EE+GS: Difference between revisions
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Combination of [[Emotion Engine]] and [[Graphics Synthesizer]] used on some slim PS2 motherboards, in the | Combination of [[Emotion Engine]] and [[Graphics Synthesizer]] used on some slim PS2 motherboards, in the Japan-only PSX DVR and in Japan/US launch model PS3 consoles. | ||
One of the first mass-produced 90nm ICs, as claimed by Sony. [https://www.eetimes.com/semi-insights-stands-by-not-90-nm-description-of-psx-chip/ This claim is however disputed.] Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known<ref>https://www.sie.com/content/dam/corporate/en/corporate/release/pdf/030421be.pdf</ref>: | One of the first mass-produced 90nm ICs, as claimed by Sony. [https://www.eetimes.com/semi-insights-stands-by-not-90-nm-description-of-psx-chip/ This claim is however disputed.] Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known<ref>https://www.sie.com/content/dam/corporate/en/corporate/release/pdf/030421be.pdf</ref>: | ||
*EE: 128 bit RISC | *EE: 128 bit RISC | ||
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*Package: 536 pin EBGA | *Package: 536 pin EBGA | ||
All revisions seem to be manufactured using the same process, as they all have an identical die area. | |||
== Revisions == | == Revisions == | ||
*GS 1.12 + EE 4.2: CXD9797GB (some or all PSX first revision motherboard XPD-001, some GH-035-11, probably also on some XPD-005 or other GH-035 - ?) | *GS 1.12 + EE 4.2: CXD9797GB (some or all PSX first revision motherboard XPD-001, some GH-035-11, probably also on some XPD-005 or other GH-035 - ?) | ||
| Line 19: | Line 21: | ||
*GS 1.12 + EE 4.2: CXD9833GB (GH-035 - GH-052, XPD-005 (PSX), probably also on some XPD-001 (PSX), probably also on some PlayStation 3 COK-001 boards or prototypes since this revision is referenced in the PS3 service manual) | *GS 1.12 + EE 4.2: CXD9833GB (GH-035 - GH-052, XPD-005 (PSX), probably also on some XPD-001 (PSX), probably also on some PlayStation 3 COK-001 boards or prototypes since this revision is referenced in the PS3 service manual) | ||
** Apparently manufactured and used in parallel to CXD2953AGB | ** Apparently manufactured and used in parallel to CXD2953AGB | ||
** 86 mm² die size | |||
** Produced 2004 - 2007 | ** Produced 2004 - 2007 | ||
*GS 1.13 + EE 4.2: CXD2953AGB (GH-035 - GH-052, probably also on some PSX boards XPD-001 or XPD-005, PlayStation 3 COK-001) | *GS 1.13 + EE 4.2: CXD2953AGB (GH-035 - GH-052, probably also on some PSX boards XPD-001 or XPD-005, PlayStation 3 COK-001) | ||
** Apparently manufactured and used in parallel to CXD9833GB | ** Apparently manufactured and used in parallel to CXD9833GB | ||
** 86 mm² die size | |||
** Produced 2004 - 2007 | ** Produced 2004 - 2007 | ||
All revisions have a copyright date of 2003. | All revisions have a copyright date of 2003. | ||
The 3 revisions seem to be externally interchangeable (at most maybe requiring some minimal changes to external circuitry), since all 3 of them can be found on the same board (GH-035). | The 3 revisions seem to be externally interchangeable (at most maybe requiring some minimal changes to external circuitry, maybe not even requiring any changes at all), since all 3 of them can be found on the same board (GH-035). | ||
For SCPH- | For SCPH-790xx and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP, SPU2 and RDRAM instead. | ||
Latest revision as of 01:42, 20 January 2024
Combination of Emotion Engine and Graphics Synthesizer used on some slim PS2 motherboards, in the Japan-only PSX DVR and in Japan/US launch model PS3 consoles. One of the first mass-produced 90nm ICs, as claimed by Sony. This claim is however disputed. Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known[1]:
- EE: 128 bit RISC
- GS: Parallel rendering processor with embedded DRAM
- Process: 90 nm
- Total number of transistors: 53.5 million
- Embedded DRAM: 4 MB
- Memory size: 0.19 µm²
- Clock frequency: 294.912 Mhz
- Power consumption: 8 W (initial power consumption was 37 W two chips total)
- Metal layer: 5
- Die size: 86 mm² (initial die size was 413 mm² two chips total)
- Package: 536 pin EBGA
All revisions seem to be manufactured using the same process, as they all have an identical die area.
Revisions[edit | edit source]
- GS 1.12 + EE 4.2: CXD9797GB (some or all PSX first revision motherboard XPD-001, some GH-035-11, probably also on some XPD-005 or other GH-035 - ?)
- 86 mm² die size with Toshiba's "CMOS4 90 nm" process
- Produced 2003 - 2004
- GS 1.12 + EE 4.2: CXD9833GB (GH-035 - GH-052, XPD-005 (PSX), probably also on some XPD-001 (PSX), probably also on some PlayStation 3 COK-001 boards or prototypes since this revision is referenced in the PS3 service manual)
- Apparently manufactured and used in parallel to CXD2953AGB
- 86 mm² die size
- Produced 2004 - 2007
- GS 1.13 + EE 4.2: CXD2953AGB (GH-035 - GH-052, probably also on some PSX boards XPD-001 or XPD-005, PlayStation 3 COK-001)
- Apparently manufactured and used in parallel to CXD9833GB
- 86 mm² die size
- Produced 2004 - 2007
All revisions have a copyright date of 2003.
The 3 revisions seem to be externally interchangeable (at most maybe requiring some minimal changes to external circuitry, maybe not even requiring any changes at all), since all 3 of them can be found on the same board (GH-035).
For SCPH-790xx and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP, SPU2 and RDRAM instead.