Editing EE+GS

Combination of [[Emotion Engine]] and [[Graphics Synthesizer]] used on some slim PS2 motherboards, in the japanese-only PSX DVR and in Japan/US launch model PS3 consoles.
One of the first mass-produced 90nm ICs, as claimed by Sony. [https://www.eetimes.com/semi-insights-stands-by-not-90-nm-description-of-psx-chip/ This claim is however disputed.] Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known<ref>https://www.sie.com/content/dam/corporate/en/corporate/release/pdf/030421be.pdf</ref>:
*EE: 128 bit RISC
*GS: Parallel rendering processor with embedded DRAM
*Process: 90 nm
*Total number of transistors: 53.5 million
*Embedded DRAM: 4 MB
*Memory size: 0.19 µm²
*Clock frequency: 294.912 Mhz
*Power consumption: 8 W (initial power consumption was 37 W two chips total)
*Metal layer: 5
*Die size: 86 mm² (initial die size was 413 mm² two chips total)
*Package: 536 pin EBGA

== Revisions ==
*GS 1.12 + EE 4.2: CXD9797GB (PSX first revision motherboard XPD-001, GH-035-11 - ?)
** 86 mm² die size with Toshiba's "CMOS4 90 nm" process
** Produced 2003 - 2004
*GS 1.12 + EE 4.2: CXD9833GB (? - GH-035-11 - GH-052-42 - ?)
** Apparently manufactured and used in parallel to CXD2953AGB
** Produced 2004 - 2007
*GS 1.13 + EE 4.2: CXD2953AGB (GH-035-XX - GH-051-51, PlayStation 3 COK-001)
** ~60 mm² die size, likely with a more advanced 90 nm process
** Apparently manufactured and used in parallel to CXD9833GB
** Produced 2004 - 2007

The 3 revisions seem to be externally interchangeable (at most maybe requiring some minimal changes to external circuitry), since all 3 of them have been used on a single board (GH-035).

For SCPH-79XXX and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP, SPU2 and RDRAM instead.