CPU: Difference between revisions

Revision as of 10:50, 31 December 2022

Relative size of these pictures is not to scale. See below for actual sizes.


<imgur w=486>PE0z6bx.jpg</imgur>	<imgur w=486>UfvCXSG.jpg</imgur>	<imgur w=486>e7i00rQ.jpg</imgur>
Dieshot of CXD8530Q taken from Ken Kutaragis presentation at Hot Chips '99.	Dieshot of CXD8530CQ taken from zeptobars.com.	Dieshot of CXD8606Q taken from Ken Kutaragis presentation at Hot Chips '99.

CXD8530Q
- Found on some PU-7
- Die size: 128 mm², 1M transistors
- Comes in a metal QFP package
CXD8530AQ
- Found on some PU-7
- Comes in a metal QFP package
CXD8530BQ
- Found on some PU-7
- This revision and all later revisions are implemented in standard cells as an ASIC, which means there are less visible structures on the die.
- This revision and all later revisions come in a plastic QFP package.
CXD8530CQ
- Found on some PU-8 and PU-16
- Die size: 66 mm²

From PU-18 onwards (SCPH-55XX), only CXD8606 was used.

@@ Line 15: / Line 15: @@
 ** Found on some PU-7
 ** Die size: 128 mm², 1M transistors
+** Comes in a metal QFP package
 * CXD8530AQ
 ** Found on some PU-7
+** Comes in a metal QFP package
 * CXD8530BQ
 ** Found on some PU-7
 ** This revision and all later revisions are implemented in standard cells as an ASIC, which means there are less visible structures on the die.
+** This revision and all later revisions come in a plastic QFP package.
 * CXD8530CQ
 ** Found on some PU-8 and PU-16