EE+GS: Difference between revisions
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*CXD2953AGB (PlayStation 3 COK-001) | *CXD2953AGB (PlayStation 3 COK-001) | ||
For SCPH-79XXX and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP and RDRAM instead. | For SCPH-79XXX and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP, SPU2 and RDRAM instead. | ||
Revision as of 01:15, 26 September 2021
Combination of Emotion Engine and Graphics Synthesizer used on later slim PS2 motherboard revisions, in the japanese-only PSX DVR and in Japan/US launch model PS3 consoles. One of the first mass-produced 90nm ICs. Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known[1]:
- EE: 128 bit RISC
- GS: Parallel rendering processor with embedded DRAM
- Process: 90 nm
- Total number of transistors: 53.5 million
- Embedded DRAM: 4 MB
- Memory size: 0.19 µm²
- Clock frequency: 294.912 Mhz
- Power consumption: 8 W (initial power consumption was 37 W two chips total)
- Metal layer: 5
- Die size: 86 mm² (initial die size was 413 mm² two chips total)
- Package: 536 pin EBGA
Revisions
- CXD9797GB (PSX first revision motherboard XPD-001)
- CXD9833GB (? - GH-051-32 - ?)
- ...
- CXD2953AGB (PlayStation 3 COK-001)
For SCPH-79XXX and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP, SPU2 and RDRAM instead.