Editing Syscon Error Codes
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This error occurs when Bit Training fails. Bit Training, also know as bit calibration, is a critical process during the power-on-reset (POR) sequence of the CELL BE processor. It fine-tunes the behavior of individual bits within the 8-bit-wide Rambus channels. This adjustment accounts for variations in circuitry, wiring, and loading delays. Bit training plays a pivotal role in optimizing signal quality by calibrating the signal driver current, driver impedance, and ensuring that the timing of each of the eight data bits aligns with clock edges, effectively centering the data "eye" allowing for more accurate and reliable data transmission. | This error occurs when Bit Training fails. Bit Training, also know as bit calibration, is a critical process during the power-on-reset (POR) sequence of the CELL BE processor. It fine-tunes the behavior of individual bits within the 8-bit-wide Rambus channels. This adjustment accounts for variations in circuitry, wiring, and loading delays. Bit training plays a pivotal role in optimizing signal quality by calibrating the signal driver current, driver impedance, and ensuring that the timing of each of the eight data bits aligns with clock edges, effectively centering the data "eye" allowing for more accurate and reliable data transmission. | ||
'''Remember | '''Remember ITS NOT ALWAYS bad connection between the CPU and GPU.''' Bit training calibrates the connection between the GPU, CPU AND South bridge. For example, A0403034 occurred on a VER-001 with a probably BGA defect. By putting pressure on the southbridge the console would boot. Look at the data error and other information of the console before assuming a bad GPU. | ||
This is the most common error seen in early Phat model PS3's with the 90nm [[RSX]]. It is the hallmark of solder fatigue (such as a cracked solder ball or bump defect) which affects the Flex IO interface that allows the CPU, GPU, and SB to communicate. It is by no means limited to the early models, however. These errors have been seen in every model of PS3 with varying frequency. However, it's most common in the earliest models, likely due to a manufacturing defect in the 90nm RSX material set. Namely a CTE mismatch between | This is the most common error seen in early Phat model PS3's with the 90nm [[RSX]]. It is the hallmark of solder fatigue (such as a cracked solder ball or bump defect) which affects the Flex IO interface that allows the CPU, GPU, and SB to communicate. It is by no means limited to the early models, however. These errors have been seen in every model of PS3 with varying frequency. However, it's most common in the earliest models, likely due to a manufacturing defect in the 90nm RSX material set. Namely a CTE mismatch between underill and bump material that leads to premature solder fatigue and GPU failure. Dubbed "BumpGate," this is a well known failure modality among GPUs manufactured from 2005-2008. Although it has not been proven unequivocally that the 90nm RSX is affected by Bumpgate, members of the community have shown the 90nm RSX has an increased failure rate, similar material set, and exhibits similar symptoms to known bumpgate affected chipsets - such as black screens (GLOD), graphical artifacts like lines, double images, color splotches and pixelation. | ||
While Bumpgate is a plausible explanation, it's not the only one. The materials used to construct the motherboard and processors have different coefficient of thermal expansion (CTE). This means they will expand and contract at different rates as the chip heats up and cools down, which applies force to solder connections. Over many thermal cycle this deforms the solder and causes a defect. That may affect the Bumps, which attach the silicon die to the interposer (sometimes referred to as substrate) or the Ball-Grid Array (BGA) which connects the interposer to the Motherboard. | While Bumpgate is a plausible explanation, it's not the only one. The materials used to construct the motherboard and processors have different coefficient of thermal expansion (CTE). This means they will expand and contract at different rates as the chip heats up and cools down, which applies force to solder connections. Over many thermal cycle this deforms the solder and causes a defect. That may affect the Bumps, which attach the silicon die to the interposer (sometimes referred to as substrate) or the Ball-Grid Array (BGA) which connects the interposer to the Motherboard. | ||