Flash (Hardware)

Differentiation

CECHA-CECHG (Fat-old) : 2x Samsung K9F1G08U0A-PIB0 (2x1Gbit=256MB total)

CECHH-CECHQ (Fat-new) and CECH-2xxxA/B (Slim): 1x Spansion S29GL128N90TFIR2 or 1x Samsung K8Q2815UQB-PI4B

For a difference between models, see SKU Models

Samsung K9F1G08U0A-PIB0

48-pin TSOP1 Standard Type
12mm x 20mm
Samsung K9F1G08U0A-PIB0

Datasheet

productcode meaning:
K - Memory
9 - NAND Flash
F - Small Classification : SLC Normal
1G - Density : 1Gigabit (128MB)
0 - Technology : Normal (x8)
8 - Organisation : x8
U - Vcc Supply Voltage : min 2.7V - Max 3.6V / typ. 3.3V
0 - Mode : Normal
A - Generation : 2nd
-
P - Package : 48pin TSOP1 (12mm x 20mm / 0.5mm pitch)) Lead-free
I - Temperature : Industrial
B - Customer Bad Block : Include Bad Block
0 - PreProgram Version : None

Pin	Usage	Remarks
1	NC	No Connection
2	NC	No Connection
3	NC	No Connection
4	NC	No Connection
5	NC	No Connection
6	NC	No Connection
7	R/B	Read/Busy Output
8	RE	Read Enable
9	CE	Chip Enable
10	NC	No Connection
11	NC	No Connection
12	Vcc	Vcc (min 2.7V-max 3.6V / typ 3.3V)
13	Vss	Ground
14	NC	No Connection
15	NC	No Connection
16	CLE	Command Latch Enable
17	ALE	Address Latch Enable
18	WE	Write Enable
19	WP	Write Protect
20	NC	No Connection
21	NC	No Connection
22	NC	No Connection
23	NC	No Connection
24	NC	No Connection

Pin	Usage	Remarks
25	NC	No Connection
26	NC	No Connection
27	NC	No Connection
28	NC	No Connection
29	I/O0
30	I/O1
31	I/O2
32	I/O3
33	NC	No Connection
34	NC	No Connection
35	NC	No Connection
36	Vss	Ground
37	Vcc	Vcc (min 2.7V-max 3.6V / typ 3.3V)
38	NC	No Connection
39	NC	No Connection
40	NC	No Connection
41	I/O4
42	I/O5
43	I/O6
44	I/O7
45	NC	No Connection
46	NC	No Connection
47	NC	No Connection
48	NC	No Connection

Spansion S29GL128N90TFIR2

56-pin TSOP1 Standard Type
14mm x 20mm
Spansion S29GLxxxN

Datasheet

productcode meaning:
S29GL128N - 3.0 Volt-only, 512 Megabit (32M x 16-bit/64Mx8-bit), Page-Mode, Flash Memory, 110nm
90 - Speed option : 90ns
T - Package type: TSOP
F - Package materials set : Lead-free
I - Temperature range : Industrial
R2 - ?Vio = 2.7 to 3.6V, lowest address sector protected?

Pin	Usage	Remarks
1	A23	No Connection for S29GL128N
2	A22
3	A15
4	A14
5	A13
6	A12
7	A11
8	A10
9	A9
10	A8
11	A19
12	A20
13	WE#	Write Enable
14	RESET#	Reset
15	A21
16	WP#/ACC	Write Protect / Accelerated Program Operation
17	RD/BY#	Ready/Busy Output
18	A18
19	A17
20	A7
21	A6
22	A5
23	A4
24	A3
25	A2
26	A1
27	NC	No Connection
28	NC	No Connection

Pin	Usage	Remarks
29	Vio	Vio - Output Buffer Power
30	NC	No Connection
31	A0
32	CE#	Chip Enable
33	VSS	Ground
34	OE#	Output Enable
35	DQ0
36	DQ8
37	DQ1
38	DQ9
39	DQ2
40	DQ10
41	DQ3
42	DQ11
43	Vcc	Vcc (min 2.7V-max 3.6V / typ 3.0V)
44	DQ4
45	DQ12
46	DQ5
47	DQ13
48	DQ6	*OTP?
49	DQ14
50	DQ7	*OTP?
51	DQ15/A-1
52	VSS	Ground
53	#BYTE	BYTE# Selects 8-bit or 16-bit mode (NC on Samsung NOR)
54	A16
55	NC	No Connection
56	A24	No Connection for S29GL128N and S29GL256N

Samsung K8Q2815UQB-PI4B

56-pin TSOP1 Standard Type
14mm x 20mm

Datasheet

productcode meaning:
K - Memory
8 - NOR Flash
Q - Small Classification : Page Mode DDP
28 - Density : 128M, 8M / 16Bank / 8^8
15 - Dual Bank Boot Block (Bank1, Bank2) : 16M, 2M / 14M
U - Vcc : 3.0V / 3.3V (2.7V~3.6V)
Q - Device Type: Yop and Bottom Boot Block
B - Generation : 3rd Generation
-
P - Package : TSOP1 (Lead Free)
I - Temp : Industrial
4B - Speed : 60ns/25ns (Page)

Pin	Usage	Remarks
1	NC	No Connection
2	A22
3	A15
4	A14
5	A13
6	A12
7	A11
8	A10
9	A9
10	A8
11	A19
12	A20
13	WE	Write Enable
14	RESET	Reset
15	A21
16	WP/ACC	Write Protect / Accelerated Program Operation
17	RD/BY	Ready/Busy Output
18	A18
19	A17
20	A7
21	A6
22	A5
23	A4
24	A3
25	A2
26	A1
27	NC	No Connection
28	NC	No Connection

Pin	Usage	Remarks
29	VCCQ	VccQ
30	NC	No Connection
31	A0
32	CE	Chip Enable
33	VSS	Ground
34	OE	Output Enable
35	DQ0
36	DQ8
37	DQ1
38	DQ9
39	DQ2
40	DQ10
41	DQ3
42	DQ11
43	Vcc	Vcc (min 2.7V-max 3.6V / typ 3.0V)
44	DQ4
45	DQ12
46	DQ5
47	DQ13
48	DQ6	*OTP?
49	DQ14
50	DQ7	*OTP?
51	DQ15
52	VSS	Ground
53	NC	No Connection
54	A16
55	NC	No Connection
56	NC	No Connection

• OTP Block Region : 256-word Flash memory region. The data DQ6=1 for customer locked and DQ7=1 for factory locked

Other

Renesas HN58X2504TIE

8-pin TSSOP
Renesas HN58X2504TIE

Datasheet

productcode meaning:
H - 
N - 
5 -
8 - Organisation : x8bit
X - 
2 - 
5 - 
0 - 
4 - Density : 4-kbit (512x8bit)
T - Package : 8pin plastic TSSOP (TTP-8DAV)
I - Temp : Industrial (-40 to +85 °C 
E - Environment : Lead Free

Each PS3 has a special EEPROM chip on the motherboard using a SPI Serial Interface Renasas chip.

Type	Size	Speed	Voltage	Packaging	Manufacturer	Serial Number	Description
EEPROM	4-kbit (512x8bit)	3MHz	1.8V to 5.5V	8-pin TSSOP	Renesas	HN58X2504TIE	PS3 EEPROM chip

Pin	Usage	Remarks
1	S	Chip Select
2	Q	Serial data output
3	W	Write Protect
4	VSS	Ground
5	D	Serial data input
6	C	Serial Clock
7	HOLD	Hold
8	VCC	Vcc (min 1.8V-max 5.5V)