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= System Memory | [[Category:Hardware]] | ||
== Main System Memory == | |||
The PS3 has 256MB of 64 bit bus Rambus XDR main system memory. Some models use four 64MB Samsung chips, while other models uses four 64MB Elpida chips. | |||
The PS3 has | |||
A sample of the Memory chips in different PS3 models: | |||
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" | {| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" | ||
|- bgcolor="#cccccc" | |- bgcolor="#cccccc" | ||
! Type !! Size !! Speed !! Voltage !! Packaging !! Manufact. !! Serial Number !! Amount !! Models | ! Type !! Size !! Speed !! Voltage !! Packaging !! Manufact. !! Serial Number !! Amount !! Models | ||
|- | |- | ||
| Rambus XDR || 64MB || 400MHz || 1.8V+/-0.09V || FBGA-104 || Elpida || | | Rambus XDR || 64MB || 400MHz || 1.8V+/-0.09V || FBGA-104 || Elpida || X5116AC-SE-3C-E || 4x || CECHA/COK-001 up to including CECHG/SEM-001 | ||
|- | |- | ||
| Rambus XDR || 64MB || 400MHz || 1.8V+/-0.09V || FBGA- | | Rambus XDR || 64MB || 400MHz || 1.8V+/-0.09V || FBGA-104 || Samsung || K4Y50164UC-JCB3 || 4x || ?Some initial models? | ||
|- | |- | ||
| Rambus XDR || 64MB || 400MHz || 1.8V+/-0.09V || FBGA- | | Rambus XDR || 64MB || 400MHz || 1.8V+/-0.09V || FBGA-100 || Samsung || K4Y50164UE-JCB3 || 4x || CECHJ/DIA-002 and CECHK/DIA-002 | ||
|- | |- | ||
| Rambus XDR || 64MB || 400MHz || 1.8V+/-0.09V || FBGA-104 || | | Rambus XDR || 64MB || 400MHz || 1.8V+/-0.09V || FBGA-104 || Elpida || X5116ADSE-3C-E || 4x || CECHH/DIA-001, CECHL/VER-001 up and including CECHQ/VER-001 and PS3 Slim CECH-20..A/DYN-001 | ||
|- | |- | ||
| Rambus XDR || 128MB || 400MHz || 1.5V+/-0.075V || FBGA-150 || Elpida || | | Rambus XDR || 128MB || 400MHz || 1.5V+/-0.075V || FBGA-150 || Elpida || X1032BASE-3C-F || 2x || CECH-21..A/SUR-001 | ||
|- | |- | ||
|} | |} | ||
: | |||
=== Elpida X5116AC-SE-3C-E === | |||
<div style="float:right">[[File:EDX5116ACSE-3C-E.png|200px|thumb|left|104-ball FBGA<br />Elpida X5116AC-SE-3C-E]]</div> | |||
Datasheet: [http://www.elpida-korea.com/pdfs/E0881E20.pdf Elpida X5116AC-SE-3C-E] | |||
<pre>productcode meaning: | |||
E - Elpida Memory | |||
D - Type : Monolithic Device | |||
X - Product Family : XDR RAM | |||
51 - Density : 512M (x16bit) | |||
16 - Organisation : x16bit | |||
A - Supply Voltage : 1.8V, DRSL | |||
C - Die Revision: C | |||
SE - Package : FBGA (with back cover) | |||
- | |||
3C - Speed : 3.2G (tRAC = 35, C Bin) | |||
- | |||
E - Environmental Code : Lead Free</pre> | |||
= | === Samsung K4Y50164UC-JCB3 === | ||
The 256MB of GDDR3 memory is located inside the | <div style="float:right">[[File:K4Y50164UC-JCB3.png|200px|thumb|left|104-ball FBGA<br />Samsung K4Y50164UC-JCB3]]</div> | ||
Datasheet: [http://www.samsung.com/global/system/business/semiconductor/product/2007/6/11/XDR_RDRAM/XDRDRAM/Component/512Mbit/K4Y50164UC/ds_k4y50xx4uc_rev11.pdf Samsung K4Y50164UC-JCB3] | |||
<pre>productcode meaning: | |||
K - Samsung Memory | |||
4 - DRAM | |||
Y - Product : XDR RAM | |||
50 - Density : 512M, 32K/16ms(0,49us) | |||
16 - Organisation : x16 | |||
4 - Banks : 8 | |||
U - Interface : DRSL(1.8V, 1.2V) | |||
C - Generation : 4th | |||
- | |||
J - Packagetype: BOC lead free | |||
C - Temperature & Power: Commercial, Normal Power | |||
B3 - Speed (Data frequency, tRAC, tRC) : 3.2Gbps, 35ns, 24cycles</pre> | |||
=== Samsung K4Y50164UE-JCB3 === | |||
(CECHG,CECHK) | |||
<div style="float:right">[[File:K4Y50164UE-JCB3.png|200px|thumb|left|100-ball FBGA<br />Samsung K4Y50164UE-JCB3]]</div> | |||
Datasheet: [http://www.samsung.com/global/system/business/semiconductor/product/2007/6/11/XDR_RDRAM/XDRDRAM/Component/512Mbit/K4Y50164UE/ds_k4y50xx4ue_rev10.pdf Samsung K4Y50164UE-JCB3] | |||
<pre>productcode meaning: | |||
K - Samsung Memory | |||
4 - DRAM | |||
Y - Product : XDR RAM | |||
50 - Density : 512M, 32K/16ms(0,49us) | |||
16 - Organisation : x16 | |||
4 - Banks : 8 | |||
U - Interface : DRSL(1.8V, 1.2V) | |||
E - Generation : 6th | |||
- | |||
J - Packagetype: BOC lead free | |||
C - Temperature & Power: Commercial, Normal Power | |||
B3 - Speed (Data frequency, tRAC, tRC) : 3.2Gbps, 35ns, 24cycles</pre> | |||
=== Elpida X5116ADSE-3C-E === | |||
(CECH-20xx) | |||
<div style="float:right">[[File:X5116ADSE-3C-E.png|200px|thumb|left|104-ball FBGA<br />Elpida X5116ADSE-3C-E]]</div> | |||
Datasheet: [http://www.elpida.com/eolpdfs/E1033E40_EOL.pdf Elpida X5116ADSE-3C-E] | |||
<pre>productcode meaning: | |||
X - Product Family : XDR RAM | |||
51 - Density : 512M (x16bit) | |||
16 - Organisation : x16bit | |||
A - Supply Voltage : 1.8V, DRSL | |||
D - Die Revision: D | |||
SE - Package : FBGA (with back cover) | |||
- | |||
3C - Speed : 3.2G (tRAC = 35, C Bin) | |||
- | |||
E - Environmental Code : Lead Free</pre> | |||
=== Elpida X1032BASE-3C-F === | |||
(CECH-21xx and later) | |||
Datasheet: E1332E50 (EOL) | |||
<pre>productcode meaning: | |||
E - Elpida Memory | |||
D - Type : Monolithic Device | |||
X - Product Family : XDR RAM | |||
13 - Density : 1Gbit (128MB) 32Mbitx32 | |||
32 - Organisation : x32bit | |||
B - Supply Voltage : 1.5V +/- 0.075V, DRSL | |||
A - Die Revision: A | |||
SE - Package : FBGA (with back cover) | |||
- | |||
3C - Speed : 3.2G (tRAC = 35, C Bin) | |||
- | |||
F - Environmental Code : Lead & Halogen Free</pre> | |||
== Graphics Memory == | |||
<div style="float:right">[[File:RSX bare die.jpg|200px|thumb|left|RSX bare die<br />GPU in centre<br />4x GDDR3]]</div> | |||
The 256MB of GDDR3 memory is located inside the RSX chip using four 64MB FBGA chips. | |||
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" | {| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" | ||
|- bgcolor="#cccccc" | |- bgcolor="#cccccc" | ||
! Type !! Size !! Speed !! Voltage !! Packaging !! Manufacturer !! Serial Number !! Description | ! Type !! Size !! Speed !! Voltage !! Packaging !! Manufacturer !! Serial Number !! Description | ||
|- | |- | ||
| GDDR3 || 64MB (512Mbit) || 700MHz || 2.0V +/-0.1V || <strike>FBGA-136</strike> on-die || Samsung || | | GDDR3 || 64MB (512Mbit) || 700MHz || 2.0V +/-0.1V || <strike>FBGA-136</strike> on-die || Samsung || K4J52324QC-SC14 || 256MB total (4 chips) for PS3 Graphics Memory | ||
|- | |- | ||
| GDDR3 || | | GDDR3 || 64MB (512Mbit_ || 700MHz || 2.0V +/-0.1V || <strike>FBGA-136</strike> on-die || Qimonda || HYB18H512322AF-14 || 256MB total (4 chips) for PS3 Graphics Memory (later models) | ||
|- | |- | ||
|} | |} | ||
= | |||
[ | === Samsung K4J52324QC-SC14 === | ||
<div style="float:right">[[File:K4J52324QC-SC14.png|200px|thumb|left|FBGA-136 / on-die<br />Samsung K4J52324QC-SC14]]</div> | |||
Datasheet: [http://www.datasheetcatalog.org/datasheets2/12/1276857_1.pdf Samsung K4J52324QC-SC14] | |||
<pre>productcode meaning: | |||
K - Samsung Memory | |||
4 - DRAM | |||
J - Product : GDDR3 RAM | |||
52 - Density : 512M, 32ms, 8K | |||
32 - Organisation : x32 | |||
4 - Banks : 8 | |||
Q - Interface : DRSL(1.8V, 1.2V) | |||
C - Generation : 4th | |||
- | |||
S - Packagetype: BOC lead | |||
C - Temperature & Power: Commercial, Normal Power (1.8V +/- 0.1V) | |||
14 - Speed (Data frequency, tRAC, tRC) : 1.4Gbps | |||
</pre> | |||
=== Qimonda HYB18H512322AF-14 === | |||
<div style="float:right">[[File:HYB18H512322AF-14.png|200px|thumb|left|FBGA-136 / on-die<br />Qimonda HYB18H512322AF-14]]</div> | |||
datasheet: unavailable | |||
<pre>productcode meaning: | |||
H | |||
Y | |||
B | |||
1 | |||
8 | |||
H | |||
512 - Density : 512M (16M x 32) | |||
32 - Organisation : x32 | |||
2 | |||
A | |||
F | |||
- | |||
14- Speed (Data frequency, tRAC, tRC) : 1.4Gbps | |||
</pre> | |||
== PS2 Compatibility Memory == | |||
See: [[PS2 Compatibility]] | See: [[PS2 Compatibility]] | ||