Editing K8Q2815UQB-PI4B

= Samsung K8Q2815UQB-PI4B (NOR) =

<div style="float:right">[[File:TOSP1-56pin.png|200px|thumb|left|56-pin TSOP1 Standard Type<br />14mm x 20mm]]<br />[[File:Samsung K8Q2815UQB-PI4B (NOR).jpg|200px|thumb|left|Samsung K8Q2815UQB-PI4B (NOR) as seen on modern PS3 Slim]]</div>

* [http://www.samsung.com/global/system/business/semiconductor/product/2007/8/7/144546ds_k8q2815uqb_rev11.pdf Datasheet]
* [http://www.ps3devwiki.com/files/documents/-%20Datasheets/NOR/Samsung_K8Q2815UQB-PI4B.pdf Samsung_K8Q2815UQB-PI4B.pdf]

<pre>productcode meaning:
K - Memory
8 - NOR Flash
Q - Small Classification : Page Mode DDP
28 - Density : 128M, 8M / 16Bank / 8^8
15 - Dual Bank Boot Block (Bank1, Bank2) : 16M, 2M / 14M
U - Vcc : 3.0V / 3.3V (2.7V~3.6V)
Q - Device Type: Top and Bottom Boot Block
B - Generation : 3rd Generation
-
P - Package : TSOP1 (Lead Free)
I - Temp : Industrial
4B - Speed : 60ns/25ns (Page)</pre>

'''NOTE'''
 Multiple Bank architectures (8 banks)
 - Bank 0 :  8Mbit (4Kw x 8 and 32Kw x 15)
 - Bank 1 : 24Mbit (32Kw x 48)
 - Bank 2 : 24Mbit (32Kw x 48)
 - Bank 3 :  8Mbit (4Kw x 8 and 32Kw x 15)
 - Bank 4 :  8Mbit (4Kw x 8 and 32Kw x 15)
 - Bank 5 : 24Mbit (32Kw x 48)
 - Bank 6 : 24Mbit (32Kw x 48)
 - Bank 7 :  8Mbit (4Kw x 8 and 32Kw x 15)
 OTP Block : Extra 256 word
 - 128word for factory and 128word for customer OTP (only on first Virtual Chip, A22=low)

{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" 
|- bgcolor="#cccccc"
! Pin !! Usage !! Remarks
|-
| 1 || style="color:white; background-color:darkgrey;" | NC || style="color:white; background-color:darkgrey;" | No Connection
|-
| 2 || A22 || Virtual Chip Enable of 2nd Chip
|-
| 3 || A15 || 
|-
| 4 || A14 || 
|-
| 5 || A13 || 
|-
| 6 || A12 || 
|-
| 7 || A11 || 
|-
| 8 || A10 || 
|-
| 9 || A9 || 
|-
| 10 || A8 || 
|-
| 11 || A19 || 
|-
| 12 || A20 || 
|-
| 13 || WE || Write Enable
|-
| 14 || RESET || Reset
|-
| 15 || A21 || 
|-
| 16 || WP/ACC || Write Protect / Accelerated Program Operation
|-
| 17 || RD/BY || Ready/Busy Output
|-
| 18 || A18 || 
|-
| 19 || A17 || 
|-
| 20 || A7 || 
|-
| 21 || A6 || 
|-
| 22 || A5 || 
|-
| 23 || A4 || 
|-
| 24 || A3 || 
|-
| 25 || A2 || 
|-
| 26 || A1 || 
|-
| 27 || style="color:white; background-color:darkgrey;" | NC || style="color:white; background-color:darkgrey;" | No Connection
|-
| 28 || style="color:white; background-color:darkgrey;" | NC || style="color:white; background-color:darkgrey;" | No Connection
|-
|}
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" 
|- bgcolor="#cccccc"
! Pin !! Usage !! Remarks
|-
| 29 || VCCQ || VccQ
|-
| 30 || style="color:white; background-color:darkgrey;" | NC || style="color:white; background-color:darkgrey;" | No Connection
|-
| 31 || A0 || 
|-
| 32 || CE || Chip Enable
|-
| 33 || VSS || Ground
|-
| 34 || OE || Output Enable
|-
| 35 || DQ0 || 
|-
| 36 || DQ8 || 
|-
| 37 || DQ1 || 
|-
| 38 || DQ9 || 
|-
| 39 || DQ2 || 
|-
| 40 || DQ10 || 
|-
| 41 || DQ3 || 
|-
| 42 || DQ11 || 
|-
| 43 || Vcc || Vcc (min 2.7V-max 3.6V / typ 3.0V)
|-
| 44 || DQ4 || 
|-
| 45 || DQ12 || 
|-
| 46 || DQ5 || 
|-
| 47 || DQ13 || 
|-
| 48 || DQ6 || *OTP?
|-
| 49 || DQ14 || 
|-
| 50 || DQ7 || *OTP?
|-
| 51 || DQ15 || 
|-
| 52 || VSS || Ground
|-
| 53 || style="color:white; background-color:darkgrey;" | NC || style="color:white; background-color:darkgrey;" | No Connection
|-
| 54 || A16 || 
|-
| 55 || style="color:white; background-color:darkgrey;" | NC || style="color:white; background-color:darkgrey;" | No Connection
|-
| 56 || style="color:white; background-color:darkgrey;" | NC || style="color:white; background-color:darkgrey;" | No Connection
|-
|}
*OTP Block Region : 256-word Flash memory region. The data DQ6=1 for customer locked and DQ7=1 for factory locked


{{Motherboard Components}}<noinclude>[[Category:Main]]</noinclude>