Heatsink: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
|||
| (5 intermediate revisions by 2 users not shown) | |||
| Line 6: | Line 6: | ||
= B/B' chassis heatsink = | = B/B' chassis heatsink = | ||
* On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | * On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | ||
* This heatsink is unique in that it also cools the [[DSP]] via an additional thermal pad. DSP is not cooled in most chassis. | ** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in B-chassis and CXD2934GB in B'-chassis), which require thermal pads with a different height | ||
* This heatsink is unique in that it also cools the [[DSP]] via an additional thermal pad. DSP is not cooled in most chassis types. | |||
* Has a heatpipe | * Has a heatpipe | ||
= C/C' chassis heatsink = | = C/C' chassis heatsink = | ||
* On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | * On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | ||
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in C-chassis and CXD2934GB in C'-chassis), which require thermal pads with a different height | |||
* Has no heatpipe, but larger fin area (compared to B/B' chassis) | |||
= AB-chassis heatsink = | = AB-chassis heatsink = | ||
| Line 16: | Line 19: | ||
= D/D' chassis heatsink = | = D/D' chassis heatsink = | ||
* On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | * On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used. | ||
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in D-chassis and CXD2934GB in D'-chassis), which require thermal pads with a different height | |||
= F-chassis heatsink (type 1, large aluminum fins) = | = F-chassis heatsink (type 1, large aluminum fins) = | ||
| Line 47: | Line 51: | ||
= R-chassis heatsink (large shield type) = | = R-chassis heatsink (large shield type) = | ||
''Goes with the GH-071 board'' | ''Goes with the GH-071 board'' | ||
*Has no cooling fins anymore; only the shield itself acts as heatsink | |||
= R-chassis heatsink (small shield type) = | = R-chassis heatsink (small shield type) = | ||
''Goes with the GH-072 board | ''Goes with the GH-072 board and is also used in the [[Sony BRAVIA KDL22PX300]]'' | ||
*Has no cooling fins anymore; only the shield itself acts as heatsink | |||
= [[PSX]] heatsink = | = [[PSX]] heatsink = | ||
Latest revision as of 02:31, 12 November 2024
Overview[edit | edit source]
This page is currently work-in-progress. (November 2023)
A/A+ chassis heatsink[edit | edit source]
B/B' chassis heatsink[edit | edit source]
- On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- This is because of the different heights of the GS variants used in these chassis (CXD2944GB in B-chassis and CXD2934GB in B'-chassis), which require thermal pads with a different height
- This heatsink is unique in that it also cools the DSP via an additional thermal pad. DSP is not cooled in most chassis types.
- Has a heatpipe
C/C' chassis heatsink[edit | edit source]
- On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- This is because of the different heights of the GS variants used in these chassis (CXD2944GB in C-chassis and CXD2934GB in C'-chassis), which require thermal pads with a different height
- Has no heatpipe, but larger fin area (compared to B/B' chassis)
AB-chassis heatsink[edit | edit source]
D/D' chassis heatsink[edit | edit source]
- On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
- This is because of the different heights of the GS variants used in these chassis (CXD2944GB in D-chassis and CXD2934GB in D'-chassis), which require thermal pads with a different height
F-chassis heatsink (type 1, large aluminum fins)[edit | edit source]
F-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)[edit | edit source]
G-chassis heatsink (type 1, large aluminum fins)[edit | edit source]
G-chassis heatsink (type 2, thin sheet-aluminum fins with heat pipe)[edit | edit source]
H-chassis heatsink[edit | edit source]
I-chassis heatsink[edit | edit source]
J-chassis heatsink[edit | edit source]
K-chassis heatsink (separate EE and GS)[edit | edit source]
K-chassis heatsink (combined EE+GS)[edit | edit source]
L-chassis heatsink (separate EE and GS)[edit | edit source]
L-chassis heatsink (combined EE+GS)[edit | edit source]
M-chassis heatsink[edit | edit source]
N-chassis heatsink[edit | edit source]
P-chassis heatsink[edit | edit source]
R-chassis heatsink (large shield type)[edit | edit source]
Goes with the GH-071 board
- Has no cooling fins anymore; only the shield itself acts as heatsink
R-chassis heatsink (small shield type)[edit | edit source]
Goes with the GH-072 board and is also used in the Sony BRAVIA KDL22PX300
- Has no cooling fins anymore; only the shield itself acts as heatsink