Emotion Engine: Difference between revisions
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The Emotion Engine used in Playstation 2 gaming console is a central processing unit developed and manufactured by Sony Computer Entertainment and Toshiba. It was also used in early PlayStation 3 models sold in Japan and North America (Model Numbers CECHAxx & CECHBxx) to provide PlayStation 2 game backward compatibility. Mass production of the Emotion Engine began in 1999 and ended in late 2012 with the discontinuation of the PlayStation 2. The first revision released in retail consoles, CXD9542GB, is known to have been manufactured using a 250nm process, to contain 13.5 millions of transistors and to consume 18 W of power. | The Emotion Engine used in Playstation 2 gaming console is a central processing unit developed and manufactured by Sony Computer Entertainment and Toshiba. It was also used in early PlayStation 3 models sold in Japan and North America (Model Numbers CECHAxx & CECHBxx) to provide PlayStation 2 game backward compatibility. Mass production of the Emotion Engine began in 1999 and ended in late 2012 with the discontinuation of the PlayStation 2. The first revision released in retail consoles, CXD9542GB, is known to have been manufactured using a 250nm process, to contain 13.5 millions of transistors and to consume 18 W of power. | ||
There have been die-shrinks and optimizations over the years, but it's unknown with which revision these happened. | |||
== Revisions == | == Revisions == | ||
Revision as of 17:54, 15 October 2021
Overview
The Emotion Engine used in Playstation 2 gaming console is a central processing unit developed and manufactured by Sony Computer Entertainment and Toshiba. It was also used in early PlayStation 3 models sold in Japan and North America (Model Numbers CECHAxx & CECHBxx) to provide PlayStation 2 game backward compatibility. Mass production of the Emotion Engine began in 1999 and ended in late 2012 with the discontinuation of the PlayStation 2. The first revision released in retail consoles, CXD9542GB, is known to have been manufactured using a 250nm process, to contain 13.5 millions of transistors and to consume 18 W of power.
There have been die-shrinks and optimizations over the years, but it's unknown with which revision these happened.
Revisions
- 1.4: CXD9542GB (GH-001, GH-003)
- 2.0: CXD9615GB (GH-004 - GH-016, GH-015 might contain either CXD9615GB or CXD9708GB)
- 3.0 / 3.1: CXD9708GB (GH-015 - GH-032-11 (at least), GH-015 might contain either CXD9615GB or CXD9708GB)
- 3.0 / 3.1: CXD9832GB (? - GH-32-54 - ?)
- 4.3: CXD2976GB (plastic case, also includes the RDRAM and IOP with IOP's RAM and SPU2 with SPU2's RAM, GH-061-12 - GH-072-42, thus used in every 79XXX and 90XXX slim PS2)