Editing CPU

== Overview ==
'''LSI CoreWare CW33300-based core'''
* MIPS R3000A-compatible 32-bit RISC CPU MIPS R3051 with 5&nbsp;KB L1&nbsp;cache, running at 33.8688&nbsp;MHz
* The microprocessor was manufactured by LSI Logic Corp. with technology licensed from SGI
* Features:
** Initial feature size (process node) was 0.5 micron (500&nbsp;nm)
** 850k – 1M transistors
** Operating performance: 30&nbsp;MIPS
** Bus bandwidth 132&nbsp;MB/s
** One arithmetic/logic unit (ALU)
** One shifter
* CPU cache:
** 4&nbsp;KB instruction cache
** 1&nbsp;KB non-associative SRAM data cache

'''Geometry Transformation Engine (GTE)'''
* Coprocessor that resides inside the main CPU processor, giving it additional vector math instructions used for 3D graphics, lighting, geometry, polygon and coordinate transformations - GTE performs high-speed matrix multiplications
* Operating performance: 66 MIPS
* Polygons per second (rendered in hardware):
** 90,000 with texture mapping, lighting and Gouraud shading
** 180,000 with texture mapping
** 360,000 with flat shading

'''Motion Decoder (MDEC)'''
* Also residing within the main CPU, enables full screen, high quality FMV playback and is responsible for decompressing images and video into VRAM
* Operating performance: 80 MIPS
* Documented device mode is to read three RLE-encoded 16×16 macroblocks, run IDCT and assemble a single 16×16 RGB macroblock
* Output data may be transferred directly to GPU via DMA
* It is possible to overwrite IDCT matrix and some additional parameters, however MDEC internal instruction set was never documented
* It is directly connected to a CPU bus

'''System Control Coprocessor (Cop0)'''
* This unit is part of the CPU. Has 16 32-bit control registers
* Modified from the original R3000A cop0 architecture, with the addition of a few registers and functions
* Controls memory management through virtual memory technique, system interrupts, exception handling, and breakpoints

== Revisions ==

=== CXD8530 ===
* CXD8530Q
** Found on some PU-7, very early/launch units
** Die size: 128 mm², 1M transistors
** Manufactured in 0.6 µm
** Comes in a metal QFP package
* CXD8530AQ
** Found on some PU-7, mostly early/launch units
** Die size: 128 mm², 1M transistors
** Comes in a metal QFP package
* CXD8530BQ
** Found on some PU-7
** Die size: 66 mm²
** This revision and all later revisions are implemented in standard cells as an ASIC, which means there are less visible structures on the die
** This revision and all later revisions come in a plastic QFP package
* CXD8530CQ
** Found on some PU-8 and PU-16
** Die size: 66 mm²

=== CXD8606 ===
From PU-18 onwards (SCPH-55XX), only CXD8606 was used.
* CXD8606Q
** Found on some PU-8 and PU-18
** Die size: 66 mm², 850k transistors
** Manufactured in 350 nm
* CXD8606AQ
** Found on some PU-18
** Die size: 26.5 mm²
* CXD8606BQ
** Found on some PU-20 as well as PU-22, PU-23 and earlier PM-41
** Die size: 26.5 mm²
*** Identical die size to CXD8606AQ
* CXD8606CQ
** Found on later PM-41

=== CXD8661 ===
* CXD8661R
** Used in some arcade systems (Capcom ZN-2, Namco System 12)
** Runs at considerably higher clock speeds

== Pictures ==
=== Comparison ===
[[File:PS1 die sizes.jpg|thumb|Properly scaled comparison of die shots of most PS1 CPU revisions. Created by [https://twitter.com/Siliconinsid/ Siliconinsider]]]

=== Single dice ===
''Relative size of these pictures is not to scale. See above for actual sizes.''
{| class="wikitable"
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| [[File:PE0z6bx.jpg|240px]] || [[File:UfvCXSG.jpg|240px]] || [[File:e7i00rQ.jpg|240px]] || [[File:CXD8606BQ.jpg|240px]]
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| Dieshot of CXD8530Q taken from Ken Kutaragis</br>presentation at Hot Chips '99. || Dieshot of CXD8530CQ taken from [https://zeptobars.com/en/read/Playstation-1-MIPS-CPU-PS1-CXD8530CQ-R3051 zeptobars.com].|| Dieshot of CXD8606Q taken from Ken Kutaragis</br>presentation at Hot Chips '99. || Dieshot of CXD8606BQ by [http://ic.onidev.fr/map/CXD8606BQ.html TICS/onidev]
|}