==== Generation ==== | |||
==== Block Type ==== | |||
<pre>T: Top Boot | |||
B: Bottom Boot | |||
H: Uniform Sector, Highest Address Sector Protected | |||
L: Uniform Sector, Lowest Address Sector Protected | |||
U: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Highest Address Sector Protected | |||
D: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Lowest Address Sector Protected</pre> | |||
==== Package Type ==== | |||
<pre>P: 8-PDIP | |||
M: SOP | |||
Q: PLCC | |||
T/T2: TSOP | |||
XB: 0.8mm Ball Pitch / 0.3mm Ball Size | |||
XC: 1.0mm Ball Pitch / 0.4mm Ball Size | |||
XE: 0.8mm Ball Pitch / 0.4mm Ball Size | |||
XF: 1.0mm Ball Pitch / 0.6mm Ball Size | |||
XH: 0.5mm Ball Pitch / 0.3mm Ball Size | |||
GB: 0.5mm Ball Pitch / 0.25mm Ball Size | |||
XG: 0.8mm Ball Pitch / 0.4mm Ball Size</pre> | |||
==== Temperature Range ==== | |||
<pre>C: Commercial (-0'C to 70'C) | |||
I: Industrial (-40'C to 85'C) | |||
S: Automotive Grade 3 (-40'C to 85'C) | |||
R: Automotive Grade 2 (-40'C to 105'C) | |||
Q: Automotive Grade 1 (-40'C to 125'C)</pre> | |||
==== Speed ==== | |||
<pre>55: 55ns | |||
70: 70ns | |||
90: 90ns | |||
10: 100ns | |||
11: 110ns</pre> | |||
==== Option ==== | |||
<pre>G: RoHS Compliant | |||
Q: Restricted VCC: (3.0V-3.6V) RoHS Compliant</pre> |
Revision as of 02:33, 1 March 2012
shops
Buying spare NAND/NOR parts:
PSP flash
ref. : http://hitmen.c02.at/files/yapspd/psp_doc/chap3.html
FAT
TA-079 - Samsung K5E5658HCM-D060 (3.0V/2.5V) TA-080 - TA-081 - TA-082 - Samsung K5E5658ACM-D060 (1.8V/1.8V) TA-086 -
Slim
TA-085 - Sharp LR388A1 TA-088 - Sharp LR388A0 - PSP-2000
Brite
TA-090 -
Go
TA-091 - TA-094 -
X360
- Samsung K9F4G08U0M-K9F4G08U0A-K9F4G08U0B-K9F4G08U0C-K9F4G08U0D-K9F4G08U0E-K9F4G08U0Y-K9F4G08U0Z.pdf (1.05 MB) (not used in PS3, was asked in EF.net #progskeet-support (Xbox360 Jasper)
- Hynix h27ubg8t2atr (used in new glitchproof xbox 360 mobo)
H - Hynix 2 - Flash 7 - NAND u - 2.7V~3.6V VCC bg - 32Gb 8 - x8 organisation t - MLC + single die + large block 2 - 1nCE & 1 R/nB; Sequential Row Read Disable a - 2nd generation t - TSOP1 r - Lead & Halogen free
Datasheet: AAFDEd01.pdf (1.58 MB)
product serial breakdown
Macronix
Serial Flash
Device
25L: 3V, Serial Flash 25U: 1.8V, Serial Flash 25V: 2.5V, Serial Flash
Density
10: 1Mb 20: 2Mb 40: 4Mb 80: 8Mb 16: 16Mb 32: 32Mb 64: 64 Mb 128: 128Mb 256/257: 256Mb
Mode
05: Standard single I/O 06: Single in, Dual out 08: Unique ID 25/26: Default lock protection 33/35: MXSMIO - Multi in, Multi out 36: MXSMIO - Single in, Multi out 45: MXSMIO Duplex - Multi I/O with DTR 55: MXSMIO - Security type
Generation
Package Type
P: 300mil 8-PDIP ZN: 8-WSON (6x5mm) Z2: 8-WSON (8x6mm) ZU: 8-USON M: SOP O: 173mil 8-TSSOP XC: 24-ball TFBGA
Temperature Range
I: Industrial (-40'C to 85'C) S: Automotive Grade 3 (-40'C to 85'C) R: Automotive Grade 2 (-40'C to 105'C) Q: Automotive Grade 1 (-40'C to 125'C)
Speed
10: 104MHz 12: 85MHz/86MHz 13: 75MHz 15: 66MHz 20: 50MHz 25: 40MHz
Option
G: RoHS Compliant
Parallel Flash
Device
29F: 5V, Parallel Flash 29LV / 29GL / 68GL: 3V, Parallel Flash 29LA / 29GA: Security Type, Parallel Flash
Density
20x: 2Mb 40x: 4Mb 80x: 8Mb 16x: 16Mb 32x: 32Mb 64x: 64 Mb 12x: 128Mb 25x: 256Mb 51x: 512Mb
Generation
Block Type
T: Top Boot B: Bottom Boot H: Uniform Sector, Highest Address Sector Protected L: Uniform Sector, Lowest Address Sector Protected U: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Highest Address Sector Protected D: VI/O=1.65 to VCC, VCC=2.7 to 3.6V, Lowest Address Sector Protected
Package Type
P: 8-PDIP M: SOP Q: PLCC T/T2: TSOP XB: 0.8mm Ball Pitch / 0.3mm Ball Size XC: 1.0mm Ball Pitch / 0.4mm Ball Size XE: 0.8mm Ball Pitch / 0.4mm Ball Size XF: 1.0mm Ball Pitch / 0.6mm Ball Size XH: 0.5mm Ball Pitch / 0.3mm Ball Size GB: 0.5mm Ball Pitch / 0.25mm Ball Size XG: 0.8mm Ball Pitch / 0.4mm Ball Size
Temperature Range
C: Commercial (-0'C to 70'C) I: Industrial (-40'C to 85'C) S: Automotive Grade 3 (-40'C to 85'C) R: Automotive Grade 2 (-40'C to 105'C) Q: Automotive Grade 1 (-40'C to 125'C)
Speed
55: 55ns 70: 70ns 90: 90ns 10: 100ns 11: 110ns
Option
G: RoHS Compliant Q: Restricted VCC: (3.0V-3.6V) RoHS Compliant