Flash (Hardware)

Flash

The PS3 uses a NOR interface from the South Bridge to address the main firmware flash. On NAND based consoles, it uses the Starship2 as an interleaving bridge chip to the two NAND flash, while on NOR based consoles the single NOR flash is connected directly to the South Bridge.

SKU Differentiation

For a difference between models, see SKU Models

Retail

CECHA/COK-001 up to including CECHE/COK-002W : 2x Samsung K9F1G08U0A-PIB0 (NAND 2x1Gbit=256MB total)

CECHG/SEM-001 : 2x Samsung K9F1G08UOB-PIB0 (NAND 2x1Gbit=256MB total)

CECHH/DIA-001 up to including CECHK/DIA-002 : 1x Spansion S29GL128N90TFIR2 (NOR 16MB)

CECHL/VER-001 (1-878-196-31) : 1x Spansion S29GL128P90TFIR2 (NOR 16MB)

CECHL/VER-001 and PS3 Slim 2... : 1x Samsung K8Q2815UQB-PI4B (NOR 16MB)

CECH-20../DYN-001 (1-880-055-31) : 1x Samsung K8Q2815UQB-PI4B (NOR 16MB)

CECH-20../DYN-001 (1-880-055-??) : 1x Macronix MX29GL128ELT2I-90G (NOR Flash)

CECH-250../JTP-001 : 1x Spansion S29GL128P90TFIR2 (NOR 16MB)

CECH-250../JSD-001 : 1x Samsung K8P2716UZC-QI4D (NOR 16MB)

CECH-30../KTE-001 : 1x Spansion S29GL128P90TFIR2 (NOR 16MB) -OR- (conflicting reports) 1x Macronix MX29GL128ELT2I-90G (NOR Flash)

Non Retail

Reference Tool DECR1000A Communication Processor board : 1x Samsung K9F2G08U0M (NAND 1x2Gbit=256MB total)

Pinout Flash chips

NAND

Samsung K9F1G08U0A-PIB0 or K9F1G08UOB-PIB0 (NAND)

48-pin TSOP1 Standard Type
12mm x 20mm
Samsung K9F1G08U0A-PIB0

One of the 2 Samsung K9F1G08U0A-PIB0 on a NAND based FAT

Datasheet

productcode meaning:
K - Memory
9 - NAND Flash
F - Small Classification : SLC Normal
1G - Density : 1Gigabit (128MB)
0 - Technology : Normal (x8)
8 - Organisation : x8
U - Vcc Supply Voltage : min 2.7V - Max 3.6V / typ. 3.3V
0 - Mode : Normal
A - Generation : 2nd
-
P - Package : 48pin TSOP1 (12mm x 20mm / 0.5mm pitch)) Lead-free
I - Temperature : Industrial
B - Customer Bad Block : Include Bad Block
0 - PreProgram Version : None

Pin Usage Remarks 1 NC No Connection 2 NC No Connection 3 NC No Connection 4 NC No Connection 5 NC No Connection 6 NC No Connection 7 R/B Read/Busy Output 8 RE Read Enable 9 CE Chip Enable 10 NC No Connection 11 NC No Connection 12 Vcc Vcc (min 2.7V-max 3.6V / typ 3.3V) 13 Vss Ground 14 NC No Connection 15 NC No Connection 16 CLE Command Latch Enable 17 ALE Address Latch Enable 18 WE Write Enable 19 WP Write Protect 20 NC No Connection 21 NC No Connection 22 NC No Connection 23 NC No Connection 24 NC No Connection

Pin Usage Remarks 48 NC No Connection 47 NC No Connection 46 NC No Connection 45 NC No Connection 44 I/O7 43 I/O6 42 I/O5 41 I/O4 40 NC No Connection 39 NC No Connection 38 NC No Connection 37 Vcc Vcc (min 2.7V-max 3.6V / typ 3.3V) 36 Vss Ground 35 NC No Connection 34 NC No Connection 33 NC No Connection 32 I/O3 31 I/O2 30 I/O1 29 I/O0 28 NC No Connection 27 NC No Connection 26 NC No Connection 25 NC No Connection

Samsung K9F2G08U0M (NAND)

1x 2 Gbit NAND as used on Reference Tool DECR1000A Communication Processor board

Samsung K9F2G08U0M
48-pin TSOP1 Standard Type 12mm x 20mm
used on Reference Tool DECR1000A Communication Processor board

Datasheet

productcode meaning:
K - Memory
9 - NAND Flash
F - Small Classification : SLC Normal
2G - Density : 2Gigabit (256MB)
0 - Technology : Normal (x8)
8 - Organisation : x8
U - Vcc Supply Voltage : min 2.7V - Max 3.6V / typ. 3.3V
0 - Mode : Normal
M - Generation : 
-
?P - Package : 48pin TSOP1 (12mm x 20mm / 0.5mm pitch)) Lead-free
?I - Temperature : Industrial
?B - Customer Bad Block : Include Bad Block
?0 - PreProgram Version : None

Pin Usage Remarks 1 NC No Connection 2 NC No Connection 3 NC No Connection 4 NC No Connection 5 NC No Connection 6 NC No Connection 7 R/B Read/Busy Output 8 RE Read Enable 9 CE Chip Enable 10 NC No Connection 11 NC No Connection 12 Vcc Vcc (min 2.7V-max 3.6V / typ 3.3V) 13 Vss Ground 14 NC No Connection 15 NC No Connection 16 CLE Command Latch Enable 17 ALE Address Latch Enable 18 WE Write Enable 19 WP Write Protect 20 NC No Connection 21 NC No Connection 22 NC No Connection 23 NC No Connection 24 NC No Connection

Pin Usage Remarks 48 NC No Connection 47 NC No Connection 46 NC No Connection 45 NC No Connection 44 I/O7 43 I/O6 42 I/O5 41 I/O4 40 NC No Connection 39 NC No Connection 38 PRE Power-On Read Enable PRE controls auto read operation executed during power-on. Power-on auto-read is enabled when PRE pin is tied to VCC. 37 Vcc Vcc (min 2.7V-max 3.6V / typ 3.3V) 36 Vss Ground 35 NC No Connection 34 NC No Connection 33 NC No Connection 32 I/O3 31 I/O2 30 I/O1 29 I/O0 28 NC No Connection 27 NC No Connection 26 NC No Connection 25 NC No Connection

NOR

Spansion S29GL128N90TFIR2 or S29GL128P90TFIR2 (NOR)

56-pin TSOP1 Standard Type
14mm x 20mm
Spansion S29GLxxxN

Datasheet

productcode meaning:
S29GL128N - 3.0 Volt-only, 512 Megabit (32M x 16-bit/64Mx8-bit), Page-Mode, Flash Memory, 110nm
90 - Speed option : 90ns
T - Package type: TSOP
F - Package materials set : Lead-free
I - Temperature range : Industrial
R2 - ?Vio = 2.7 to 3.6V, lowest address sector protected?

Pin	Usage	Remarks
1	A23	No Connection for S29GL128N
2	A22
3	A15
4	A14
5	A13
6	A12
7	A11
8	A10
9	A9
10	A8
11	A19
12	A20
13	WE#	Write Enable
14	RESET#	Reset
15	A21
16	WP#/ACC	Write Protect / Accelerated Program Operation
17	RD/BY#	Ready/Busy Output
18	A18
19	A17
20	A7
21	A6
22	A5
23	A4
24	A3
25	A2
26	A1
27	NC	No Connection
28	NC	No Connection

Pin	Usage	Remarks
29	Vio	Vio - Output Buffer Power
30	NC	No Connection
31	A0
32	CE#	Chip Enable
33	VSS	Ground
34	OE#	Output Enable
35	DQ0
36	DQ8
37	DQ1
38	DQ9
39	DQ2
40	DQ10
41	DQ3
42	DQ11
43	Vcc	Vcc (min 2.7V-max 3.6V / typ 3.0V)
44	DQ4
45	DQ12
46	DQ5
47	DQ13
48	DQ6	*OTP?
49	DQ14
50	DQ7	*OTP?
51	DQ15/A-1
52	VSS	Ground
53	#BYTE	BYTE# Selects 8-bit or 16-bit mode (NC on Samsung NOR)
54	A16
55	NC	No Connection
56	A24	No Connection for S29GL128N and S29GL256N

Samsung K8Q2815UQB-PI4B (NOR)

56-pin TSOP1 Standard Type
14mm x 20mm

Samsung K8Q2815UQB-PI4B (NOR) as seen on modern PS3 Slim

Datasheet

productcode meaning:
K - Memory
8 - NOR Flash
Q - Small Classification : Page Mode DDP
28 - Density : 128M, 8M / 16Bank / 8^8
15 - Dual Bank Boot Block (Bank1, Bank2) : 16M, 2M / 14M
U - Vcc : 3.0V / 3.3V (2.7V~3.6V)
Q - Device Type: Top and Bottom Boot Block
B - Generation : 3rd Generation
-
P - Package : TSOP1 (Lead Free)
I - Temp : Industrial
4B - Speed : 60ns/25ns (Page)

NOTE

Multiple Bank architectures (8 banks)
- Bank 0 : 8Mbit (4Kw x 8 and 32Kw x 15)
- Bank 1 :24Mbit (32Kw x 48)
- Bank 2 : 24Mbit (32Kw x 48)
- Bank 3 : 8Mbit (4Kw x 8 and 32Kw x 15)
- Bank 4 : 8Mbit (4Kw x 8 and 32Kw x 15)
- Bank 5 :24Mbit (32Kw x 48)
- Bank 6 : 24Mbit (32Kw x 48)
- Bank 7 : 8Mbit (4Kw x 8 and 32Kw x 15)
OTP Block : Extra 256 word
- 128word for factory and 128word for customer OTP

Pin	Usage	Remarks
1	NC	No Connection
2	A22
3	A15
4	A14
5	A13
6	A12
7	A11
8	A10
9	A9
10	A8
11	A19
12	A20
13	WE	Write Enable
14	RESET	Reset
15	A21
16	WP/ACC	Write Protect / Accelerated Program Operation
17	RD/BY	Ready/Busy Output
18	A18
19	A17
20	A7
21	A6
22	A5
23	A4
24	A3
25	A2
26	A1
27	NC	No Connection
28	NC	No Connection

Pin	Usage	Remarks
29	VCCQ	VccQ
30	NC	No Connection
31	A0
32	CE	Chip Enable
33	VSS	Ground
34	OE	Output Enable
35	DQ0
36	DQ8
37	DQ1
38	DQ9
39	DQ2
40	DQ10
41	DQ3
42	DQ11
43	Vcc	Vcc (min 2.7V-max 3.6V / typ 3.0V)
44	DQ4
45	DQ12
46	DQ5
47	DQ13
48	DQ6	*OTP?
49	DQ14
50	DQ7	*OTP?
51	DQ15
52	VSS	Ground
53	NC	No Connection
54	A16
55	NC	No Connection
56	NC	No Connection

• OTP Block Region : 256-word Flash memory region. The data DQ6=1 for customer locked and DQ7=1 for factory locked

Samsung K8P2716UZC-QI4D (NOR)

Samsung K8P2716UZC-QI4D as seen on some JSD-001 boards

Datasheet

productcode meaning:
K - Memory
8 - NOR Flash
P
27 - Density : 
18 - Dual Bank Boot Block : 
U - Vcc : 3.0V / 3.3V (2.7V~3.6V)
Z - Device Type: 
C - Generation : 4rd Generation
-
Q - Package : 
I - Temp : Industrial
4D - Speed : 

Macronix MX29GL128ELT2I-90G (NOR)

56-pin TSOP1 Standard Type
14mm x 20mm

Macronix MX29GL128ELT2I-90G (NOR) as seen on CECH-30.. according to some sources

Datasheet

productcode meaning:
MX29GL Series
3V
128 Mb
16M x 8/8M x 16
90ns
Parallel Flash
TSOP-56

Pin	Usage	Remarks
1	NC	No Connection
2	A22
3	A15
4	A14
5	A13
6	A12
7	A11
8	A10
9	A9
10	A8
11	A19
12	A20
13	WE#	Write Enable
14	RESET#	Reset
15	A21
16	WP#/ACC	Write Protect / Accelerated Program Operation
17	RD/BY#	Ready/Busy Output
18	A18
19	A17
20	A7
21	A6
22	A5
23	A4
24	A3
25	A2
26	A1
27	NC	No Connection
28	NC	No Connection

Pin	Usage	Remarks
29	VI/O	Vcc I/O (min 2.7V-max 3.6V / typ 3.0V)
30	NC	No Connection
31	A0
32	CE#	Chip Enable
33	GND	Ground
34	OE#	Output Enable
35	Q0
36	Q8
37	Q1
38	Q9
39	Q2
40	Q10
41	Q3
42	Q11
43	Vcc	Vcc (min 2.7V-max 3.6V / typ 3.0V)
44	Q4
45	Q12
46	Q5
47	Q13
48	Q6
49	Q14
50	Q7
51	Q15/A-1	Q15 (Word Mode) / LSB addr (Byte Mode)
52	GND	Ground
53	BYTE#	Selects 8bits or 16bits mode
54	A16
55	NC	No Connection
56	NC	No Connection

Pinout Other

Renesas HN58X2504TIE (EEPROM)

8-pin TSSOP
Renesas HN58X2504TIE

Note: although edepot&others lists it on the board, I can only find this IC in the sixaxis.
Datasheet

productcode meaning:
H - 
N - 
5 -
8 - Organisation : x8bit
X - 
2 - 
5 - 
0 - 
4 - Density : 4-kbit (512x8bit)
T - Package : 8pin plastic TSSOP (TTP-8DAV)
I - Temp : Industrial (-40 to +85 °C 
E - Environment : Lead Free

Each PS3 has a special EEPROM chip on the motherboard using a SPI Serial Interface Renasas chip.

Type	Size	Speed	Voltage	Packaging	Manufacturer	Serial Number	Description
EEPROM	4-kbit (512x8bit)	3MHz	1.8V to 5.5V	8-pin TSSOP	Renesas	HN58X2504TIE	PS3 EEPROM chip

Pin	Usage	Remarks
1	S	Chip Select
2	Q	Serial data output
3	W	Write Protect
4	VSS	Ground
5	D	Serial data input
6	C	Serial Clock
7	HOLD	Hold
8	VCC	Vcc (min 1.8V-max 5.5V)