Editing EE+GS

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Combination of [[Emotion Engine]] and [[Graphics Synthesizer]] used on some slim PS2 motherboards, in the Japan-only PSX DVR and in Japan/US launch model PS3 consoles.
Combination of [[Emotion Engine]] and [[Graphics Synthesizer]] used on some slim PS2 motherboards, in the japanese-only PSX DVR and in Japan/US launch model PS3 consoles.
One of the first mass-produced 90nm ICs, as claimed by Sony. [https://www.eetimes.com/semi-insights-stands-by-not-90-nm-description-of-psx-chip/ This claim is however disputed.] Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known<ref>https://www.sie.com/content/dam/corporate/en/corporate/release/pdf/030421be.pdf</ref>:
One of the first mass-produced 90nm ICs, as claimed by Sony. [https://www.eetimes.com/semi-insights-stands-by-not-90-nm-description-of-psx-chip/ This claim is however disputed.] Thanks to an old Sony press release, many details (of the first revisions; might have changed later on) are publicly known<ref>https://www.sie.com/content/dam/corporate/en/corporate/release/pdf/030421be.pdf</ref>:
*EE: 128 bit RISC
*EE: 128 bit RISC
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*Package: 536 pin EBGA
*Package: 536 pin EBGA


All revisions seem to be manufactured using the same process, as they all have an identical die area.
== Revisions ==
== Revisions ==
*GS 1.12 + EE 4.2: CXD9797GB (some or all PSX first revision motherboard XPD-001, some GH-035-11, probably also on some XPD-005 or other GH-035 - ?)
*GS 1.12 + EE 4.2: CXD9797GB (PSX first revision motherboard XPD-001, GH-035-11 - ?)
** 86 mm² die size with Toshiba's "CMOS4 90 nm" process
** 86 mm² die size with Toshiba's "CMOS4 90 nm" process
** Produced 2003 - 2004
** Produced 2003 - 2004
*GS 1.12 + EE 4.2: CXD9833GB (GH-035 - GH-052, XPD-005 (PSX), probably also on some XPD-001 (PSX), probably also on some PlayStation 3 COK-001 boards or prototypes since this revision is referenced in the PS3 service manual)
*GS 1.12 + EE 4.2: CXD9833GB (? - GH-035-11 - GH-052-42 - ?)
** Apparently manufactured and used in parallel to CXD2953AGB
** Apparently manufactured and used in parallel to CXD2953AGB
** 86 mm² die size
** Produced 2004 - 2007
** Produced 2004 - 2007
*GS 1.13 + EE 4.2: CXD2953AGB (GH-035 - GH-052, probably also on some PSX boards XPD-001 or XPD-005, PlayStation 3 COK-001)
*GS 1.13 + EE 4.2: CXD2953AGB (GH-035-XX - GH-051-51, PlayStation 3 COK-001)
** ~60 mm² die size, likely with a more advanced 90 nm process
** Apparently manufactured and used in parallel to CXD9833GB
** Apparently manufactured and used in parallel to CXD9833GB
** 86 mm² die size
** Produced 2004 - 2007
** Produced 2004 - 2007


All revisions have a copyright date of 2003.
The 3 revisions seem to be externally interchangeable (at most maybe requiring some minimal changes to external circuitry), since all 3 of them have been used on a single board (GH-035).
 
The 3 revisions seem to be externally interchangeable (at most maybe requiring some minimal changes to external circuitry, maybe not even requiring any changes at all), since all 3 of them can be found on the same board (GH-035).


For SCPH-790xx and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP, SPU2 and RDRAM instead.
For SCPH-79XXX and newer PS2 consoles, GS was separated from EE again and EE was combined with IOP, SPU2 and RDRAM instead.
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