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= B/B' chassis heatsink =
= B/B' chassis heatsink =
* On B-chassis, a single thermal pad for EE, GS and RDRAM is used. On B'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in B-chassis and CXD2934GB in B'-chassis), which require thermal pads with a different height
* This heatsink is unique in that it also cools the [[DSP]] via an additional thermal pad. DSP is not cooled in most chassis types.
* Has a heatpipe


= C/C' chassis heatsink =
= C/C' chassis heatsink =
* On C-chassis, a single thermal pad for EE, GS and RDRAM is used. On C'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in C-chassis and CXD2934GB in C'-chassis), which require thermal pads with a different height
* Has no heatpipe, but larger fin area (compared to B/B' chassis)


= AB-chassis heatsink =
= AB-chassis heatsink =


= D/D' chassis heatsink =
= D/D' chassis heatsink =
* On D-chassis, a single thermal pad for EE, GS and RDRAM is used. On D'-chassis, a thermal pad for EE and RDRAM and a separate thermal pad for GS are used.
** This is because of the different heights of the GS variants used in these chassis (CXD2944GB in D-chassis and CXD2934GB in D'-chassis), which require thermal pads with a different height


= F-chassis heatsink (type 1, large aluminum fins) =
= F-chassis heatsink (type 1, large aluminum fins) =
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= R-chassis heatsink (small shield type) =
= R-chassis heatsink (small shield type) =
''Goes with the GH-072 board''
''Goes with the GH-072 board''
''Also used in the [[Sony BRAVIA KDL22PX300]]''
''Also used in the [[Sony BRAVIA KDL22PX300]]''


= [[PSX]] heatsink =
= [[PSX]] heatsink =
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