Editing Syscon Error Codes
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**[[Thermal#Temperature_Monitors|Temperature Monitors]] | **[[Thermal#Temperature_Monitors|Temperature Monitors]] | ||
Some PS3 motherboards ([[TMU-520]], [[COK-001]], [[COK-002]]), have a temperature monitor located somewhere in the CELL power block. The other retail PS3 motherboard models | Some PS3 motherboards ([[TMU-520]], [[COK-001]], [[COK-002]]), have a temperature monitor located somewhere in the CELL power block. The other retail PS3 motherboard models doesnt meassures the temperature of the CELL VR | ||
All the PS3 temperature monitor chips have a internal thermal sensor integrated + 2 pins for an optional external sensor. The temperature monitors for CELL and RSX are configured to use the external sensor, but this one for CELL VR probably uses the internal | All the PS3 temperature monitor chips have a internal thermal sensor integrated + 2 pins for an optional external sensor. The temperature monitors for CELL and RSX are configured to use the external sensor, but this one for CELL VR probably uses the internal | ||
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As the console cools the microscopic gaps in the solder can be physically reconnected by thermal warping. Warping is due to differences in the Coefficients of Thermal Expansion (CTE) between materials in the motherboard and processor. This expansion and contraction can reconnect the solder joints just enough to allow the console to boot. Or it may disconnect them. | As the console cools the microscopic gaps in the solder can be physically reconnected by thermal warping. Warping is due to differences in the Coefficients of Thermal Expansion (CTE) between materials in the motherboard and processor. This expansion and contraction can reconnect the solder joints just enough to allow the console to boot. Or it may disconnect them. | ||
*If they reconnected, the console will boot until it | *If they reconnected, the console will boot until it experiances another 1601/1701 event. | ||
*It they do not reconnect, the console cannot complete BitTraining and will fail in POST with error A0403034. Often with an associated Data error, such as A0404401 (if the broken solder joint affected a Data line on one of the SPI lines). If there is no Data error, the broken joint only affected the voltage for the SPI line. Either RSX_VDDR or YC_RC_VDDIO. | *It they do not reconnect, the console cannot complete BitTraining and will fail in POST with error A0403034. Often with an associated Data error, such as A0404401 (if the broken solder joint affected a Data line on one of the SPI lines). If there is no Data error, the broken joint only affected the voltage for the SPI line. Either RSX_VDDR or YC_RC_VDDIO. | ||
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*To calibrate the FlexIO interface (BitTraining). | *To calibrate the FlexIO interface (BitTraining). | ||
If Attention occurs during the Power ON State (Step# 80) it indicates an error condition. Basically, something is flagged by the Processor as abnormal. It's forced to attempt to resolve the problem before it can continue with whatever it was trying to do. If the error condition cannot be resolved, the CPU sends the ATTENTION signal to the SYSCON. The SYSCON immediately shuts off the console, then reads the SPI Status Register to | If Attention occurs during the Power ON State (Step# 80) it indicates an error condition. Basically, something is flagged by the Processor as abnormal. It's forced to attempt to resolve the problem before it can continue with whatever it was trying to do. If the error condition cannot be resolved, the CPU sends the ATTENTION signal to the SYSCON. The SYSCON immediately shuts off the console, then reads the SPI Status Register to determin the cause. Then it records the A0801701 in it's errorlog along with the specific cause (if it determined one). Errors that can cause the Attention include: | ||
*Unresolved Checkstop errors (14FF) | *Unresolved Checkstop errors (14FF) | ||
*Livelock Detection (1601) | *Livelock Detection (1601) | ||
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*BGA/Bump Defect that occurs while the Console was On (Step# 80). Subsequent attempts to power on the console would result in 3034/4xxx errors. | *BGA/Bump Defect that occurs while the Console was On (Step# 80). Subsequent attempts to power on the console would result in 3034/4xxx errors. | ||
A user get this error code with a damaged hard drive. He was | A user get this error code with a damaged hard drive. He was transfering some games via FTP, and his console turned off with Ylod. When he tried to turn on again, he get a Glod. Problem was fixed just by changing the HDD. | ||
1701 has been reported from using homebrew apps that caused a software conflict. Uninstalling the software can resolve the issue. It that's not possible because the system is locked up, it may be necessary to restore the operating system (OS). | 1701 has been reported from using homebrew apps that caused a software conflict. Uninstalling the software can resolve the issue. It that's not possible because the system is locked up, it may be necessary to restore the operating system (OS). | ||
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=== Fatal Errors === | === Fatal Errors === | ||
---- | ---- | ||
*This fatal error codes seems to be repeated up to 3 times for 3 special cases, as example, errors '''20'''03, '''21'''03, and '''22'''03 are related with southbridge, the only thing that changes in the error code is the second digit (located | *This fatal error codes seems to be repeated up to 3 times for 3 special cases, as example, errors '''20'''03, '''21'''03, and '''22'''03 are related with southbridge, the only thing that changes in the error code is the second digit (located inmediatly after the category 2). If at some point we find what means that second digit we can join the wiki page sections together (with titles: "2001 & 2101", "2002 & 2102", "2003 & 2103", etc...)<br> | ||
In other words, there are 3 groups: '''20xx''' (composed by 13 errors), '''21xx''' (composed by 13 errors), and '''22xx''' (composed by 1 error). See {{Talk}} | In other words, there are 3 groups: '''20xx''' (composed by 13 errors), '''21xx''' (composed by 13 errors), and '''22xx''' (composed by 1 error). See {{Talk}} | ||
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==== 2102 (RSX) ==== | ==== 2102 (RSX) ==== | ||
[[RSX]] (IC2001) | [[RSX]] (IC2001) | ||
I had detected a short in the CELL, after removing one of the NEC/ | I had detected a short in the CELL, after removing one of the NEC/TOKINS, the error had changed. | ||
After applying slight pressure to the CELL, I used some thermal pads to create the pressure. 5 small, 1 mm pads, and two larger 2mm pads, the same size and depth as the ones used on the southbridge chip) The console now boots and runs without any issues. | After applying slight pressure to the CELL, I used some thermal pads to create the pressure. 5 small, 1 mm pads, and two larger 2mm pads, the same size and depth as the ones used on the southbridge chip) The console now boots and runs without any issues. | ||
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Usually this caused by a bad Power Supply Unit (PSU). | Usually this caused by a bad Power Supply Unit (PSU). | ||
Alternatively, a failure on the 12v_main line can cause it. Check fuses, capacitors, resistors, and | Alternatively, a failure on the 12v_main line can cause it. Check fuses, capacitors, resistors, and IC's on the 12v line. Measure resistance of the large 2 prong 12v connector on the motherboard. It should read in the Kilo ohms range if there is sufficient separation. Otherwise you may have a short somewhere on the line. | ||
====3002==== | ====3002==== | ||
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====3003 ([[CELL BE|CELL]] Core Power Failure)==== | ====3003 ([[CELL BE|CELL]] Core Power Failure)==== | ||
This error will occur in the case of a PWR failure on the main core voltage of the CPU (VDDC). For example, if the filtering capacitors (NEC/ | This error will occur in the case of a PWR failure on the main core voltage of the CPU (VDDC). For example, if the filtering capacitors (NEC/TOKIN's) are severely damaged. There are other SMD's in that filter, so it could be related to them as well. | ||
A shorted Blu-Ray drive can cause this error as well. Be sure that your drive is going well before doing anything on your console. | A shorted Blu-Ray drive can cause this error as well. Be sure that your drive is going well before doing anything on your console. | ||
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====3004 ([[RSX]] Core Power Failure)==== | ====3004 ([[RSX]] Core Power Failure)==== | ||
This error will occur in the case of a PWR failure on the main core voltage of the GPU (VDDC). For example, if the filtering capacitors (NEC/ | This error will occur in the case of a PWR failure on the main core voltage of the GPU (VDDC). For example, if the filtering capacitors (NEC/TOKIN's) are severely damaged. There are other SMD's in that filter, so it could be related to them as well. | ||
====3005==== | ====3005==== | ||
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Through sabotage testing is was found that disabling +1.2V_YC_RC_VDDIO caused A0213013. | Through sabotage testing is was found that disabling +1.2V_YC_RC_VDDIO caused A0213013. | ||
Also through sabotage testing, it was found that when L6305 is removed it | Also through sabotage testing, it was found that when L6305 is removed it cut's off +1.8V_RSX_FBVDDQ (VRAM voltage). It caused a 10x A0202120 & 1x A0213013 error combo. | ||
====3020==== | ====3020==== | ||
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While Bumpgate is a plausible explanation, it's not the only one. The materials used to construct the motherboard and processors have different coefficient of thermal expansion (CTE). This means they will expand and contract at different rates as the chip heats up and cools down, which applies force to solder connections. Over many thermal cycle this deforms the solder and causes a defect. That may affect the Bumps, which attach the silicon die to the interposer (sometimes referred to as substrate) or the Ball-Grid Array (BGA) which connects the interposer to the Motherboard. | While Bumpgate is a plausible explanation, it's not the only one. The materials used to construct the motherboard and processors have different coefficient of thermal expansion (CTE). This means they will expand and contract at different rates as the chip heats up and cools down, which applies force to solder connections. Over many thermal cycle this deforms the solder and causes a defect. That may affect the Bumps, which attach the silicon die to the interposer (sometimes referred to as substrate) or the Ball-Grid Array (BGA) which connects the interposer to the Motherboard. | ||
3034 is triggered when Bit calibration, also known as BitTraining, cannot complete correctly. So it is not limited to a singular cause. BGA defects from thermal cycling, drop damage, pulling force from separating the heat sink from the processors while disassembling, or delidding can occur. The bumps on CPU, GPU, or SB can fail, Flex IO traces that connect them can be broken/scratched, or accumulated damage from wear and tear (electromigration) can also cause BitTraining to fail. Anything that can disrupt the impedance of the FlexIO can cause BitTraining to fail. A skilled | 3034 is triggered when Bit calibration, also known as BitTraining, cannot complete correctly. So it is not limited to a singular cause. BGA defects from thermal cycling, drop damage, pulling force from separating the heat sink from the processors while disassembling, or delidding can occur. The bumps on CPU, GPU, or SB can fail, Flex IO traces that connect them can be broken/scratched, or accumulated damage from wear and tear (electromigration) can also cause BitTraining to fail. Anything that can disrupt the impedance of the FlexIO can cause BitTraining to fail. A skilled technition will need to use deductive reasoning to diagnose the cause and choose the appropriate repair. | ||
A qualitative test known as a "pressure test" may be used to help make a diagnosis. Applying slight pressure, within reason (not your body weight or clamping force which could cause a BGA defect), to the processor flexes the | A qualitative test known as a "pressure test" may be used to help make a diagnosis. Applying slight pressure, within reason (not your body weight or clamping force which could cause a BGA defect), to the processor flexes the motherboatd beneath the BGA and "may" temporarily reconnect a solder ball with it's pad. Like holding 2 wires together. This can cause flickering on screen, a console to power on when it couldn't before, etc. If the console or error responds differently when pressure is applied, this may be taken as evidence of a BGA defect. It is not difinitive, but tips the odds in favor of that diagnosis. A reball in that case may be sucessful. However, if it does not respond to pressure is not likely to be the BGA and another explnation, such as bumps are more likely. It should be noted that bumps can be affected by force as well, but because the underfill suppots them, it generally requires more force to reconnect them using this method. This is what the "Bolt mod," comonly performed on the XBOX 360 did. That much force permantly deforms the motherboard and causes irreparable damage. DO NOT DO THIS! But it illistrates the point. You don't need much force to see if the BGA is affected and if it responds to light pressure, it's unlikely to be the bumps. Therefore, taken together with other clues, it can be helpful to a skilled technition gathering evidence for a diagnosis. | ||
In consoles with a 90nm [[RSX]] (CECH-Axx/Bxx/Cxx/Exx/Gxx/Hxx, and M03 models) the most likely cause of a 3034 is the GPU itself. It can be replaced with another 90nm RSX without modification. However, it can also be replaced with a more reliable 65nm or 40nm model, using a process nicknamed a "Frankenstein Mod." SONY service technicians performed this modification in some officially refurbished consoles. The PS3 community has developed a method as well. Since there is a question about the 90nm RSX's reliability and both a reball and Frankenstein mod require the 90nm to be desoldered, it is advisable to replace the 90nm GPU with a more reliable model instead of risking another 90nm GPU. Rework is hard on the motherboard and surrounding components, so choosing a repair with the fewest uncertainty's is wise. | In consoles with a 90nm [[RSX]] (CECH-Axx/Bxx/Cxx/Exx/Gxx/Hxx, and M03 models) the most likely cause of a 3034 is the GPU itself. It can be replaced with another 90nm RSX without modification. However, it can also be replaced with a more reliable 65nm or 40nm model, using a process nicknamed a "Frankenstein Mod." SONY service technicians performed this modification in some officially refurbished consoles. The PS3 community has developed a method as well. Since there is a question about the 90nm RSX's reliability and both a reball and Frankenstein mod require the 90nm to be desoldered, it is advisable to replace the 90nm GPU with a more reliable model instead of risking another 90nm GPU. Rework is hard on the motherboard and surrounding components, so choosing a repair with the fewest uncertainty's is wise. | ||
In models without the 90nm RSX, 3034 is still possible, but far less likely to be caused by the GPU. CPU BGA defects are common in dropped consoles, those that have been | In models without the 90nm RSX, 3034 is still possible, but far less likely to be caused by the GPU. CPU BGA defects are common in dropped consoles, those that have been delided or have trace damage to the area around the processors. So troubleshooting is necessary to make a diagnosis. | ||
====3035 ==== | ====3035 ==== | ||
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===Data Errors=== | ===Data Errors=== | ||
---- | ---- | ||
*This error codes seems to be repeated up to 5 times for 5 special cases, as example, errors 4'''0'''01, 4'''1'''01, 4'''2'''01, 4'''3'''01, 4'''4'''01 are related to CELL, the only thing that changes in the error code is the second digit (located | *This error codes seems to be repeated up to 5 times for 5 special cases, as example, errors 4'''0'''01, 4'''1'''01, 4'''2'''01, 4'''3'''01, 4'''4'''01 are related to CELL, the only thing that changes in the error code is the second digit (located inmediatly after the category). If at some point we find what means that digit we can join the wiki page sections together (with titles: "4001, 4101, 4201, 4301, 4401", etc...) | ||
====4001==== | ====4001==== | ||