Editing Syscon Error Codes

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1701 has been reported from using homebrew apps that caused a software conflict. Uninstalling the software can resolve the issue. It that's not possible because the system is locked up, it may be necessary to restore the operating system (OS).
1701 has been reported from using homebrew apps that caused a software conflict. Uninstalling the software can resolve the issue. It that's not possible because the system is locked up, it may be necessary to restore the operating system (OS).
1701 and 1601 can also occur when exiting heavier games on a dex firmware paired with multiman due to I'm guessing dex and webman allocating 2 more megabytes of ram [as shown by the webman fps counter allocating 18 to xmb on cex and 20 on dex], interfering with the syscon fan curve causing it to get "stuck" resulting in overheating and causing a ylod upon exiting the game though the console reboots fine which may trick people into thinking webman or dex overheats their consoles. I haven't looked into this issue too much but converting from cex to dex has fixed the issue and the issue arose when converting to dex so I belive there are fringe cases where this is an issue


==== 1802 ([[RSX]] Initialization) ====
==== 1802 ([[RSX]] Initialization) ====
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It is often seen coinciding with 1601/1701, 14FF, 1301, and 3034 in case of Bad GPU (Common). DVE or HDMI Transmitter possible. If so, multiple errors at the same timestamp allow you to distinguish between causes.
It is often seen coinciding with 1601/1701, 14FF, 1301, and 3034 in case of Bad GPU (Common). DVE or HDMI Transmitter possible. If so, multiple errors at the same timestamp allow you to distinguish between causes.
This error could also show when opening and closing a PS2 emulated game in a CFW console, both in Evilnat and Rebug. The errors would be in dyads. If this is the case there is no reason of concern.


==== 2024 (AV) ====
==== 2024 (AV) ====
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This error occurs when Bit Training fails. Bit Training, also know as bit calibration, is a critical process during the power-on-reset (POR) sequence of the CELL BE processor. It fine-tunes the behavior of individual bits within the 8-bit-wide Rambus channels. This adjustment accounts for variations in circuitry, wiring, and loading delays. Bit training plays a pivotal role in optimizing signal quality by calibrating the signal driver current, driver impedance, and ensuring that the timing of each of the eight data bits aligns with clock edges, effectively centering the data "eye" allowing for more accurate and reliable data transmission.  
This error occurs when Bit Training fails. Bit Training, also know as bit calibration, is a critical process during the power-on-reset (POR) sequence of the CELL BE processor. It fine-tunes the behavior of individual bits within the 8-bit-wide Rambus channels. This adjustment accounts for variations in circuitry, wiring, and loading delays. Bit training plays a pivotal role in optimizing signal quality by calibrating the signal driver current, driver impedance, and ensuring that the timing of each of the eight data bits aligns with clock edges, effectively centering the data "eye" allowing for more accurate and reliable data transmission.  


'''Remember, ITS NOT ALWAYS a bad connection between the CPU, and GPU.''' Bit training calibrates the connection between the GPU, CPU AND South bridge. For example, A0403034 occurred on a VER-001 with a probably BGA defect. By putting pressure on the southbridge the console would boot. Look at the data error and other information of the console before assuming a bad GPU.
'''Remember ITS NOT ALWAYS bad connection between the CPU and GPU.''' Bit training calibrates the connection between the GPU, CPU AND South bridge. For example, A0403034 occurred on a VER-001 with a probably BGA defect. By putting pressure on the southbridge the console would boot. Look at the data error and other information of the console before assuming a bad GPU.


This is the most common error seen in early Phat model PS3's with the 90nm [[RSX]]. It is the hallmark of solder fatigue (such as a cracked solder ball or bump defect) which affects the Flex IO interface that allows the CPU, GPU, and SB to communicate. It is by no means limited to the early models, however. These errors have been seen in every model of PS3 with varying frequency. However, it's most common in the earliest models, likely due to a manufacturing defect in the 90nm RSX material set. Namely a CTE mismatch between the underfill and bump material that leads to premature solder fatigue and GPU failure. Dubbed "BumpGate," this is a well known failure modality among GPUs manufactured from 2005-2008. Although it has not been proven unequivocally that the 90nm RSX is affected by Bumpgate, members of the community have shown the 90nm RSX has an increased failure rate, similar material set, and exhibits similar symptoms to known bumpgate affected chipsets - such as black screens (GLOD), graphical artifacts like lines, double images, color splotches and pixelation.  
This is the most common error seen in early Phat model PS3's with the 90nm [[RSX]]. It is the hallmark of solder fatigue (such as a cracked solder ball or bump defect) which affects the Flex IO interface that allows the CPU, GPU, and SB to communicate. It is by no means limited to the early models, however. These errors have been seen in every model of PS3 with varying frequency. However, it's most common in the earliest models, likely due to a manufacturing defect in the 90nm RSX material set. Namely a CTE mismatch between underill and bump material that leads to premature solder fatigue and GPU failure. Dubbed "BumpGate," this is a well known failure modality among GPUs manufactured from 2005-2008. Although it has not been proven unequivocally that the 90nm RSX is affected by Bumpgate, members of the community have shown the 90nm RSX has an increased failure rate, similar material set, and exhibits similar symptoms to known bumpgate affected chipsets - such as black screens (GLOD), graphical artifacts like lines, double images, color splotches and pixelation.  


While Bumpgate is a plausible explanation, it's not the only one. The materials used to construct the motherboard and processors have different coefficient of thermal expansion (CTE). This means they will expand and contract at different rates as the chip heats up and cools down, which applies force to solder connections. Over many thermal cycle this deforms the solder and causes a defect. That may affect the Bumps, which attach the silicon die to the interposer (sometimes referred to as substrate) or the Ball-Grid Array (BGA) which connects the interposer to the Motherboard.  
While Bumpgate is a plausible explanation, it's not the only one. The materials used to construct the motherboard and processors have different coefficient of thermal expansion (CTE). This means they will expand and contract at different rates as the chip heats up and cools down, which applies force to solder connections. Over many thermal cycle this deforms the solder and causes a defect. That may affect the Bumps, which attach the silicon die to the interposer (sometimes referred to as substrate) or the Ball-Grid Array (BGA) which connects the interposer to the Motherboard.  
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====5FFF====
====5FFF====
[[CELL BE|CELL]] or [[RSX]]
[[CELL BE|CELL]] or [[RSX]]
In recent times, this error has been known for the CPU (CELL), but it is actually due to an error in the NOR of the Playstation 3 SLIM/SUPER SLIM. Due to a failure when performing the exploit, you can end up having a console Bricked, for this use E3 FLASHER, Tennsy.etc
For 3XXX, 4XXX consoles, the BRICK WITH Tennsy can be solved. in 4XXX keep in mind that the NOR can be emmc (12GB) therefore it will not be possible to solve it (for now...)
for Super Slim reflow or reball RSX


{{Hardware Modification}}<noinclude>
{{Hardware Modification}}<noinclude>
[[Category:Main]]
[[Category:Main]]
</noinclude>
</noinclude>
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