Heatsink: Difference between revisions
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= B/B' chassis heatsink = | = B/B' chassis heatsink = | ||
* On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | * On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | ||
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in B-chassis and CXD2934GB in B'-chassis), which require thermal pads with a different height | |||
* This heatsink is unique in that it also cools the [[DSP]] via an additional thermal pad. DSP is not cooled in most chassis types. | * This heatsink is unique in that it also cools the [[DSP]] via an additional thermal pad. DSP is not cooled in most chassis types. | ||
* Has a heatpipe | * Has a heatpipe | ||
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= C/C' chassis heatsink = | = C/C' chassis heatsink = | ||
* On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | * On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | ||
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in C-chassis and CXD2934GB in C'-chassis), which require thermal pads with a different height | |||
* Has no heatpipe, but larger fin area (compared to B/B' chassis) | * Has no heatpipe, but larger fin area (compared to B/B' chassis) | ||
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= D/D' chassis heatsink = | = D/D' chassis heatsink = | ||
* On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | * On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | ||
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in D-chassis and CXD2934GB in D'-chassis), which require thermal pads with a different height | |||
= F-chassis heatsink (type 1, large aluminum fins) = | = F-chassis heatsink (type 1, large aluminum fins) = | ||
Revision as of 23:07, 29 September 2024
Overview
This page is currently work-in-progress. (November 2023)
A/A+ chassis heatsink
B/B' chassis heatsink
- On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- This is because of the different heights of the GS variants used in these chassis (CXD2944GB in B-chassis and CXD2934GB in B'-chassis), which require thermal pads with a different height
- This heatsink is unique in that it also cools the DSP via an additional thermal pad. DSP is not cooled in most chassis types.
- Has a heatpipe
C/C' chassis heatsink
- On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- This is because of the different heights of the GS variants used in these chassis (CXD2944GB in C-chassis and CXD2934GB in C'-chassis), which require thermal pads with a different height
- Has no heatpipe, but larger fin area (compared to B/B' chassis)
AB-chassis heatsink
D/D' chassis heatsink
- On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- This is because of the different heights of the GS variants used in these chassis (CXD2944GB in D-chassis and CXD2934GB in D'-chassis), which require thermal pads with a different height
F-chassis heatsink (type 1, large aluminum fins)
F-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)
G-chassis heatsink (type 1, large aluminum fins)
G-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)
H-chassis heatsink
I-chassis heatsink
J-chassis heatsink
K-chassis heatsink (separate EE and GS)
K-chassis heatsink (combined EE+GS)
L-chassis heatsink (separate EE and GS)
L-chassis heatsink (combined EE+GS)
M-chassis heatsink
N-chassis heatsink
P-chassis heatsink
R-chassis heatsink (large shield type)
Goes with the GH-071 board
R-chassis heatsink (small shield type)
Goes with the GH-072 board
Also used in the Sony BRAVIA KDL22PX300