EE+GS: Difference between revisions
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Combination of [[Emotion Engine]] and [[Graphics Synthesizer]] used on later slim PS2 motherboard revisions, in the japanese-only PSX DVR and in Japan/US launch model PS3 consoles. | Combination of [[Emotion Engine]] and [[Graphics Synthesizer]] used on later slim PS2 motherboard revisions, in the japanese-only PSX DVR and in Japan/US launch model PS3 consoles. | ||
One of the first mass-produced 90nm ICs. Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known<ref>https://www.sie.com/content/dam/corporate/en/corporate/release/pdf/030421be.pdf</ref>: | |||
*EE: 128 bit RISC | |||
*GS: Parallel rendering processor with embedded DRAM | |||
*Process: 90 nm | |||
*Total number of transistors: 53.5 million | |||
*Embedded DRAM: 4 MB | |||
*Memory size: 0.19 µm² | |||
*Clock frequency: 294.912 Mhz | |||
*Power consumption: 8 W (initial power consumption was 37Watts two chips total) | |||
*Metal layer: 5 | |||
*Die size: 86 mm² (initial die size was 413 mm2 two chips total) | |||
*Package: 536 pin EBGA | |||
== Revisions == | == Revisions == | ||
Revision as of 17:47, 25 September 2021
Combination of Emotion Engine and Graphics Synthesizer used on later slim PS2 motherboard revisions, in the japanese-only PSX DVR and in Japan/US launch model PS3 consoles. One of the first mass-produced 90nm ICs. Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known[1]:
- EE: 128 bit RISC
- GS: Parallel rendering processor with embedded DRAM
- Process: 90 nm
- Total number of transistors: 53.5 million
- Embedded DRAM: 4 MB
- Memory size: 0.19 µm²
- Clock frequency: 294.912 Mhz
- Power consumption: 8 W (initial power consumption was 37Watts two chips total)
- Metal layer: 5
- Die size: 86 mm² (initial die size was 413 mm2 two chips total)
- Package: 536 pin EBGA