Heatsink

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Overview

This page is currently work-in-progress. (November 2023)

A/A+ chassis heatsink

B/B' chassis heatsink

  • On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
  • This heatsink is unique in that it also cools the DSP via an additional thermal pad. DSP is not cooled in most chassis.
  • Has a heatpipe

C/C' chassis heatsink

  • On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
  • Has no heatpipe, but larger fin area (compared to B/B' chassis)

AB-chassis heatsink

D/D' chassis heatsink

  • On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.

F-chassis heatsink (type 1, large aluminum fins)

F-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)

G-chassis heatsink (type 1, large aluminum fins)

G-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)

H-chassis heatsink

I-chassis heatsink

J-chassis heatsink

K-chassis heatsink (separate EE and GS)

K-chassis heatsink (combined EE+GS)

L-chassis heatsink (separate EE and GS)

L-chassis heatsink (combined EE+GS)

M-chassis heatsink

N-chassis heatsink

P-chassis heatsink

R-chassis heatsink (large shield type)

Goes with the GH-071 board

R-chassis heatsink (small shield type)

Goes with the GH-072 board Also used in the Sony BRAVIA KDL22PX300

PSX heatsink