Heatsink

Overview

This page is currently work-in-progress. (November 2023)

B/B' chassis heatsink

• On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
  • This is because of the different heights of the GS variants used in these chassis (CXD2944GB in B-chassis and CXD2934GB in B'-chassis), which require thermal pads with a different height
• This heatsink is unique in that it also cools the DSP via an additional thermal pad. DSP is not cooled in most chassis types.
• Has a heatpipe

C/C' chassis heatsink

• On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
  • This is because of the different heights of the GS variants used in these chassis (CXD2944GB in C-chassis and CXD2934GB in C'-chassis), which require thermal pads with a different height
• Has no heatpipe, but larger fin area (compared to B/B' chassis)

D/D' chassis heatsink

• On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
  • This is because of the different heights of the GS variants used in these chassis (CXD2944GB in D-chassis and CXD2934GB in D'-chassis), which require thermal pads with a different height

R-chassis heatsink (large shield type)

Goes with the GH-071 board

R-chassis heatsink (small shield type)

Goes with the GH-072 board

Also used in the Sony BRAVIA KDL22PX300