Editing EE+GS
Jump to navigation
Jump to search
The edit can be undone. Please check the comparison below to verify that this is what you want to do, and then publish the changes below to finish undoing the edit.
| Latest revision | Your text | ||
| Line 1: | Line 1: | ||
Combination of [[Emotion Engine]] and [[Graphics Synthesizer]] used on | Combination of [[Emotion Engine]] and [[Graphics Synthesizer]] used on later slim PS2 motherboard revisions, in the japanese-only PSX DVR and in Japan/US launch model PS3 consoles. | ||
One of the first mass-produced 90nm ICs | One of the first mass-produced 90nm ICs. Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known<ref>https://www.sie.com/content/dam/corporate/en/corporate/release/pdf/030421be.pdf</ref>: | ||
*EE: 128 bit RISC | *EE: 128 bit RISC | ||
*GS: Parallel rendering processor with embedded DRAM | *GS: Parallel rendering processor with embedded DRAM | ||
| Line 8: | Line 8: | ||
*Memory size: 0.19 µm² | *Memory size: 0.19 µm² | ||
*Clock frequency: 294.912 Mhz | *Clock frequency: 294.912 Mhz | ||
*Power consumption: 8 W (initial power consumption was | *Power consumption: 8 W (initial power consumption was 37Watts two chips total) | ||
*Metal layer: 5 | *Metal layer: 5 | ||
*Die size: 86 mm² (initial die size was 413 | *Die size: 86 mm² (initial die size was 413 mm2 two chips total) | ||
*Package: 536 pin EBGA | *Package: 536 pin EBGA | ||
== Revisions == | == Revisions == | ||