Editing CELL BE

<div style="float:right">[[File:CXD2992AGB 46J2494 diemrk1.jpg|x300px|thumb|left|IBM markings in CXD2992AGB die]][[File:CellBE.jpg|x300px|thumb|right|Cell Broadband Engine<br />CPU with heatplate<br />CXD2992AGB]]</div>

= Cell Broadband Engine =

The Cell CPU has one 3.2Ghz PPE (Power Processor Element) with two threads and eight 3.2Ghz SPE (Synergistic Processing Elements).

The PPE is a general purpose CPU, while the eight SPE are geared towards processing data in parallel. One SPE is disabled to increase yield, so the PS3 can have at most 9 threads running at the same time (2 from PPE and 7 from SPE). Note that one SPE is reserved for the hypervisor, so PS3 programs can take advantage of 8 threads. Both the PPE and SPE of the Cell are 64 bit, and manipulate data in Big Endian.

== Specifications ==

* 1 PPE (Power Processor Element)
** 3.2Ghz
** 64 bit, Big Endian
** 2 threads (can run at same time)
** L1 cache: 32kB data + 32kB instruction
** L2 cache: 512kB
** Memory bus width: 64bit (serial)
** VMX (Altivec) instruction set support
** Full IEEE-754 compliant 
** the PPU can execute two double precision or eight single precision operations per clockcycle
* 8 SPE (Synergistic Processing Element)
** 3.2Ghz
** 64 bit, Big Endian
** 1 SPE disabled to improve chip yield (see: [[Unlocking the 8th SPE]])
** 1 SPE dedicated for hypervisor security
** 256KB local store per SPE
** 128 registers per SPE
** Dual Issue (Each SPE can execute 2 instructions per clock)
** IEEE-754 compliant in double precision (single precision round-towards-zero instead of round-towards-even)

There is a lot of info about CELL/BE on the [[Cell Programming IBM]] page.

== Die explained ==
<gallery>
File:CELLBE die large.jpg|Cell Broadband Engine<br />Die - 90nm
File:SPU-DIE.PNG|Cell Broadband Engine<br />SPU Die map
File:CellBE-map-90nm.jpg|Cell Broadband Engine<br />Die map - 90nm
File:CellBE-map-65nm.jpg|Cell Broadband Engine<br />Die map - 65nm
File:CellBE-map-45nm.jpg|Cell Broadband Engine<br />Die map - 45nm
File:Cell-90nm-die.png|Cell Broadband Engine<br />Die map - 90nm
File:SPU-diagram-DMA.png|Cell Broadband Engine<br />SPU diagram
</gallery>

{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" 
|- bgcolor="#cccccc"
! ABBR !! Usage !! Speed !! Notes
|-
| BEI || Broadband engine interface || 1.6GHz (NCLK/2) || I/O Controller to FlexIO(/RSX)
|-
| EIB || Element interconnect bus || 1.6GHz (NCLK/2) || used as communication ring for the 8 SPE (and PPU + MIC + BEI)
|-
| FlexIO || High-speed I/O interface || 2.5Ghz (RC_REFCLK : 500MHz 1:5 PLL) || Flex I/O to [[RSX]]
|-
| L2 || Level 2 cache || 3.2GHz (NCLK) || 512KB L2 cache for PPE
|-
| MIC || Memory interface controller || 1.6GHz (NCLK/2) || Memory controller to XIO(/Rambus XDR)
|-
| MBL || MIC bus logic || 1.6GHz (NCLK/2) || From MIC(/PPE) to EIB(/SPE's)
|-
| PPE || Power processor element || 3.2GHz (NCLK) || Main dualthreaded CPU
|-
| SPE || Synergistic processor element || <span title="see SPU table below">3.2GHz/1.6GHz</span> || 8 present, 1 disabled from factory
|-
| XIO || Extreme data rate I/O cell || 1.6GHz (Y0_RQ_CTM/Y1_RQ_CTM : 400MHz 1:4 PLL) || Rambus XDR Interface
|-
| TEST || Test control unit (TCU) / pervasive logic (PRV) ||  || Used for power management, thermal management, clock control, software-performance monitoring, trace analysis, preboot (and secureboot?), <br />also has RAS-unit (Reliability, Availability, Serviceability), JTAG (IEEE 1149 test access port) and SPI Serial Peripheral Interface
|-
| PLL || Phase-Locked Loop || 400MHz || Before preboot external clock (400MHz) is used (see [[Timebases]])<br />afterwards only internal PLL (PLL_REFCLK : 400MHz 1:8 PLL) for main clocks: NCLK=3.2GHz, NCLK/2=1.6GHz, MiClk=1.6GHz, XIO Clk=1.6GHz, BClk=1.667GHz, RO/TO Clk=2.5GHz
|-
|}

=== SPE ===

{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" 
|- bgcolor="#cccccc"
! ABBR !! Usage !! Speed !! Notes
|-
| BIU || Bus interface unit || 1.6GHz (NCLK/2) || connects DMAC+EIB and LS+EIB
|-
| DMAC || Direct memory access controller || 1.6GHz (NCLK/2) || controls DMA, SPU+LS and BIU(/EIB)
|-
| EIB || Element interconnect bus || 1.6GHz (NCLK/2) || busring to which all SPE's are connected (and PPU + MIC + BEI)
|-
| LS || Local store || 3.2GHz (NCLK) || 256KB of local memory, accessable via DMA/MBOX
|-
| MFC || Memory flow controller || 1.6GHz (NCLK/2) || 
|-
| MIC || Memory interface controller || 1.6GHz (NCLK/2) || Memory controller to XIO(/Rambus XDR)
|-
| MMIO || Memory-mapped I/O || 1.6GHz (NCLK/2) || 
|-
| MMU || Memory management unit || 1.6GHz (NCLK/2) || used by DMAC for management
|-
| SPU || Synergistic processor unit || 3.2GHz (NCLK) || SPU execution unit
|-
| TLB || Translation lookaside buffer || 1.6GHz (NCLK/2) || used by MMU as buffer
|-
|}

Reference: http://hpc.pnl.gov/people/fabrizio/papers/ieeemicro-cell.pdf // backup/mirror: [http://www.multiupload.com/UN7VJHHER1 ieeemicro-cell.pdf (222.51 KB)]

== Bandwidth I/O ==
<div style="float:right">[[File:Cellbe-bandwith.gif|200px|thumb|left|CellBE bandwidth]]</div>

* MIC (Memory Interface Controller) &lt;from/to&gt; [[RAM#Main_System_Memory|dual Rambus XDR]]: 25.6GB/s theoretical

* IOIF0 (I/O Interface to RSX): 20GB/s to&gt; [[RSX]] / 15 GB/s &lt; [[RSX]] ([[RSX]] &lt;from/to&gt; [[RAM#Graphics_Memory|GDDR3]]: 20.8GB/s @ 650MHz)

* IOIF1 (I/O Interface to Southbridge): &lt;from/to&gt; [[South Bridge]] : 2.5GB/s 

* EIB (Element Interconnect Bus) : 4x 128bit buses / 128byte packets : 204.8 GB/s total

* PPU (PowerPC Processing Element) : 25.6 GLOP/s FPU, L1/L2: 51.2GB/s

* LHS (Load Hit Store) pipeline stall : ~40 clockcycles

* SPE (Synergistic Processor Elements) : 2 IPC SPU to Local Store : 51.2GB/s

Reference: [http://www.ibm.com/developerworks/power/library/pa-cellperf/ Cell Broadband Engine Architecture and its first implementation - A performance view]

== Types @ SKU ==
<gallery>
File:Cell-BE-90nm.jpg|[[CELL BE]] 90nm
File:Cell-BE-65nm.jpg|[[CELL BE]] 65nm
File:Cell-BE-45nm.jpg|[[CELL BE]] 45nm
</gallery>
'''Note:''' All Cell BE packages measures 42.5mm × 42.5mm

The Cell BE was introduced at 90nm. Later, PS3 model numbers starting with CECHG uses the 65nm version, while the PS3 Slim (CECH-20xx) used the 45nm version (See [[SKU Models]] and table below).

A sampling of the CELL/B.E. types by model number:
{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable" style="border:1px solid #999; border-collapse: collapse;" 
|- bgcolor="#cccccc"
! PS3 Model !! Mobo Model !! Mobo part number !! CELL type !! Die process !! Total Die Size !! Width x Length !! SPU size !! PPE Size !! Remark
|-
| [[CECHAxx]] || [[COK-00x#COK-001|COK-001]] || - || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECHAxx]] || [[COK-00x#COK-001|COK-001]] || 1-871-868-12 || [[CXD2964AGB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHAxx]] || [[COK-00x#COK-001|COK-001]] || 1-871-868-22 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHAxx]] || [[COK-00x#COK-001|COK-001]] || 1-871-868-32 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHBxx]] || [[COK-00x#COK-001|COK-001]] || - || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECHBxx]] || [[COK-00x#COK-001|COK-001]] || 1-871-868-22 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHBxx]] || [[COK-00x#COK-001|COK-001]] || 1-871-868-32 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHCxx]] || [[COK-00x#COK-002|COK-002]] || 1-873-513-21<br />1-873-513-31 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECHExx]] || [[COK-00x#COK-002W|COK-002W]] || - || CXD29?? || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECHExx]] || [[COK-00x#COK-002W|COK-002W]] || 1-873-513-21 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHExx]] || [[COK-00x#COK-002W|COK-002W]] || 1-873-513-21 || [[CXD2964AGB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHExx]] || [[COK-00x#COK-002W|COK-002W]] || 1-873-513-31 || [[CXD2964AGB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHExx]] || [[COK-00x#COK-002W|COK-002W]] || 1-873-513-31 || [[CXD2964GB]] || 90nm || 235.48mm² || 19.17mm x 12.29mm || 14.76mm² || 28.86mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHGxx]] || [[SEM-00x|SEM-001]] || 1-875-384-11<br />1-875-384-21<br />1-875-384-31 || [[CXD2981AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECHHxx]] || [[DIA-00x#DIA-001|DIA-001]] || 1-875-368-11<br />1-875-368-31 || [[CXD2981GB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECHHxx]] || [[DIA-00x#DIA-001|DIA-001]] || 1-875-938-11 || [[CXD2981AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHHxx]] || [[DIA-00x#DIA-001|DIA-001]] || 1-875-938-31 || [[CXD2981AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHJxx]] || [[DIA-00x#DIA-002|DIA-002]] || 1-876-912-31 || [[CXD2989GB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECHKxx]] || [[DIA-00x#DIA-002|DIA-002]] || 1-876-912-32 || [[CXD2989AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECHKxx]] || [[DIA-00x#DIA-002|DIA-002]] || 1-876-912-32 || [[CXD2990GB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || 
|-
| [[CECHLxx]] || [[VER-00x|VER-001]] || - || [[CXD2990AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECHLxx]] || [[VER-00x|VER-001]] || 1-878-196-31 || [[CXD2990GB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECHMxx]] || [[VER-00x|VER-001]] || ?1-878-196-41? || -? || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || -?
|-
| [[CECHPxx]] || [[VER-00x|VER-001]] || 1-878-196-31 || [[CXD2990AGB]] || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || -?
|-
| [[CECHQxx]] || [[VER-00x|VER-001]] || ?1-878-196-41? || CXD299? || 65nm || 174.61mm² || 15.59mm x 11.20mm || 11.08mm² || 19.60mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECH-20xx]] || [[DYN-00x|DYN-001]] || - || [[CXD2992AGB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECH-20xx]] || [[DYN-00x|DYN-001]] || 1-880-055-31 || [[CXD2992AGB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECH-21xx]] || [[SUR-00x|SUR-001]] || - || [[CXD2992AGB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECH-21xx]] || [[SUR-00x|SUR-001]] || 1-881-945-11 || [[CXD2992AGB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || [http://reballing.es/viewtopic.php?f=13&t=2131 reballing.es]
|-
| [[CECH-25xx]] || [[JTP-00x|JTP-001]] || 1-882-481-21 || [[CXD2992GB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || 
|-
| [[CECH-25xx]] || [[JTP-00x|JTP-001]] || 1-882-481-31 || [[CXD2992GB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || [http://www.edepot.com/playstation3.html#PS3_RSX_GPU edepot ps3secrets]
|-
| [[CECH-25xx]] || [[JSD-00x|JSD-001]] || 1-882-481-31 || [[CXD2992GB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || 
|-
| [[CECH-30xx]] || [[KTE-00x|KTE-001]] || 1-884-749-11 || [[CXD2996GB]]? || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || -?
|-
| [[CECH-30xx]] || [[KTE-00x|KTE-001]] || 1-884-749-31 || [[CXD2996GB]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || 6.47mm² || 11.32mm² || 
|-
| [[CECH-40xx]] || [[MSX-00x|MSX-001]] || 1-886-928-11 || [[CXD2996BGB]] || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || [https://www.techrepublic.com/pictures/cracking-open-the-playstation-3-super-slim/ techrepublic]
|-
| [[CECH-40xx]] || [[MPX-00x|MPX-001]] || 1-887-233-11  || [[CXD2996BGB]] || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || -?
|-
| ? || [[NPX-00x|NPX-001]] || ? || ? || 45nm? || 115.46mm²? || 12.75mm x 9.06mm? || 6.47mm²? || 11.32mm²? || -?
|-
| ? || [[PPX-00x|PPX-001]] || ?  || ? || ?nm (smaller ?) || ?mm² || ?mm x ?mm || ?mm² || ?mm² || 
|-
| [[CECH-42xx]] || [[PQX-00x|PQX-001]] || 1-888-629-22  || [[CXD2999AGG]] || ?nm (smaller ?) || ?mm² || ?mm x ?mm || ?mm² || ?mm² || [http://www.mobile01.com/topicdetail.php?f=281&t=3747667&p=1 mobile01_tw]
|-
| ? || [[RTX-00x|RTX-001]] || ?  || ? || ?nm (smaller ?) || ?mm² || ?mm x ?mm || ?mm² || ?mm² || 
|-
| [[CECH-43xx]] || [[REX-00x|REX-001]] || 1-893-507-31  || [[CXD2999AGG]] || 45nm || 115.46mm² || 12.75mm x 9.06mm || ?mm² || ?mm² || Identical die size despite smaller case. Die (sometimes?) glued/soldered to IHS! Do not delid!
|-
|}

===Alternative list===

*[[Template:CELL pad layout 90nm]] (41x41)-(19x19)-84 = 1681-361-84 = '''1236 pads'''
** '''CXD2964 series'''
*** [[CXD2964GB]], found in [[CECHAxx]]/[[COK-00x#COK-001|COK-001]]
*** [[CXD2964AGB]], found in: [[CECHAxx]]/[[COK-00x#COK-001|COK-001]], [[CECHBxx]]/[[COK-00x#COK-001|COK-001]] and [[CECHCxx]]/[[COK-00x#COK-002|COK-002]]
*** CXD2964BGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
*[[Template:CELL pad layout 65nm]] (41x41)-(15x17)-84 = 1681-255-84 = '''1342 pads'''
** '''CXD2981 series'''
*** [[CXD2981GB]], found in: [[CECHHxx]]/[[DIA-00x|DIA-001]]
*** [[CXD2981AGB]], found in: [[CECHHxx]]/[[DIA-00x#DIA-001|DIA-001]] and [[CECHGxx]]/[[SEM-00x|SEM-001]]
*** CXD2981BGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
*** CXD2981CGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
** '''CXD2989 series'''
*** [[CXD2989GB]], found in: [[CECHJxx]]/[[DIA-00x#DIA-002|DIA-002]]
*** [[CXD2989AGB]], found in: [[CECHKxx]]/[[DIA-00x#DIA-002|DIA-002]]
*** CXD2989BGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
** '''CXD2990 series'''
*** [[CXD2990GB]], found in: [[CECHLxx]]/[[VER-00x|VER-001]]
*** [[CXD2990AGB]], found in: [[CECHLxx]]/[[VER-00x|VER-001]]
*** CXD2990BGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
*** Also in [[DECR-1400]]/[[DEB-001]] ?
*[[Template:CELL pad layout 45nm v1]] (41x41)-(17x17)-84 = 1681-289-84 = '''1308 pads'''
** '''CXD2992 series'''
*** [[CXD2992GB]], found in: [[CECH-25xx]]/[[JTP-00x|JTP-001]] and [[CECH-25xx]]/[[JSD-00x|JSD-001]] (without the black plastic spacer in between the IHS and the substrate. Standard thermal paste in the DIE)
*** [[CXD2992AGB]], found in: [[CECH-20xx]]/[[DYN-00x|DYN-001]], [[CECH-21xx]]/[[SUR-00x|SUR-001]]
*** [[CXD2992BGB]], found in: [[CECH-25xx]]/[[JTP-00x|JTP-001]] and [[CECH-25xx]]/[[JSD-00x|JSD-001]] ('''with''' the black plastic spacer in between the IHS and the substrate. Posible '''thermal adhesive''' in the DIE)
*** CXD2992CGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
** '''CXD2996 series'''
*** [[CXD2996GB]], found in: [[CECH-30xx]]/[[KTE-00x|KTE-001]] and [[CECH-40xx]]/[[MSX-00x|MSX-001]]
*** CXD2996AGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
*** [[CXD2996BGB]], found in: [[CECH-30xx]]/[[KTE-00x|KTE-001]] and [[CECH-40xx]]/[[MPX-00x|MPX-001]] ('''with''' the black plastic spacer in between the IHS and the substrate. Posible '''thermal adhesive''' in the DIE)
*** CXD2996CGB, never reported to wiki but google knows it, belongs to the same series with the suffix "GB" -> "AGB" -> "BGB" -> "CGB"
*[[Template:CELL pad layout 45nm v2]] (42x42)-(22x18)-9 = 1764-396-9 = '''1359 pads'''
** '''CXD2999 series (45 nm ?)'''
*** CXD2999GG, never reported to wiki but google knows it, belongs to the same series with the suffix "GG" -> "AGG" -> "BGG"
*** [[CXD2999AGG]], found in: [[CECH-42xx]]/[[PQX-00x|PQX-001]]
*** CXD2999BGG, never reported to wiki but google knows it, belongs to the same series with the suffix "GG" -> "AGG" -> "BGG"
<br />

== PVR (powerpc version register) ==
The PVR inside the microprocessor is the only way to identify what version of what part you have.

 cat /proc/cpuinfo

or

   unsigned int pvr;
   __asm__ __volatile__ ("mfpvr %0" : "=r" (pvr));

code above should work in kernel & user mode. <!-- http://lists.freebsd.org/pipermail/svn-src-head/2010-February/014780.html -->

{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable sortable" style="border:1px solid #999; border-collapse: collapse;" 
|- bgcolor="#cccccc"
! CellBE serial !! die tech !! PVR !! Notes
|-
| [[CXD2964AGB]] || 90nm ||  || 
|-
| [[CXD2964GB]] || 90nm ||  || 
|-
| [[CXD2981AGB]] || 65nm ||  || 
|-
| [[CXD2981GB]] || 65nm ||  || 
|-
| [[CXD2989AGB]] || 65nm ||  || 
|-
| [[CXD2989GB]] || 65nm ||  || 
|-
| [[CXD2990AGB]] || 65nm ||  || 
|-
| [[CXD2990GB]] || 65nm ||  || 
|-
| [[CXD2992AGB]] || 45nm ||  || 
|-
| [[CXD2992GB]] || 45nm ||  || 
|-
| [[CXD2996GB]] || 45nm ||  || 
|-
| [[CXD2999AGG]] ||  ||  || 
|-
|}

=== Cell Revisions ===

{|class="wikitable"
|-
! Low word of BP_VR !! Revision !! Name
|-
| 0x0000 || 0x010 || 90 nm DD 1.0
|-
| 0x0001 || 0x011 || 90 nm DD 1.1
|-
| 0x0002 || 0x012 || 90 nm DD 1.2
|-
| 0x0100 || 0x020 || 90 nm DD 2.0
|-
| 0x0200 || 0x030 || 90 nm DD 3.0
|-
| 0x0201 || 0x031 || 90 nm DD 3.1
|-
| 0x0202 || 0x032 || 90 nm DD 3.2
|-
| 0x1000 || 0x110 || 65 nm DD 1.0
|-
| 0x2000 || 0x210 || 45 nm DD 1.0
|-
| 0x2100 || 0x220 || 45 nm DD 2.0
|}

{| border="1" cellspacing="0" cellpadding="5" border="#999" class="wikitable sortable" style="border:1px solid #999; border-collapse: collapse;" 
|- bgcolor="#cccccc"
! CellBE Version !! PVR !! Speed || SKU
|-
| Cell/BE v1.0 || 0x0070 0x0100 || 2.4GHz || [[CEB-1020]]
|-
| Cell/BE v2.0 || 0x0070 0x0400 || 2.4GHz || [[CEB-2030]], [[CEB-2040]]
|-
| Cell/BE v3.0 || 0x0070 0x0500 || 3.2GHz || [[CEB-2050]]
|-
| Cell/BE v3.1 || 0x0070 0x0501 || 3.2GHz || [[CEB-9000]]
|-
| Cell/BE v3.2 || 0x0070 0x0501 || 3.2GHz ||
|-
| ???? || 0x0070 0x2100 ||  || 
|-
| 11S DD1.0 || ???? || ???? || [[VER-001]]
|-
| 12S DD2.0 || ???? || ???? || [[KTE-001]]
|-
|}

== Unsorted ==
=== Cell Integrated Heat Spreader (IHS) WARNING ===
Starting with PS3 Slim models CECH-25xx some of the CELL Integrated Heat Spreaders are secured to the CELL processor die with thermal adhesive. Cell processor models with a thinner substrate and black plastic spacer in between the IHS and the substrate may be glued. Removing an IHS that is glued to the Cell will destroy the Cell CPU.

=== Integrated Heat Spreader (IHS) removed pic's ===

* when it goes OK: 
** http://imageshack.us/f/855/imgp0048v.jpg/ http://imageshack.us/f/850/imgp0046i.jpg/
** http://www.testhome.de/Austin316/files/Bilder/ps3/Cell_IHS_1.jpg  http://www.testhome.de/Austin316/files/Bilder/ps3/Cell_IHS_2.jpg  http://www.testhome.de/Austin316/files/Bilder/ps3/Cell_IHS_3.jpg

* when it goes wrong: 
** http://postimage.org/image/hl11y3969/full/ http://postimage.org/image/bbydh5s6v/full/

=== IHS size and mounting ===
on a COK-001 the CPU heatspreader is 4.00cm x 4.00cm while the RSX heatspreader is 4.25cm x 4.25 cm - CPU and RSX mountholes are 8.75cm apart and 6.3mm diameter

although a PC cooler should fit within these dimensions fine, mounting the 2 (which are also elevated differently from the motherboard) can be problematic

=== IHSBuster tool ===
<gallery>
File:IHSBuster-pic0.png|[[CELL BE]] IHSBuster - pic0
File:IHSBuster-pic1.png|[[CELL BE]] IHSBuster - pic1
File:IHSBuster-pic2.png|[[CELL BE]] IHSBuster - pic2
File:IHSBuster-pic3.png|[[CELL BE]] IHSBuster - pic3
</gallery>


{{Motherboard Components}}<noinclude>[[Category:Main]]</noinclude>