EE+GS: Difference between revisions

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*CXD2953AGB (PlayStation 3 COK-001)
*CXD2953AGB (PlayStation 3 COK-001)
*CXD2976GB (plastic case, also includes the RDRAM, GH-061-12 - GH-072-42, thus used in every 79XXX and 90XXX slim PS2)

Revision as of 23:55, 25 September 2021

Combination of Emotion Engine and Graphics Synthesizer used on later slim PS2 motherboard revisions, in the japanese-only PSX DVR and in Japan/US launch model PS3 consoles. One of the first mass-produced 90nm ICs. Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known[1]:

  • EE: 128 bit RISC
  • GS: Parallel rendering processor with embedded DRAM
  • Process: 90 nm
  • Total number of transistors: 53.5 million
  • Embedded DRAM: 4 MB
  • Memory size: 0.19 µm²
  • Clock frequency: 294.912 Mhz
  • Power consumption: 8 W (initial power consumption was 37 W two chips total)
  • Metal layer: 5
  • Die size: 86 mm² (initial die size was 413 mm² two chips total)
  • Package: 536 pin EBGA

Revisions

  • CXD9797GB (PSX first revision motherboard XPD-001)
  • CXD9833GB (? - GH-051-32 - ?)
  • ...
  • CXD2953AGB (PlayStation 3 COK-001)