RAM

XDR-quad to CELLBE to SouthBridge diagram of PS3 FAT and early PS3 Slim's CECH-20..A/DYN-001

XDR-dual to CELLBE to SouthBridge diagram since CECH-21..A/SUR-001

Main System Memory

The PS3 has 256MB of 64 bit bus Rambus XDR main system memory. Some models use four 64MB Samsung chips, while other models uses four 64MB Elpida chips.

A sample of the Memory chips in different PS3 models:

Type	Size	Speed	Voltage	Packaging	Manufact.	Serial Number	Amount	Models
Rambus XDR	64MB	400MHz	1.8V+/-0.09V	FBGA-104	Elpida	X5116AC-SE-3C-E	4x	CECHA/COK-001 up to including CECHG/SEM-001
Rambus XDR	64MB	400MHz	1.8V+/-0.09V	FBGA-104	Samsung	K4Y50164UC-JCB3	4x	?Some initial models?
Rambus XDR	64MB	400MHz	1.8V+/-0.09V	FBGA-100	Samsung	K4Y50164UE-JCB3	4x	CECHJ/DIA-002 and CECHK/DIA-002
Rambus XDR	64MB	400MHz	1.8V+/-0.09V	FBGA-104	Elpida	X5116ADSE-3C-E	4x	CECHH/DIA-001, CECHL/VER-001 up and including CECHQ/VER-001 and PS3 Slim CECH-20..A/DYN-001
Rambus XDR	128MB	400MHz	1.5V+/-0.075V	FBGA-150	Elpida	X1032BASE-3C-F	2x	CECH-21..A/SUR-001

Elpida X5116AC-SE-3C-E

104-ball FBGA
Elpida X5116AC-SE-3C-E

Datasheet: Elpida X5116AC-SE-3C-E

productcode meaning:
E - Elpida Memory
D - Type : Monolithic Device
X - Product Family : XDR RAM
51 - Density : 512M (x16bit)
16 - Organisation : x16bit
A - Supply Voltage : 1.8V, DRSL
C - Die Revision: C
SE - Package : FBGA (with back cover)
-
3C - Speed : 3.2G (tRAC = 35, C Bin)
-
E - Environmental Code : Lead Free

Samsung K4Y50164UC-JCB3

104-ball FBGA
Samsung K4Y50164UC-JCB3

Datasheet: Samsung K4Y50164UC-JCB3

productcode meaning:
K - Samsung Memory
4 - DRAM
Y - Product : XDR RAM
50 - Density : 512M, 32K/16ms(0,49us)
16 - Organisation : x16
4 - Banks : 8
U - Interface : DRSL(1.8V, 1.2V)
C - Generation : 4th
-
J - Packagetype: BOC lead free
C - Temperature & Power: Commercial, Normal Power
B3 - Speed (Data frequency, tRAC, tRC) : 3.2Gbps, 35ns, 24cycles

Samsung K4Y50164UE-JCB3

(CECHG,CECHK)

100-ball FBGA
Samsung K4Y50164UE-JCB3

Datasheet: Samsung K4Y50164UE-JCB3

productcode meaning:
K - Samsung Memory
4 - DRAM
Y - Product : XDR RAM
50 - Density : 512M, 32K/16ms(0,49us)
16 - Organisation : x16
4 - Banks : 8
U - Interface : DRSL(1.8V, 1.2V)
E - Generation : 6th
-
J - Packagetype: BOC lead free
C - Temperature & Power: Commercial, Normal Power
B3 - Speed (Data frequency, tRAC, tRC) : 3.2Gbps, 35ns, 24cycles

Elpida X5116ADSE-3C-E

(CECH-20xx)

104-ball FBGA
Elpida X5116ADSE-3C-E

Datasheet: Elpida X5116ADSE-3C-E

productcode meaning:
X - Product Family : XDR RAM
51 - Density : 512M (x16bit)
16 - Organisation : x16bit
A - Supply Voltage : 1.8V, DRSL
D - Die Revision: D
SE - Package : FBGA (with back cover)
-
3C - Speed : 3.2G (tRAC = 35, C Bin)
-
E - Environmental Code : Lead Free

Elpida X1032BASE-3C-F

(CECH-21xx and later)

Datasheet: E1332E50 (EOL)

productcode meaning:
E - Elpida Memory
D - Type : Monolithic Device
X - Product Family : XDR RAM
13 - Density : 1Gbit (128MB) 32Mbitx32 
32 - Organisation : x32bit
B - Supply Voltage : 1.5V +/- 0.075V, DRSL
A - Die Revision: A
SE - Package : FBGA (with back cover)
-
3C - Speed : 3.2G (tRAC = 35, C Bin)
-
F - Environmental Code : Lead & Halogen Free

Graphics Memory

Quad 64MB GDDR3 (256MB total) to RSX to CellBE diagram

RSX bare die
GPU in centre
4x GDDR3

The 256MB of GDDR3 memory is located inside the RSX chip using four 64MB FBGA chips.

Type	Size	Speed	Voltage	Packaging	Manufacturer	Serial Number	Description
GDDR3	64MB (512Mbit)	700MHz	2.0V +/-0.1V	FBGA-136 on-die	Samsung	K4J52324QC-SC14	256MB total (4 chips) for PS3 Graphics Memory
GDDR3	64MB (512Mbit)	700MHz	2.0V +/-0.1V	FBGA-136 on-die	Qimonda	HYB18H512322AF-14	256MB total (4 chips) for PS3 Graphics Memory (later models)

Samsung K4J52324QC-SC14

FBGA-136 / on-die
Samsung K4J52324QC-SC14

Datasheet: Samsung K4J52324QC-SC14

productcode meaning:
K - Samsung Memory
4 - DRAM
J - Product : GDDR3 RAM
52 - Density : 512M, 32ms, 8K
32 - Organisation : x32
4 - Banks : 8
Q - Interface : DRSL(1.8V, 1.2V)
C - Generation : 4th
-
S - Packagetype: BOC lead
C - Temperature & Power: Commercial, Normal Power (1.8V +/- 0.1V)
14 - Speed (Data frequency, tRAC, tRC) : 1.4Gbps

Qimonda HYB18H512322AF-14

FBGA-136 / on-die
Qimonda HYB18H512322AF-14

datasheet: unavailable

productcode meaning:
H
Y
B
1
8
H
512 - Density : 512M (16M x 32)
32 - Organisation : x32
2
A
F
-
14- Speed (Data frequency, tRAC, tRC) : 1.4Gbps

Other XDR Rambus references

• CellBE_HIG_65nm_v1.01_8Jun2007.pdf
• BE_Hardwar_Init_Guide_v1.3_31March2006.pdf
• Rambus XDR IO Cell (XIO) - dl_0362_v0_71.pdf
• XDR Architecture - Rambus dl_0161_v0_8.pdf
• 8x4Mx16/8/4/2 - Rambus xdr_dl_0476.pdf
• XDR Clock Generator - Rambus dl_0169l_v0_81.pdf
• dl_0178_v0_93.pdf (january 2006)
• dl_0178_v0_95.pdf (august 2006)

PS2 Compatibility Memory

See: PS2 Compatibility