Editing Heatsink

Jump to navigation Jump to search
Warning: You are not logged in. Your IP address will be publicly visible if you make any edits. If you log in or create an account, your edits will be attributed to your username, along with other benefits.

The edit can be undone. Please check the comparison below to verify that this is what you want to do, and then publish the changes below to finish undoing the edit.

Latest revision Your text
Line 6: Line 6:
= B/B' chassis heatsink =
= B/B' chassis heatsink =
* On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
* On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in B-chassis and CXD2934GB in B'-chassis), which require thermal pads with a different height
* This heatsink is unique in that it also cools the [[DSP]] via an additional thermal pad. DSP is not cooled in most chassis.
* This heatsink is unique in that it also cools the [[DSP]] via an additional thermal pad. DSP is not cooled in most chassis types.
* Has a heatpipe
* Has a heatpipe


= C/C' chassis heatsink =
= C/C' chassis heatsink =
* On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
* On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in C-chassis and CXD2934GB in C'-chassis), which require thermal pads with a different height
* Has no heatpipe, but larger fin area (compared to B/B' chassis)


= AB-chassis heatsink =
= AB-chassis heatsink =
Line 19: Line 16:
= D/D' chassis heatsink =
= D/D' chassis heatsink =
* On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
* On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in D-chassis and CXD2934GB in D'-chassis), which require thermal pads with a different height


= F-chassis heatsink (type 1, large aluminum fins) =
= F-chassis heatsink (type 1, large aluminum fins) =
Line 54: Line 50:
= R-chassis heatsink (small shield type) =
= R-chassis heatsink (small shield type) =
''Goes with the GH-072 board''
''Goes with the GH-072 board''
''Also used in the [[Sony BRAVIA KDL22PX300]]''
''Also used in the [[Sony BRAVIA KDL22PX300]]''


= [[PSX]] heatsink =
= [[PSX]] heatsink =
Please note that all contributions to PS2 Developer wiki are considered to be released under the GNU Free Documentation License 1.2 (see PS2 Developer wiki:Copyrights for details). If you do not want your writing to be edited mercilessly and redistributed at will, then do not submit it here.
You are also promising us that you wrote this yourself, or copied it from a public domain or similar free resource. Do not submit copyrighted work without permission!

To protect the wiki against automated edit spam, we kindly ask you to solve the following hCaptcha:

Cancel Editing help (opens in new window)
Retrieved from "http://www.psdevwiki.com/ps2/Heatsink"